DE304699T1 - Verbundstoff mit niedriger dielektrischer konstante und verfahren zu dessen herstellung. - Google Patents

Verbundstoff mit niedriger dielektrischer konstante und verfahren zu dessen herstellung.

Info

Publication number
DE304699T1
DE304699T1 DE198888112746T DE88112746T DE304699T1 DE 304699 T1 DE304699 T1 DE 304699T1 DE 198888112746 T DE198888112746 T DE 198888112746T DE 88112746 T DE88112746 T DE 88112746T DE 304699 T1 DE304699 T1 DE 304699T1
Authority
DE
Germany
Prior art keywords
composite material
hollow spheres
tiny hollow
glass
material according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE198888112746T
Other languages
English (en)
Inventor
Yoshiaki Hannoh-Shi Saitama Satoh
Original Assignee
Junkosha Co. Ltd., Tokio/Tokyo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Junkosha Co. Ltd., Tokio/Tokyo filed Critical Junkosha Co. Ltd., Tokio/Tokyo
Publication of DE304699T1 publication Critical patent/DE304699T1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/32—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof from compositions containing microballoons, e.g. syntactic foams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/443—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds
    • H01B3/445—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds from vinylfluorides or other fluoroethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
    • C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
    • C08J2327/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08J2327/18—Homopolymers or copolymers of tetrafluoroethylene
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/034—Organic insulating material consisting of one material containing halogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0254—Microballoons or hollow filler particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Moulding By Coating Moulds (AREA)
  • Organic Insulating Materials (AREA)
  • Inorganic Insulating Materials (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Claims (10)

EP 88 112 746.8-2109 Patent-Nr. 0 304 699 JUNKOSHA CO., LTD. PATENTANSPRÜCHE
1. Verbundstoff mit niedriger Dielektrizitätskonstante, gekennzeichnet durch winzige Hohlkugeln aus isolierendem Material, die in faserigem Polytetrafluorethylen dispergiert sind.
2. Verbundstoff nach Anspruch 1, dadurch gekennzeichnet, daß die winzigen Holhlkugeln aus einem isolierenden Material gebildet sind, das aus der Materialgruppe Glas, Kunststoff und Gummi ausgewählt ist.
3. Verbundstoff nach Anspruch 2, dadurch gekennzeichnet, daß das Glas einen Siliziumdioxidgehalt von nicht weniger als 80% aufweist.
4. Verbundstoff nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß die winzigen Hohlkugeln eine Oberflächenbehandlung mit einem Kopplungsagens erfahren haben.
5. Verbundstoff nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß der Gehalt der winzigen Hohlkugeln in dem Verbundstoff im Bereich zwischen 50 bis 95 Gew.-% liegt.
6. Verfahren zum Herstellen des Verbundstoffs nach einem der An-
sprüche 1 bis 5, dadurch gekennzeichnet, daß winzige Hohlkugeln und feines PTFE-Pulver gemischt werden, daß die Mischung ausgezogen wird, um ein Blatt zu bilden, und daß das Blatt schließlich erhitzt und gesintert wird.
7. Verfahren nach Anspruch 6, dadurch gekennzeichnet, daß ein
Gleitmittel vor dem Ausziehen der Mischung beigefügt wird.
8. Verfahren nach Anspruch 6 oder 7, dadurch gekennzeichnet, daß die winzigen Hohlkugeln Glaskugeln sind.
9. Verfahren nach Anspruch 8, dadurch gekennzeichnet, daß die Glaskugeln einer Oberlfächenbehandlung mit einem Kopplungsagens unterzogen werden. ■
,
10. Verfahren nach einem der Asprüche 6 bis 9,! dadurch gekennzeichnet, daß der Durchmesser der Kugeln im Bereich von 1 um bis 300 um liegt.
DE198888112746T 1987-08-28 1988-08-04 Verbundstoff mit niedriger dielektrischer konstante und verfahren zu dessen herstellung. Pending DE304699T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62214604A JPS6460648A (en) 1987-08-28 1987-08-28 Low-permittivity composite material

Publications (1)

Publication Number Publication Date
DE304699T1 true DE304699T1 (de) 1989-05-11

Family

ID=16658463

Family Applications (1)

Application Number Title Priority Date Filing Date
DE198888112746T Pending DE304699T1 (de) 1987-08-28 1988-08-04 Verbundstoff mit niedriger dielektrischer konstante und verfahren zu dessen herstellung.

