DE2929623C2 - Feinstdraht aus einer Aluminiumlegierung - Google Patents

Feinstdraht aus einer Aluminiumlegierung

Info

Publication number
DE2929623C2
DE2929623C2 DE2929623A DE2929623A DE2929623C2 DE 2929623 C2 DE2929623 C2 DE 2929623C2 DE 2929623 A DE2929623 A DE 2929623A DE 2929623 A DE2929623 A DE 2929623A DE 2929623 C2 DE2929623 C2 DE 2929623C2
Authority
DE
Germany
Prior art keywords
aluminum
fine wires
copper
fine wire
aluminum alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2929623A
Other languages
German (de)
English (en)
Other versions
DE2929623A1 (de
Inventor
Albrecht Dipl.-Phys. Dr. 6454 Bruchköbel Bischoff
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WC Heraus GmbH and Co KG
Original Assignee
WC Heraus GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WC Heraus GmbH and Co KG filed Critical WC Heraus GmbH and Co KG
Priority to DE2929623A priority Critical patent/DE2929623C2/de
Priority to GB8022622A priority patent/GB2056537B/en
Priority to US06/168,634 priority patent/US4380775A/en
Priority to JP9885380A priority patent/JPS5616647A/ja
Publication of DE2929623A1 publication Critical patent/DE2929623A1/de
Application granted granted Critical
Publication of DE2929623C2 publication Critical patent/DE2929623C2/de
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C22C21/12—Alloys based on aluminium with copper as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/023—Alloys based on aluminium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y10T428/12438—Composite
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
DE2929623A 1979-07-21 1979-07-21 Feinstdraht aus einer Aluminiumlegierung Expired DE2929623C2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE2929623A DE2929623C2 (de) 1979-07-21 1979-07-21 Feinstdraht aus einer Aluminiumlegierung
GB8022622A GB2056537B (en) 1979-07-21 1980-07-10 Aluminium alloy wires
US06/168,634 US4380775A (en) 1979-07-21 1980-07-11 Semiconductor unit with connecting wires
JP9885380A JPS5616647A (en) 1979-07-21 1980-07-21 Aluminum alloy super fine conductive wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2929623A DE2929623C2 (de) 1979-07-21 1979-07-21 Feinstdraht aus einer Aluminiumlegierung

Publications (2)

Publication Number Publication Date
DE2929623A1 DE2929623A1 (de) 1981-01-29
DE2929623C2 true DE2929623C2 (de) 1981-11-26

Family

ID=6076403

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2929623A Expired DE2929623C2 (de) 1979-07-21 1979-07-21 Feinstdraht aus einer Aluminiumlegierung

Country Status (4)

Country Link
US (1) US4380775A (2)
JP (1) JPS5616647A (2)
DE (1) DE2929623C2 (2)
GB (1) GB2056537B (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3435489A1 (de) * 1983-09-28 1985-05-02 Hitachi Ltd Halbleitervorrichtung und verfahren zu ihrer herstellung
DE3506264A1 (de) * 1984-02-24 1985-08-29 Hitachi, Ltd., Tokio/Tokyo Halbleitervorrichtung

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3023528C2 (de) * 1980-06-24 1984-11-29 W.C. Heraeus Gmbh, 6450 Hanau Aluminium enthaltender Feinstdraht
DE3110978C2 (de) * 1981-03-20 1984-07-26 Vdo Adolf Schindling Ag, 6000 Frankfurt Lötfähiges Schichtensystem
DE3153395C2 (en) * 1981-02-12 1987-11-19 W.C. Heraeus Gmbh, 6450 Hanau, De Use of a very fine wire made of a copper/tin alloy
DE3104960A1 (de) * 1981-02-12 1982-08-26 W.C. Heraeus Gmbh, 6450 Hanau "feinstdraht"
JPS602848U (ja) * 1983-06-17 1985-01-10 三洋電機株式会社 半導体装置
US4845543A (en) * 1983-09-28 1989-07-04 Hitachi, Ltd. Semiconductor device and method of manufacturing the same
JPS6189643A (ja) * 1984-10-09 1986-05-07 Toshiba Corp 半導体装置及びその製造方法
US4993622A (en) * 1987-04-28 1991-02-19 Texas Instruments Incorporated Semiconductor integrated circuit chip interconnections and methods

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB286264A (en) 1927-03-02 1928-10-11 Cie De Prod Chim Et Electro Me Process for the manufacture of electrical conductors in light aluminium alloys
GB313891A (en) 1927-12-15 1929-06-17 Carl Mueller Process of manufacturing thin bodies made from alloys of metals or metalloids
US2320880A (en) 1940-05-25 1943-06-01 Hercules Powder Co Ltd Bridge plug assembly
GB836754A (en) 1958-08-15 1960-06-09 Standard Telephones Cables Ltd Improvements in or relating to catswhiskers for point-contact semi-conductor devices
NL283249A (2) * 1961-09-19 1900-01-01
US3743894A (en) * 1972-06-01 1973-07-03 Motorola Inc Electromigration resistant semiconductor contacts and the method of producing same
US4027236A (en) * 1976-07-14 1977-05-31 Triple S Products Company Voltage and continuity checker
DE3023528C2 (de) * 1980-06-24 1984-11-29 W.C. Heraeus Gmbh, 6450 Hanau Aluminium enthaltender Feinstdraht

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3435489A1 (de) * 1983-09-28 1985-05-02 Hitachi Ltd Halbleitervorrichtung und verfahren zu ihrer herstellung
DE3506264A1 (de) * 1984-02-24 1985-08-29 Hitachi, Ltd., Tokio/Tokyo Halbleitervorrichtung

Also Published As

Publication number Publication date
JPS6117896B2 (2) 1986-05-09
GB2056537A (en) 1981-03-18
JPS5616647A (en) 1981-02-17
DE2929623A1 (de) 1981-01-29
US4380775A (en) 1983-04-19
GB2056537B (en) 1983-03-23

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Legal Events

Date Code Title Description
OAP Request for examination filed
OD Request for examination
D2 Grant after examination
8365 Fully valid after opposition proceedings
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee