DE3150399C2 - - Google Patents

Info

Publication number
DE3150399C2
DE3150399C2 DE3150399A DE3150399A DE3150399C2 DE 3150399 C2 DE3150399 C2 DE 3150399C2 DE 3150399 A DE3150399 A DE 3150399A DE 3150399 A DE3150399 A DE 3150399A DE 3150399 C2 DE3150399 C2 DE 3150399C2
Authority
DE
Germany
Prior art keywords
workpieces
treatment
ceramic
treated
heated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE3150399A
Other languages
German (de)
English (en)
Other versions
DE3150399A1 (de
Inventor
Kurt Dr. Heymann
Christoph Dr. 1000 Berlin De Donner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Priority to DE19813150399 priority Critical patent/DE3150399A1/de
Priority to GB08235407A priority patent/GB2112023B/en
Priority to SE8207148A priority patent/SE460900B/sv
Priority to IE2964/82A priority patent/IE53849B1/en
Priority to IT24724/82A priority patent/IT1156138B/it
Priority to JP57217898A priority patent/JPS58104079A/ja
Priority to FR828221017A priority patent/FR2518084B1/fr
Publication of DE3150399A1 publication Critical patent/DE3150399A1/de
Priority to US06/882,637 priority patent/US4766017A/en
Application granted granted Critical
Publication of DE3150399C2 publication Critical patent/DE3150399C2/de
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/53—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone involving the removal of at least part of the materials of the treated article, e.g. etching, drying of hardened concrete
    • C04B41/5338—Etching
    • C04B41/5353—Wet etching, e.g. with etchants dissolved in organic solvents
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/91—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics involving the removal of part of the materials of the treated articles, e.g. etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H10W70/05—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Ceramic Products (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Chemical Treatment Of Metals (AREA)
DE19813150399 1981-12-15 1981-12-15 Verfahren zur haftfesten metallisierung von keramischen materialien Granted DE3150399A1 (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE19813150399 DE3150399A1 (de) 1981-12-15 1981-12-15 Verfahren zur haftfesten metallisierung von keramischen materialien
GB08235407A GB2112023B (en) 1981-12-15 1982-12-13 Pretreating ceramics for metal coating
IE2964/82A IE53849B1 (en) 1981-12-15 1982-12-14 Process for strongly-bonded metallisation of ceramic materials
IT24724/82A IT1156138B (it) 1981-12-15 1982-12-14 Procedimento per la metallizzazione fortemente adesiva dei materiali ceramici
SE8207148A SE460900B (sv) 1981-12-15 1982-12-14 Foerfarande foer att med god vidhaeftning metallisera keramiska material
JP57217898A JPS58104079A (ja) 1981-12-15 1982-12-14 セラミツク材料の固着金属化法
FR828221017A FR2518084B1 (fr) 1981-12-15 1982-12-15 Procede pour realiser, sur des matieres ceramiques, un depot metallique adherant bien, matieres ceramiques metallisees fabriquees par ce procede, et application de celles-ci en electrotechnique et en electronique
US06/882,637 US4766017A (en) 1981-12-15 1986-07-07 Process for the adhesive metallization of ceramic materials

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19813150399 DE3150399A1 (de) 1981-12-15 1981-12-15 Verfahren zur haftfesten metallisierung von keramischen materialien

Publications (2)

Publication Number Publication Date
DE3150399A1 DE3150399A1 (de) 1983-07-21
DE3150399C2 true DE3150399C2 (enExample) 1988-09-15

Family

ID=6149190

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19813150399 Granted DE3150399A1 (de) 1981-12-15 1981-12-15 Verfahren zur haftfesten metallisierung von keramischen materialien

Country Status (8)

Country Link
US (1) US4766017A (enExample)
JP (1) JPS58104079A (enExample)
DE (1) DE3150399A1 (enExample)
FR (1) FR2518084B1 (enExample)
GB (1) GB2112023B (enExample)
IE (1) IE53849B1 (enExample)
IT (1) IT1156138B (enExample)
SE (1) SE460900B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3345353A1 (de) * 1983-12-15 1985-08-29 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren und metallisierung einer keramikoberflaeche

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6052594A (ja) * 1983-09-01 1985-03-25 Showa Denko Kk セラミックス粒子の突起を有する金属コ−ト方法
DE3402494A1 (de) * 1984-01-25 1985-07-25 Siemens AG, 1000 Berlin und 8000 München Verfahren zur metallbeschichtung von piezokeramischen werkstuecken
US4574095A (en) 1984-11-19 1986-03-04 International Business Machines Corporation Selective deposition of copper
US4647477A (en) * 1984-12-07 1987-03-03 Kollmorgen Technologies Corporation Surface preparation of ceramic substrates for metallization
EP0185967A3 (en) * 1984-12-10 1988-08-03 Kollmorgen Corporation Process for avoiding blister formation in electroless metallization of ceramic substrates
DE3523956A1 (de) * 1985-07-04 1987-01-08 Licentia Gmbh Verfahren zur chemischen metallisierung eines elektrisch schlecht leitenden traegerkoerpers aus einem anorganischen material
DE3672441D1 (de) * 1985-10-15 1990-08-09 Nec Corp Metallisiertes keramiksubstrat und herstellungsverfahren.
DE3601834A1 (de) * 1986-01-20 1987-07-23 Schering Ag Verfahren zur haftfesten metallisierung von keramischen materialien
JPH0726205B2 (ja) * 1986-08-15 1995-03-22 松下電工株式会社 窒化アルミセラミック配線基板の製法
FR2679225B1 (fr) * 1991-07-19 1993-12-24 Electronique Piezo Electricite Dissolution controlee du quartz.
US5849170A (en) * 1995-06-19 1998-12-15 Djokic; Stojan Electroless/electrolytic methods for the preparation of metallized ceramic substrates
JP3530149B2 (ja) * 2001-05-21 2004-05-24 新光電気工業株式会社 配線基板の製造方法及び半導体装置
JP5509997B2 (ja) * 2010-03-31 2014-06-04 宇部興産株式会社 光変換用セラミック複合体の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3690921A (en) * 1970-12-07 1972-09-12 Ibm Method for strongly adhering a metal film on ceramic substrates

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3345353A1 (de) * 1983-12-15 1985-08-29 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren und metallisierung einer keramikoberflaeche

Also Published As

Publication number Publication date
JPH0243707B2 (enExample) 1990-10-01
IE53849B1 (en) 1989-03-15
SE8207148L (sv) 1983-06-16
IT8224724A0 (it) 1982-12-14
JPS58104079A (ja) 1983-06-21
DE3150399A1 (de) 1983-07-21
GB2112023A (en) 1983-07-13
US4766017A (en) 1988-08-23
FR2518084B1 (fr) 1990-10-26
SE460900B (sv) 1989-12-04
IT1156138B (it) 1987-01-28
IE822964L (en) 1983-06-15
SE8207148D0 (sv) 1982-12-14
FR2518084A1 (fr) 1983-06-17
GB2112023B (en) 1986-04-09

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
D2 Grant after examination
8363 Opposition against the patent
8330 Complete renunciation