Country Status (5)

Country Link
EP (1) EP0304699A3 (de)
JP (1) JPS6460648A (de)
KR (1) KR920000221B1 (de)
DE (1) DE304699T1 (de)
GB (1) GB2209167B (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5126192A (en) * 1990-01-26 1992-06-30 International Business Machines Corporation Flame retardant, low dielectric constant microsphere filled laminate
JPH03238410A (ja) * 1990-02-16 1991-10-24 Sumitomo Electric Ind Ltd 通信用線材
US5055342A (en) * 1990-02-16 1991-10-08 International Business Machines Corporation Fluorinated polymeric composition, fabrication thereof and use thereof
JPH0413770A (ja) * 1990-05-01 1992-01-17 Junkosha Co Ltd 絶縁材料及びその製造方法
JPH0799646B2 (ja) * 1991-05-03 1995-10-25 インターナショナル・ビジネス・マシーンズ・コーポレイション 分子的多孔性エーロゲルで充填された低誘電率複合積層品
GB9206960D0 (en) * 1992-03-31 1992-05-13 Tba Industrial Products Ltd Sheet sealing material
US6042936A (en) * 1997-09-23 2000-03-28 Fibermark, Inc. Microsphere containing circuit board paper
JP4617538B2 (ja) * 2000-06-15 2011-01-26 ダイキン工業株式会社 高周波信号伝送用製品の絶縁用ポリテトラフルオロエチレン混合粉末およびそれを用いた高周波信号伝送用製品
DE20318330U1 (de) * 2003-11-25 2005-04-14 Brandenburger Isoliertechnik Gmbh & Co Thermoisolierplatte
JP2008537964A (ja) * 2005-01-19 2008-10-02 ケビン ジー． ネルソン、 誘電体材料のための方法および組成物
CN102627818A (zh) * 2011-05-12 2012-08-08 天津市天塑科技集团有限公司技术中心 一种漂珠填充改性ptfe类树脂
NZ721792A (en) * 2014-01-21 2020-05-29 Prysmian Spa High-voltage electric cable
JP2017031256A (ja) * 2015-07-29 2017-02-09 日東電工株式会社 フッ素樹脂多孔質体、それを用いた金属層付多孔質体及び配線基板
US10435534B2 (en) 2015-11-25 2019-10-08 Garlock Sealing Technologies Llc Dielectric substrate comprising unsintered polytetrafluoroethylene and methods of making the same
CN114516993B (zh) * 2020-11-20 2023-12-22 河南纳牛新材料科技有限公司 一种ptfe-空心玻璃微球复合材料及其制备方法和应用
JP2023061322A (ja) * 2021-10-19 2023-05-01 株式会社オートネットワーク技術研究所 導体被覆材料、電線、及び導体被覆材料の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3015604A (en) * 1957-05-02 1962-01-02 Du Pont Porous polytetrafluoroethylene article containing glass microballoons
US3787281A (en) * 1968-10-29 1974-01-22 Du Pont Forming a hydrolytically stable bond between glass and polytetrafluoroethylene
DE3433879A1 (de) * 1984-09-14 1986-03-27 Japan Vilene Co.,Ltd., Tokio/Tokyo Isolationsmaterial hoher thermischer leitfaehigkeit sowie verfahren zu seiner herstellung

Also Published As

Publication number Publication date
KR920000221B1 (ko) 1992-01-10
GB8818243D0 (en) 1988-09-07
KR890004358A (ko) 1989-04-21
EP0304699A3 (de) 1990-05-09
JPS6460648A (en) 1989-03-07
EP0304699A2 (de) 1989-03-01
GB2209167B (en) 1991-03-13
JPH0125769B2 (de) 1989-05-19
GB2209167A (en) 1989-05-04

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