DE3047513C2 - - Google Patents
Info
- Publication number
- DE3047513C2 DE3047513C2 DE3047513A DE3047513A DE3047513C2 DE 3047513 C2 DE3047513 C2 DE 3047513C2 DE 3047513 A DE3047513 A DE 3047513A DE 3047513 A DE3047513 A DE 3047513A DE 3047513 C2 DE3047513 C2 DE 3047513C2
- Authority
- DE
- Germany
- Prior art keywords
- plate
- chamber
- inlet opening
- door
- cassette
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
- Y10S414/138—Wafers positioned vertically within cassette
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Warehouses Or Storage Devices (AREA)
- Physical Vapour Deposition (AREA)
Description
3, 4 Kassetten
5 Halbleiterplättchen
8 Beschickungsschleuse
11 Vakuumkammer
13 Eintrittsöffnung
16 Baugruppe der Kammertür
17 Vorderwand
18 Ausschnitt
20 Plättchentragplattenbaugruppe
22 Druckplatte
23 Stößel
25 O-Ringe
28 Klemmeinrichtungen
29 Haltering
31 Plättchenunterstützungseinrichtung
33, 34 Flansche
36 Klotz
37 federnde Klammer
38 fingerartige Abschnitte
39 Klammer, flacher Abschnitt (S. 12)
40 entgegengesetzter Abschnitt
42 Unterdruckspannfutter
44 Klammerbetätigungseinrichtungen
45 Scharnier
47 Innenfläche
49 Zylinder
50 Druckstift
51 Dichtungen
53 Öffnungen
55 Hebeeinrichtung
56 Kassettenfördereinrichtung
58, 59 Schienen
60 Kette, Kettenantrieb
62 Führungsstifte
63 Kassettenwand
67 Führungsplatte
68 Schieber
69 Betätigungszylinder
70 Führungsschlitz
73 kreisbogenförmiges, oberes Schieberende, Nut
75 Führungsanflächung
76 Rollen
Claims (12)
durch eine Klemmeinrichtung (28), die auf der Plättchenunterstützung (31) in Abständen über den Umfang des Ausschnittes (18) vorgesehen ist und ein Plättchen elastisch erfaßt, um es an seinem Umfang in dem Ausschnitt (18) zu halten,
durch eine Hebeeinrichtung (55), die ein Plättchen (5) zur Eintrittsöffnung (13) der Vakuumkammer (11) anhebt.
durch eine Einrichtung, die jeweils ein Plättchen (5) erfaßt und es in Eingriff mit der Klemmeinrichtung (37) bringt oder dieser entnimmt, und
durch Dichtungen (25), die eine Abdichtung der Plättchenunterstützung (31) gegenüber der Eintrittsöffnung (13) der Kammer (11) herbeiführen.
daß die Klemmeinrichtung für jede Eintrittsöffnung (13) zum Aufnehmen eines Plättchens (5) mehrere Klammern (37) umfaßt und
daß zu jeder Klammer (37) ein flacher Abschnitt (39) gehört, der von außen nach innen in die Eintrittsöffnung (18) in Richtung auf ihren Mittelpunkt hineinragt.
daß die Kammertür (16) mit der Kammer (11) durch ein Gelenk (45) verbunden ist und
daß die Eintrittsöffnung (13) und die Plättchenunterstützung (31) stehend angeordnet sind, so daß die Tür beim Öffnen in eine Stellung kommt, in der sie sich in einer senkrechten Ebene im rechten Winkel zur Eintrittsöffnung (13) der Kammer (11) befindet.
