FR2473022B1 - Appareil de chargement et d'alimentation pour poste de traitement de substrats minces - Google Patents

Appareil de chargement et d'alimentation pour poste de traitement de substrats minces

Info

Publication number
FR2473022B1
FR2473022B1 FR8027228A FR8027228A FR2473022B1 FR 2473022 B1 FR2473022 B1 FR 2473022B1 FR 8027228 A FR8027228 A FR 8027228A FR 8027228 A FR8027228 A FR 8027228A FR 2473022 B1 FR2473022 B1 FR 2473022B1
Authority
FR
France
Prior art keywords
loading
processing station
feeding apparatus
thin substrates
substrates processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8027228A
Other languages
English (en)
Other versions
FR2473022A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Medical Systems Inc
Original Assignee
Varian Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates Inc filed Critical Varian Associates Inc
Publication of FR2473022A1 publication Critical patent/FR2473022A1/fr
Application granted granted Critical
Publication of FR2473022B1 publication Critical patent/FR2473022B1/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y10S414/138—Wafers positioned vertically within cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Physical Vapour Deposition (AREA)
FR8027228A 1979-12-21 1980-12-22 Appareil de chargement et d'alimentation pour poste de traitement de substrats minces Expired FR2473022B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/106,342 US4311427A (en) 1979-12-21 1979-12-21 Wafer transfer system

Publications (2)

Publication Number Publication Date
FR2473022A1 FR2473022A1 (fr) 1981-07-10
FR2473022B1 true FR2473022B1 (fr) 1985-11-29

Family

ID=22310897

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8027228A Expired FR2473022B1 (fr) 1979-12-21 1980-12-22 Appareil de chargement et d'alimentation pour poste de traitement de substrats minces

Country Status (8)

Country Link
US (1) US4311427A (fr)
JP (2) JPS56100440A (fr)
CH (1) CH652376A5 (fr)
DE (1) DE3047513A1 (fr)
FR (1) FR2473022B1 (fr)
GB (3) GB2066570B (fr)
IT (1) IT1134852B (fr)
NL (1) NL8006934A (fr)

Families Citing this family (103)

* Cited by examiner, † Cited by third party
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US4373846A (en) * 1980-10-24 1983-02-15 Charbonnet Carl D Panel transferring apparatus
US4421479A (en) * 1981-05-12 1983-12-20 Varian Associates, Inc. Process for treating a semiconductor material by blackbody radiation source with constant planar energy flux
US4417347A (en) * 1981-05-12 1983-11-22 Varian Associates, Inc. Semiconductor processor incorporating blackbody radiation source with constant planar energy flux
US4486652A (en) * 1981-05-12 1984-12-04 Varian Associates, Inc. Blackbody radiation source with constant planar energy flux
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US4457661A (en) * 1981-12-07 1984-07-03 Applied Materials, Inc. Wafer loading apparatus
DE3204436A1 (de) * 1982-02-09 1983-08-18 Siemens AG, 1000 Berlin und 8000 München Verfahren zur waermebehandlung von halbleiterscheiben
US4498832A (en) * 1982-05-21 1985-02-12 The Boc Group, Inc. Workpiece accumulating and transporting apparatus
US4449885A (en) * 1982-05-24 1984-05-22 Varian Associates, Inc. Wafer transfer system
US4634331A (en) * 1982-05-24 1987-01-06 Varian Associates, Inc. Wafer transfer system
US4498833A (en) * 1982-05-24 1985-02-12 Varian Associates, Inc. Wafer orientation system
US4513430A (en) * 1982-05-24 1985-04-23 Varian Associates, Inc. Missing or broken wafer sensor
EP0100206A1 (fr) * 1982-07-22 1984-02-08 Oerlikon-Buhrle U.S.A. Inc. Appareil pour le traitement d'un objet dans une chambre à vide
US4490087A (en) * 1982-07-27 1984-12-25 Northern Telecom Limited Elevating jig for semi-conductor wafers and similar articles
FR2531938B1 (fr) * 1982-08-20 1986-02-21 Crismatec Ascenseur poussoir pour plaquettes minces rangees dans un conteneur collectif
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CN101894778A (zh) * 2003-08-29 2010-11-24 交叉自动控制公司 用于半导体处理的方法和装置
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Also Published As

Publication number Publication date
GB2066570A (en) 1981-07-08
DE3047513A1 (de) 1981-08-27
GB2135120A (en) 1984-08-22
IT1134852B (it) 1986-08-20
FR2473022A1 (fr) 1981-07-10
GB2066570B (en) 1984-10-24
JPS614188B2 (fr) 1986-02-07
IT8026865A0 (it) 1980-12-22
GB8328038D0 (en) 1983-11-23
JPS56100440A (en) 1981-08-12
GB8400423D0 (en) 1984-02-08
DE3047513C2 (fr) 1990-03-29
NL8006934A (nl) 1981-07-16
CH652376A5 (de) 1985-11-15
JPS6063947A (ja) 1985-04-12
JPH0159352B2 (fr) 1989-12-15
GB2135120B (en) 1985-02-27
US4311427A (en) 1982-01-19

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