JPS58104079A - セラミツク材料の固着金属化法 - Google Patents

セラミツク材料の固着金属化法

Info

Publication number
JPS58104079A
JPS58104079A JP57217898A JP21789882A JPS58104079A JP S58104079 A JPS58104079 A JP S58104079A JP 57217898 A JP57217898 A JP 57217898A JP 21789882 A JP21789882 A JP 21789882A JP S58104079 A JPS58104079 A JP S58104079A
Authority
JP
Japan
Prior art keywords
alkali metal
metal hydroxide
ceramic materials
hydroxide solution
metallization method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57217898A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0243707B2 (enExample
Inventor
クルト・ハイマン
クリストフ・ドナ−
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Publication of JPS58104079A publication Critical patent/JPS58104079A/ja
Publication of JPH0243707B2 publication Critical patent/JPH0243707B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/53—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone involving the removal of at least part of the materials of the treated article, e.g. etching, drying of hardened concrete
    • C04B41/5338—Etching
    • C04B41/5353—Wet etching, e.g. with etchants dissolved in organic solvents
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/91—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics involving the removal of part of the materials of the treated articles, e.g. etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H10W70/05—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Ceramic Products (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Chemical Treatment Of Metals (AREA)
JP57217898A 1981-12-15 1982-12-14 セラミツク材料の固着金属化法 Granted JPS58104079A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE31503993 1981-12-15
DE19813150399 DE3150399A1 (de) 1981-12-15 1981-12-15 Verfahren zur haftfesten metallisierung von keramischen materialien

Publications (2)

Publication Number Publication Date
JPS58104079A true JPS58104079A (ja) 1983-06-21
JPH0243707B2 JPH0243707B2 (enExample) 1990-10-01

Family

ID=6149190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57217898A Granted JPS58104079A (ja) 1981-12-15 1982-12-14 セラミツク材料の固着金属化法

Country Status (8)

Country Link
US (1) US4766017A (enExample)
JP (1) JPS58104079A (enExample)
DE (1) DE3150399A1 (enExample)
FR (1) FR2518084B1 (enExample)
GB (1) GB2112023B (enExample)
IE (1) IE53849B1 (enExample)
IT (1) IT1156138B (enExample)
SE (1) SE460900B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6052594A (ja) * 1983-09-01 1985-03-25 Showa Denko Kk セラミックス粒子の突起を有する金属コ−ト方法
JPS6347382A (ja) * 1986-08-15 1988-02-29 Matsushita Electric Works Ltd 窒化アルミセラミック配線基板の製法
JP2011213780A (ja) * 2010-03-31 2011-10-27 Ube Industries Ltd 光変換用セラミック複合体の製造方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3345353A1 (de) * 1983-12-15 1985-08-29 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren und metallisierung einer keramikoberflaeche
DE3402494A1 (de) * 1984-01-25 1985-07-25 Siemens AG, 1000 Berlin und 8000 München Verfahren zur metallbeschichtung von piezokeramischen werkstuecken
US4574095A (en) 1984-11-19 1986-03-04 International Business Machines Corporation Selective deposition of copper
US4647477A (en) * 1984-12-07 1987-03-03 Kollmorgen Technologies Corporation Surface preparation of ceramic substrates for metallization
EP0185967A3 (en) * 1984-12-10 1988-08-03 Kollmorgen Corporation Process for avoiding blister formation in electroless metallization of ceramic substrates
DE3523956A1 (de) * 1985-07-04 1987-01-08 Licentia Gmbh Verfahren zur chemischen metallisierung eines elektrisch schlecht leitenden traegerkoerpers aus einem anorganischen material
DE3672441D1 (de) * 1985-10-15 1990-08-09 Nec Corp Metallisiertes keramiksubstrat und herstellungsverfahren.
DE3601834A1 (de) * 1986-01-20 1987-07-23 Schering Ag Verfahren zur haftfesten metallisierung von keramischen materialien
FR2679225B1 (fr) * 1991-07-19 1993-12-24 Electronique Piezo Electricite Dissolution controlee du quartz.
US5849170A (en) * 1995-06-19 1998-12-15 Djokic; Stojan Electroless/electrolytic methods for the preparation of metallized ceramic substrates
JP3530149B2 (ja) * 2001-05-21 2004-05-24 新光電気工業株式会社 配線基板の製造方法及び半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3690921A (en) * 1970-12-07 1972-09-12 Ibm Method for strongly adhering a metal film on ceramic substrates

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6052594A (ja) * 1983-09-01 1985-03-25 Showa Denko Kk セラミックス粒子の突起を有する金属コ−ト方法
JPS6347382A (ja) * 1986-08-15 1988-02-29 Matsushita Electric Works Ltd 窒化アルミセラミック配線基板の製法
JP2011213780A (ja) * 2010-03-31 2011-10-27 Ube Industries Ltd 光変換用セラミック複合体の製造方法

Also Published As

Publication number Publication date
JPH0243707B2 (enExample) 1990-10-01
IE53849B1 (en) 1989-03-15
SE8207148L (sv) 1983-06-16
IT8224724A0 (it) 1982-12-14
DE3150399A1 (de) 1983-07-21
GB2112023A (en) 1983-07-13
US4766017A (en) 1988-08-23
DE3150399C2 (enExample) 1988-09-15
FR2518084B1 (fr) 1990-10-26
SE460900B (sv) 1989-12-04
IT1156138B (it) 1987-01-28
IE822964L (en) 1983-06-15
SE8207148D0 (sv) 1982-12-14
FR2518084A1 (fr) 1983-06-17
GB2112023B (en) 1986-04-09

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