daß die palettenähnliche Plättchenunterstützung (31) mehrere Ausschnitte (18) aufweist, von denen jede mit mehreren Klammern (37) versehen ist,
daß die Plättchenunterstützung (31) bewegbar ist und nacheinander jeder Eintrittsöffnung (13) der Kammer (11) ein Plättchen (5) zuführt und
daß jeder Ausschnitt durch die Kammertür (8) und die Dichtungen (25) abgedichtet ist, um die Beschickungsschleuse (8) abzugrenzen, so daß mehrere Plättchen (5) in kurzen Zeitabständen nacheinander in die Kammer (11) gelangen.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3051199A DE3051199C3 (de) | 1979-12-21 | 1980-12-17 | Zufördervorrichtung für eine Einrichtung zum Beschicken von Mikroplättchen in eine Behandlungskammer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/106,342 US4311427A (en) | 1979-12-21 | 1979-12-21 | Wafer transfer system |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3047513A1 DE3047513A1 (de) | 1981-08-27 |
DE3047513C2 true DE3047513C2 (de) | 1990-03-29 |
Family
ID=22310897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19803047513 Granted DE3047513A1 (de) | 1979-12-21 | 1980-12-17 | Vorrichtung zum zufuehren von mikroplaettchen zu einer vakuumkammer |
Country Status (8)
Country | Link |
---|---|
US (1) | US4311427A (de) |
JP (2) | JPS56100440A (de) |
CH (1) | CH652376A5 (de) |
DE (1) | DE3047513A1 (de) |
FR (1) | FR2473022B1 (de) |
GB (3) | GB2066570B (de) |
IT (1) | IT1134852B (de) |
NL (1) | NL8006934A (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3425267A1 (de) * | 1983-07-19 | 1985-01-31 | Varian Associates, Inc., Palo Alto, Calif. | System zum transportieren und behandeln von duennen substraten wie platten oder wafer |
DE3051199C2 (en) * | 1979-12-21 | 1990-12-20 | Varian Associates, Inc., Palo Alto, Calif., Us | Wafer load lock and transfer system for vacuum chamber |
DE9307263U1 (de) * | 1993-05-13 | 1993-07-22 | Balzers und Leybold Deutschland Holding AG, 63450 Hanau | Vorrichtung zum Greifen und Halten eines flachen Substrats |
Families Citing this family (100)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4311427A (en) | 1979-12-21 | 1982-01-19 | Varian Associates, Inc. | Wafer transfer system |
US5024747A (en) * | 1979-12-21 | 1991-06-18 | Varian Associates, Inc. | Wafer coating system |
EP0047132B1 (de) * | 1980-09-02 | 1985-07-03 | Heraeus Quarzschmelze Gmbh | Verfahren und Gerät zum Überführen von Halbleiterscheiben zwischen Traggliedern |
US4373846A (en) * | 1980-10-24 | 1983-02-15 | Charbonnet Carl D | Panel transferring apparatus |
US4417347A (en) * | 1981-05-12 | 1983-11-22 | Varian Associates, Inc. | Semiconductor processor incorporating blackbody radiation source with constant planar energy flux |
US4486652A (en) * | 1981-05-12 | 1984-12-04 | Varian Associates, Inc. | Blackbody radiation source with constant planar energy flux |
US4421479A (en) * | 1981-05-12 | 1983-12-20 | Varian Associates, Inc. | Process for treating a semiconductor material by blackbody radiation source with constant planar energy flux |
US4550239A (en) * | 1981-10-05 | 1985-10-29 | Tokyo Denshi Kagaku Kabushiki Kaisha | Automatic plasma processing device and heat treatment device |
US4457661A (en) * | 1981-12-07 | 1984-07-03 | Applied Materials, Inc. | Wafer loading apparatus |
DE3204436A1 (de) * | 1982-02-09 | 1983-08-18 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur waermebehandlung von halbleiterscheiben |
US4498832A (en) * | 1982-05-21 | 1985-02-12 | The Boc Group, Inc. | Workpiece accumulating and transporting apparatus |
