KR890004358A - 저유전율 복합재료 - Google Patents

저유전율 복합재료 Download PDF

Info

Publication number
KR890004358A
KR890004358A KR1019880005212A KR880005212A KR890004358A KR 890004358 A KR890004358 A KR 890004358A KR 1019880005212 A KR1019880005212 A KR 1019880005212A KR 880005212 A KR880005212 A KR 880005212A KR 890004358 A KR890004358 A KR 890004358A
Authority
KR
South Korea
Prior art keywords
dielectric constant
low dielectric
composite material
constant composite
material according
Prior art date
Application number
KR1019880005212A
Other languages
English (en)
Other versions
KR920000221B1 (ko
Inventor
요시이키 사토오
Original Assignee
시마무라 요시이키
가부시키가이샤 중쿄오샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시마무라 요시이키, 가부시키가이샤 중쿄오샤 filed Critical 시마무라 요시이키
Publication of KR890004358A publication Critical patent/KR890004358A/ko
Application granted granted Critical
Publication of KR920000221B1 publication Critical patent/KR920000221B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/32—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof from compositions containing microballoons, e.g. syntactic foams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/443—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds
    • H01B3/445—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds from vinylfluorides or other fluoroethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
    • C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
    • C08J2327/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08J2327/18—Homopolymers or copolymers of tetrafluoroethylene
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/034—Organic insulating material consisting of one material containing halogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0254—Microballoons or hollow filler particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Moulding By Coating Moulds (AREA)
  • Organic Insulating Materials (AREA)
  • Inorganic Insulating Materials (AREA)

Abstract

요약 없음

Description

저유전율 복합재료
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (5)

  1. 섬유질 4불화에틸렌 수지중에 절연재료로 되는 미소 중공구체를 분산시켜서 된 저유전율 복합재료.
  2. 특허청구의 범위 제 1 항 기재의 저유전율 복합재료에 있어서, 미소중공구체는 유리,프라스틱, 고무로되는 군에서 선택된 절연재료로 되는 것을 특징으로 하는 저유전율 복합재료.
  3. 특허청구의 범위 제 2 항 기재의 저유전율 복합재료에 있어서, 유리는 이산화규소의 함유량이 80%이상인 것을 특징으로 하는 저유전율 복합재료.
  4. 특허청구의 범위 제 1 항 내지 제 3 항중 어느 하나의 항에 기재된 저유전율 복합재료에 있어서, 미소중공구체는 카프링제에 의해 표면처리되어 있는 것을 특징으로 하는 저유전율 복합재료.
  5. 특허청구의 범위 제 1 항 내지 제 4 항 기재의 어느 하나의 항에 기재된 저유전율 복합재료에 있어서, 미소중공구체의 함유량은 50-95중량%인 것을 특징으로 하는 저유전율 복합재료.
    ※ 참고사항 : 최초출원내용에 의하여 공개하는 것임.
KR1019880005212A 1987-08-28 1988-05-04 저유전율 복합재료 KR920000221B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP62-214604 1987-08-28
JP62214604A JPS6460648A (en) 1987-08-28 1987-08-28 Low-permittivity composite material
JP?62-214604 1987-08-28

Publications (2)

Publication Number Publication Date
KR890004358A true KR890004358A (ko) 1989-04-21
KR920000221B1 KR920000221B1 (ko) 1992-01-10

Family

ID=16658463

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880005212A KR920000221B1 (ko) 1987-08-28 1988-05-04 저유전율 복합재료

Country Status (5)

