DE2846489C2 - Härtbare Siloxan-Epoxy-Formmasse - Google Patents

Härtbare Siloxan-Epoxy-Formmasse

Info

Publication number
DE2846489C2
DE2846489C2 DE2846489A DE2846489A DE2846489C2 DE 2846489 C2 DE2846489 C2 DE 2846489C2 DE 2846489 A DE2846489 A DE 2846489A DE 2846489 A DE2846489 A DE 2846489A DE 2846489 C2 DE2846489 C2 DE 2846489C2
Authority
DE
Germany
Prior art keywords
weight
percent
epoxy
bisphenol
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2846489A
Other languages
German (de)
English (en)
Other versions
DE2846489B1 (de
Inventor
Keith Winton Midland Michael
Alvin Loyal Clare Moore
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp filed Critical Dow Corning Corp
Publication of DE2846489B1 publication Critical patent/DE2846489B1/de
Application granted granted Critical
Publication of DE2846489C2 publication Critical patent/DE2846489C2/de
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/681Metal alcoholates, phenolates or carboxylates
    • C08G59/685Carboxylates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/06Preparatory processes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70Siloxanes defined by use of the MDTQ nomenclature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
DE2846489A 1978-06-21 1978-10-25 Härtbare Siloxan-Epoxy-Formmasse Expired DE2846489C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/917,618 US4202811A (en) 1978-06-21 1978-06-21 Siloxane-epoxy molding compound with improved crack resistance

Publications (2)

Publication Number Publication Date
DE2846489B1 DE2846489B1 (de) 1979-07-26
DE2846489C2 true DE2846489C2 (de) 1980-03-20

Family

ID=25439061

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2846489A Expired DE2846489C2 (de) 1978-06-21 1978-10-25 Härtbare Siloxan-Epoxy-Formmasse

Country Status (7)

Country Link
US (1) US4202811A (OSRAM)
JP (1) JPS553474A (OSRAM)
CA (1) CA1103832A (OSRAM)
DE (1) DE2846489C2 (OSRAM)
FR (1) FR2429240B1 (OSRAM)
GB (1) GB2023610B (OSRAM)
IT (1) IT1115214B (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3838587A1 (de) * 1988-11-14 1990-05-17 Espe Stiftung Polyether-abformmaterial, verfahren zu seiner herstellung und seine verwendung

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817536B2 (ja) * 1979-06-21 1983-04-07 株式会社東芝 エポキシ樹脂系組成物
JPS588701B2 (ja) * 1980-04-03 1983-02-17 株式会社東芝 エポキシ系樹脂組成物
JPS58225120A (ja) * 1982-06-25 1983-12-27 Mitsubishi Gas Chem Co Inc 半導体封止用エポキシ樹脂組成物
JPS6018520A (ja) * 1983-07-12 1985-01-30 Shin Etsu Chem Co Ltd 高透明エポキシ樹脂組成物の製造方法
US4518631A (en) * 1983-11-14 1985-05-21 Dow Corning Corporation Thixotropic curable coating compositions
US4537803A (en) * 1984-05-24 1985-08-27 Westinghouse Corp. Resins containing a low viscosity organopolysiloxane liquid dielectric and a method of insulating a conductor therewith
US4816496A (en) * 1984-06-26 1989-03-28 Kabushiki Kaisha Toshiba Photocurable composition
US5037898A (en) * 1990-02-27 1991-08-06 Shell Oil Company Polysiloxane-polylactone block copolymer modified thermostat compositions
US5284938A (en) * 1990-02-27 1994-02-08 Shell Oil Company Polysiloxane modified thermoset compositions
JP3359410B2 (ja) * 1994-03-04 2002-12-24 三菱電機株式会社 成形用エポキシ樹脂組成物ならびにそれを用いた高電圧機器用モールド製品およびその製法
DE19638630B4 (de) * 1996-09-20 2004-11-18 Siemens Ag UV- und thermisch härtbare Gießharzformulierung und ihre Verwendung zum Unterfüllprozeß bei elektrischen und elektronischen Bauelementen
US6107370A (en) * 1999-01-04 2000-08-22 Aegis Coating Technologies Single pack siliconized epoxy coating
US6706405B2 (en) 2002-02-11 2004-03-16 Analytical Services & Materials, Inc. Composite coating for imparting particel erosion resistance
US9542635B2 (en) 2007-12-31 2017-01-10 Composecure, Llc Foil composite card
DK2956310T3 (da) 2013-02-13 2019-10-14 Composecure Llc Holdbart kort
CN105934346B (zh) 2014-01-29 2017-09-08 惠普发展公司,有限责任合伙企业 流体引导组件

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3358064A (en) * 1964-03-24 1967-12-12 Vitramon Inc Encapsulating molding composition and method for molding the same
US3842141A (en) * 1972-02-22 1974-10-15 Dexter Corp Silicone-epoxy copolymers and molding powders obtained therefrom
US3843577A (en) * 1972-12-26 1974-10-22 Dow Corning Siloxane-modified epoxy resin compositions
JPS5813591B2 (ja) * 1974-10-31 1983-03-14 ニツポンペイント カブシキガイシヤ ネツコウカセイヒフクソセイブツ
US3971747A (en) * 1975-04-11 1976-07-27 Dow Corning Corporation Curable compositions
US4082719A (en) * 1976-02-23 1978-04-04 Dow Corning Corporation Silicone epoxy curable compositions
US4125510A (en) * 1977-03-01 1978-11-14 Dow Corning Corporation Method of improving crack resistance of siloxane molding compositions

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3838587A1 (de) * 1988-11-14 1990-05-17 Espe Stiftung Polyether-abformmaterial, verfahren zu seiner herstellung und seine verwendung

Also Published As

Publication number Publication date
JPS6258389B2 (OSRAM) 1987-12-05
DE2846489B1 (de) 1979-07-26
FR2429240A1 (fr) 1980-01-18
GB2023610B (en) 1983-02-02
IT1115214B (it) 1986-02-03
GB2023610A (en) 1980-01-03
FR2429240B1 (fr) 1986-03-07
IT7922647A0 (it) 1979-05-14
CA1103832A (en) 1981-06-23
JPS553474A (en) 1980-01-11
US4202811A (en) 1980-05-13

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Legal Events

Date Code Title Description
8328 Change in the person/name/address of the agent

Free format text: SPOTT, G., DIPL.-CHEM. DR.RER.NAT., PAT.-ANW., 8000 MUENCHEN

8339 Ceased/non-payment of the annual fee