US4498833A (en) * | 1982-05-24 | 1985-02-12 | Varian Associates, Inc. | Wafer orientation system |
US4513430A (en) * | 1982-05-24 | 1985-04-23 | Varian Associates, Inc. | Missing or broken wafer sensor |
US4634331A (en) * | 1982-05-24 | 1987-01-06 | Varian Associates, Inc. | Wafer transfer system |
US4449885A (en) * | 1982-05-24 | 1984-05-22 | Varian Associates, Inc. | Wafer transfer system |
EP0100206A1 (de) * | 1982-07-22 | 1984-02-08 | Oerlikon-Buhrle U.S.A. Inc. | Vorrichtung zum Behandeln eines Gegenstandes in einer Vakuumkammer |
US4490087A (en) * | 1982-07-27 | 1984-12-25 | Northern Telecom Limited | Elevating jig for semi-conductor wafers and similar articles |
FR2531938B1 (fr) * | 1982-08-20 | 1986-02-21 | Crismatec | Ascenseur poussoir pour plaquettes minces rangees dans un conteneur collectif |
JPS5950538A (ja) * | 1982-09-17 | 1984-03-23 | Hitachi Ltd | ウエハ搬送装置 |
JPS59101846A (ja) * | 1982-12-01 | 1984-06-12 | Seiko Instr & Electronics Ltd | 薄板物品のリニア搬送装置 |
US4573851A (en) * | 1983-05-18 | 1986-03-04 | Microglass, Inc. | Semiconductor wafer transfer apparatus and method |
JPS59220445A (ja) * | 1983-05-20 | 1984-12-11 | バリアン・アソシエイツ・インコ−ポレイテツド | 基底を通る入路を有するカセツトトロリ− |
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USRE33341E (en) * | 1983-05-23 | 1990-09-18 | ASQ Technology, Inc. | Wafer transfer apparatus |
US4568234A (en) * | 1983-05-23 | 1986-02-04 | Asq Boats, Inc. | Wafer transfer apparatus |
US4567584A (en) * | 1983-06-13 | 1986-01-28 | Kabushiki Kaisha Toshiba | Autochanger type disc player |
US4662811A (en) * | 1983-07-25 | 1987-05-05 | Hayden Thomas J | Method and apparatus for orienting semiconductor wafers |
JPS6052574A (ja) * | 1983-09-02 | 1985-03-25 | Hitachi Ltd | 連続スパツタ装置 |
US4602713A (en) * | 1983-09-22 | 1986-07-29 | Varian Associates, Inc. | Multiple wafer holder for a wafer transfer system |
US4558388A (en) * | 1983-11-02 | 1985-12-10 | Varian Associates, Inc. | Substrate and substrate holder |
US4523985A (en) * | 1983-12-22 | 1985-06-18 | Sputtered Films, Inc. | Wafer processing machine |
US4522697A (en) * | 1983-12-22 | 1985-06-11 | Sputtered Films, Inc. | Wafer processing machine |
US4534314A (en) * | 1984-05-10 | 1985-08-13 | Varian Associates, Inc. | Load lock pumping mechanism |
US4548699A (en) * | 1984-05-17 | 1985-10-22 | Varian Associates, Inc. | Transfer plate rotation system |
US4592926A (en) * | 1984-05-21 | 1986-06-03 | Machine Technology, Inc. | Processing apparatus and method |
US4820930A (en) * | 1984-06-20 | 1989-04-11 | Canon Kabushiki Kaisha | Photomask positioning device |
US4747608A (en) * | 1984-10-30 | 1988-05-31 | Canon Kabushiki Kaisha | Wafer chuck |
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DE3681799D1 (de) * | 1985-01-22 | 1991-11-14 | Applied Materials Inc | Halbleiter-bearbeitungseinrichtung. |
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SE456570B (sv) * | 1986-01-20 | 1988-10-17 | Applied Vacuum Scandinavia Ab | Sett att transportera alster vid en tillverknings- och/eller efterbehandlingsprocess |
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JP3674864B2 (ja) * | 2003-03-25 | 2005-07-27 | 忠素 玉井 | 真空処理装置 |
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US7101138B2 (en) * | 2003-12-03 | 2006-09-05 | Brooks Automation, Inc. | Extractor/buffer |
TW200633033A (en) * | 2004-08-23 | 2006-09-16 | Koninkl Philips Electronics Nv | Hot source cleaning system |
US20120305192A1 (en) | 2011-06-03 | 2012-12-06 | Arthur Keigler | Parallel single substrate processing fluid jet module |
US20130101372A1 (en) * | 2011-10-19 | 2013-04-25 | Lam Research Ag | Method and apparatus for processing wafer-shaped articles |
US8936425B2 (en) * | 2012-01-23 | 2015-01-20 | Tera Autotech Corporation | Ancillary apparatus and method for loading glass substrates into a bracket |
RU176918U1 (ru) * | 2017-04-10 | 2018-02-01 | Общество С Ограниченной Ответственностью "Изовак" | Механизм открывания и поворота дверей вакуумной камеры |
CN113879846A (zh) * | 2021-08-30 | 2022-01-04 | 华研芯测半导体(苏州)有限公司 | 一种内置传送机构的级联真空腔装置及传送方法 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3340176A (en) * | 1965-07-28 | 1967-09-05 | Western Electric Co | Vacuum processing machine |
US3521765A (en) * | 1967-10-31 | 1970-07-28 | Western Electric Co | Closed-end machine for processing articles in a controlled atmosphere |
US3856654A (en) * | 1971-08-26 | 1974-12-24 | Western Electric Co | Apparatus for feeding and coating masses of workpieces in a controlled atmosphere |
US3921788A (en) * | 1974-05-21 | 1975-11-25 | Macronetics Inc | Processing apparatus for thin disc-like workpieces |
US3981791A (en) * | 1975-03-10 | 1976-09-21 | Signetics Corporation | Vacuum sputtering apparatus |
US4311427A (en) | 1979-12-21 | 1982-01-19 | Varian Associates, Inc. | Wafer transfer system |
-
1979
- 1979-12-21 US US06/106,342 patent/US4311427A/en not_active Expired - Lifetime
-
1980
- 1980-12-16 GB GB8040300A patent/GB2066570B/en not_active Expired
- 1980-12-17 DE DE19803047513 patent/DE3047513A1/de active Granted
- 1980-12-19 JP JP17904780A patent/JPS56100440A/ja active Granted
- 1980-12-19 NL NL8006934A patent/NL8006934A/nl not_active Application Discontinuation
- 1980-12-22 IT IT26865/80A patent/IT1134852B/it active
- 1980-12-22 FR FR8027228A patent/FR2473022B1/fr not_active Expired
- 1980-12-22 CH CH9476/80A patent/CH652376A5/de not_active IP Right Cessation
-
1983
- 1983-10-20 GB GB838328038A patent/GB8328038D0/en active Pending
-
1984
- 1984-01-09 GB GB08400423A patent/GB2135120B/en not_active Expired
- 1984-08-23 JP JP59174189A patent/JPS6063947A/ja active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3051199C2 (en) * | 1979-12-21 | 1990-12-20 | Varian Associates, Inc., Palo Alto, Calif., Us | Wafer load lock and transfer system for vacuum chamber |
DE3425267A1 (de) * | 1983-07-19 | 1985-01-31 | Varian Associates, Inc., Palo Alto, Calif. | System zum transportieren und behandeln von duennen substraten wie platten oder wafer |
DE3425267C2 (de) * | 1983-07-19 | 1993-12-16 | Varian Associates | Vorrichtung zum Transportieren und individuellen Behandeln von dünnen Substraten |
DE9307263U1 (de) * | 1993-05-13 | 1993-07-22 | Balzers und Leybold Deutschland Holding AG, 63450 Hanau | Vorrichtung zum Greifen und Halten eines flachen Substrats |
Also Published As
Publication number | Publication date |
---|---|
GB2135120B (en) | 1985-02-27 |
JPS614188B2 (de) | 1986-02-07 |
GB2066570B (en) | 1984-10-24 |
GB8400423D0 (en) | 1984-02-08 |
JPS6063947A (ja) | 1985-04-12 |
IT1134852B (it) | 1986-08-20 |
FR2473022A1 (fr) | 1981-07-10 |
NL8006934A (nl) | 1981-07-16 |
DE3047513A1 (de) | 1981-08-27 |
GB2066570A (en) | 1981-07-08 |
GB8328038D0 (en) | 1983-11-23 |
CH652376A5 (de) | 1985-11-15 |
US4311427A (en) | 1982-01-19 |
JPS56100440A (en) | 1981-08-12 |
JPH0159352B2 (de) | 1989-12-15 |
IT8026865A0 (it) | 1980-12-22 |
GB2135120A (en) | 1984-08-22 |
FR2473022B1 (fr) | 1985-11-29 |
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