Country Link
EP (1) EP0304699A3 (ko)
JP (1) JPS6460648A (ko)
KR (1) KR920000221B1 (ko)
DE (1) DE304699T1 (ko)
GB (1) GB2209167B (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5126192A (en) * 1990-01-26 1992-06-30 International Business Machines Corporation Flame retardant, low dielectric constant microsphere filled laminate
JPH03238410A (ja) * 1990-02-16 1991-10-24 Sumitomo Electric Ind Ltd 通信用線材
US5055342A (en) * 1990-02-16 1991-10-08 International Business Machines Corporation Fluorinated polymeric composition, fabrication thereof and use thereof
JPH0413770A (ja) * 1990-05-01 1992-01-17 Junkosha Co Ltd 絶縁材料及びその製造方法
JPH0799646B2 (ja) * 1991-05-03 1995-10-25 インターナショナル・ビジネス・マシーンズ・コーポレイション 分子的多孔性エーロゲルで充填された低誘電率複合積層品
GB9206960D0 (en) * 1992-03-31 1992-05-13 Tba Industrial Products Ltd Sheet sealing material
US6042936A (en) * 1997-09-23 2000-03-28 Fibermark, Inc. Microsphere containing circuit board paper
JP4617538B2 (ja) * 2000-06-15 2011-01-26 ダイキン工業株式会社 高周波信号伝送用製品の絶縁用ポリテトラフルオロエチレン混合粉末およびそれを用いた高周波信号伝送用製品
DE20318330U1 (de) * 2003-11-25 2005-04-14 Brandenburger Isoliertechnik Gmbh & Co Thermoisolierplatte
US20060210806A1 (en) * 2005-01-19 2006-09-21 Nelson Kevin G Methods and compositions for dielectric materials
CN102627818A (zh) * 2011-05-12 2012-08-08 天津市天塑科技集团有限公司技术中心 一种漂珠填充改性ptfe类树脂
CA2936606C (en) 2014-01-21 2020-12-01 Prysmian S.P.A. High-voltage electric cable
JP2017031256A (ja) * 2015-07-29 2017-02-09 日東電工株式会社 フッ素樹脂多孔質体、それを用いた金属層付多孔質体及び配線基板
US10435534B2 (en) * 2015-11-25 2019-10-08 Garlock Sealing Technologies Llc Dielectric substrate comprising unsintered polytetrafluoroethylene and methods of making the same
CN114516993B (zh) * 2020-11-20 2023-12-22 河南纳牛新材料科技有限公司 一种ptfe-空心玻璃微球复合材料及其制备方法和应用
JP2023061322A (ja) * 2021-10-19 2023-05-01 株式会社オートネットワーク技術研究所 導体被覆材料、電線、及び導体被覆材料の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3015604A (en) * 1957-05-02 1962-01-02 Du Pont Porous polytetrafluoroethylene article containing glass microballoons
US3787281A (en) * 1968-10-29 1974-01-22 Du Pont Forming a hydrolytically stable bond between glass and polytetrafluoroethylene
DE3433879A1 (de) * 1984-09-14 1986-03-27 Japan Vilene Co.,Ltd., Tokio/Tokyo Isolationsmaterial hoher thermischer leitfaehigkeit sowie verfahren zu seiner herstellung

Also Published As

Publication number Publication date
EP0304699A2 (en) 1989-03-01
EP0304699A3 (en) 1990-05-09
DE304699T1 (de) 1989-05-11
JPH0125769B2 (ko) 1989-05-19
KR920000221B1 (ko) 1992-01-10
GB2209167B (en) 1991-03-13
JPS6460648A (en) 1989-03-07
GB2209167A (en) 1989-05-04
GB8818243D0 (en) 1988-09-07

Similar Documents

Publication Publication Date Title
KR890004358A (ko) 저유전율 복합재료
KR860003306A (ko) 실리콘 발포체 수성 에어러졸 조성물
KR850005318A (ko) 섬유강화 플라스틱 시이트
KR880004915A (ko) 사출성형용 조성물
KR860000334A (ko) 수지조성물
KR920701066A (ko) 단열재 및 이 단열재를 사용한 구조체
KR900018248A (ko) 폴리프로필렌수지 조성물
KR890014646A (ko) 저유전율 복합재료
KR850006694A (ko) 무기 섬유 함유 고무-강화 중합체수지
KR860003368A (ko) 고강도 고탄성율 폴리아크릴로 니트릴계 섬유
KR910012082A (ko) 유동성이 향상된 저변형 수지조성물
KR910015653A (ko) 폴리페닐렌옥사이드수지 복합조성물
GB1289555A (ko)
KR890000592A (ko) 방향족 폴리에스테르 수지조성물
KR880013490A (ko) 함성수지 갓
KR870010122A (ko) 고투명성 필름 제조용 폴리에스테르의 제조방법
KR910015659A (ko) 폴리페닐렌 설파이드 수지 조성물
ES2171463T3 (es) Espuma polimera alquenil-aromatica de bajo peso molecular.
KR870005082A (ko) 알 비 누
KR880007657A (ko) 방향족 폴리에스테르 수지 조성물
KR930002273A (ko) 기포 경화체
KR910007506A (ko) 세포 보호제
KR870003174A (ko) 원단심(苾)제조 접착제
KR880007396A (ko) 교재용 및 방수제로 사용되는 점토성상의 용제 제조방법
KR890014667A (ko) 폴리에틸렌 테레프탈레이트 수지의 착색조성물

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee