DE2757717C3 - Prüfstift - Google Patents

Prüfstift

Info

Publication number
DE2757717C3
DE2757717C3 DE2757717A DE2757717A DE2757717C3 DE 2757717 C3 DE2757717 C3 DE 2757717C3 DE 2757717 A DE2757717 A DE 2757717A DE 2757717 A DE2757717 A DE 2757717A DE 2757717 C3 DE2757717 C3 DE 2757717C3
Authority
DE
Germany
Prior art keywords
test
test pin
tips
housing
slide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2757717A
Other languages
German (de)
English (en)
Other versions
DE2757717B2 (de
DE2757717A1 (de
Inventor
Jonathon Howard Brookline Mass. Katz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teradyne Inc
Original Assignee
Teradyne Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teradyne Inc filed Critical Teradyne Inc
Publication of DE2757717A1 publication Critical patent/DE2757717A1/de
Publication of DE2757717B2 publication Critical patent/DE2757717B2/de
Application granted granted Critical
Publication of DE2757717C3 publication Critical patent/DE2757717C3/de
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Tests Of Electronic Circuits (AREA)
DE2757717A 1976-12-27 1977-12-23 Prüfstift Expired DE2757717C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/757,778 US4105970A (en) 1976-12-27 1976-12-27 Test pin

Publications (3)

Publication Number Publication Date
DE2757717A1 DE2757717A1 (de) 1978-06-29
DE2757717B2 DE2757717B2 (de) 1980-09-18
DE2757717C3 true DE2757717C3 (de) 1981-05-21

Family

ID=25049184

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2757717A Expired DE2757717C3 (de) 1976-12-27 1977-12-23 Prüfstift

Country Status (6)

Country Link
US (1) US4105970A (cg-RX-API-DMAC7.html)
JP (1) JPS5383075A (cg-RX-API-DMAC7.html)
CA (1) CA1077570A (cg-RX-API-DMAC7.html)
DE (1) DE2757717C3 (cg-RX-API-DMAC7.html)
FR (1) FR2375601A1 (cg-RX-API-DMAC7.html)
GB (1) GB1542235A (cg-RX-API-DMAC7.html)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4321532A (en) * 1978-03-16 1982-03-23 Luna L Jack Repairable spring probe assembly
US4438397A (en) 1979-12-26 1984-03-20 Teradyne, Inc. Test pin
CA1162243A (en) * 1979-12-26 1984-02-14 Jonathon H. Katz Test pin
DE3010311A1 (de) * 1980-03-18 1981-09-24 Feinmetall Gmbh, 7033 Herrenberg Kontaktbaustein
FR2479643A1 (fr) * 1980-03-26 1981-10-02 Sodeteg Tai Palpeur pour dispositif de test de circuits imprimes et dispositifs de test incorporant un tel palpeur
US4417206A (en) * 1981-03-09 1983-11-22 Virginia Panel Corporation Electrical contact probe and method of manufacturing
US4461993A (en) * 1981-09-21 1984-07-24 Everett/Charles, Inc. Low resistance electrical spring probe
FR2526956A1 (fr) * 1982-05-11 1983-11-18 Sicame Sa Detecteur de tension sur conducteur electrique a generateur de tension piezo-electrique incorpore pour controle de son bon fonctionnement
EP0115135A1 (en) * 1982-12-27 1984-08-08 Genrad, Inc. Electrical test fixture for printed circuit boards and the like
US4571540A (en) * 1983-09-14 1986-02-18 Virginia Panel Corporation Electrical contact probe
DE3521012A1 (de) * 1984-06-12 1985-12-12 Feinmetall Gmbh, 7033 Herrenberg Kontaktelement
FR2570830B1 (fr) * 1984-09-27 1988-11-25 Feinmetall Gmbh Tige de contact a ressort notamment pour appareil de controle de circuit electrique ou electronique
JPS6179273U (cg-RX-API-DMAC7.html) * 1984-10-29 1986-05-27
DE3441480A1 (de) * 1984-11-13 1986-05-15 MANIA Elektronik Automatisation Entwicklung und Gerätebau GmbH, 6384 Schmitten Kontaktstift
US4720275A (en) * 1986-04-14 1988-01-19 Everett/Charles Contact Products, Inc. Quick termination apparatus and method for electrical connector
DE3716705A1 (de) * 1986-05-20 1987-12-03 Ingun Pruefmittelbau Gmbh Kontaktstift
JPH0515103Y2 (cg-RX-API-DMAC7.html) * 1986-06-17 1993-04-21
DE3818728A1 (de) * 1988-06-01 1989-12-14 Feinmetall Gmbh Federkontaktstift
US4947115A (en) * 1988-06-06 1990-08-07 The Siemon Company Test probe adapter
US5045780A (en) * 1989-12-04 1991-09-03 Everett/Charles Contact Products, Inc. Electrical test probe contact tip
US5254939A (en) * 1992-03-20 1993-10-19 Xandex, Inc. Probe card system
US5471148A (en) * 1993-06-24 1995-11-28 Xandex, Inc. Probe card changer system and method
US5326428A (en) 1993-09-03 1994-07-05 Micron Semiconductor, Inc. Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability
US5478779A (en) 1994-03-07 1995-12-26 Micron Technology, Inc. Electrically conductive projections and semiconductor processing method of forming same
JP3578232B2 (ja) * 1994-04-07 2004-10-20 インターナショナル・ビジネス・マシーンズ・コーポレーション 電気接点形成方法、該電気接点を含むプローブ構造および装置
US5528158A (en) * 1994-04-11 1996-06-18 Xandex, Inc. Probe card changer system and method
DE4420268A1 (de) * 1994-06-10 1995-12-14 Wee Electrotest Engineering Gm Vorrichtung zur Kontaktierung eines Steckkontaktes
US5744977A (en) * 1994-12-21 1998-04-28 Delaware Capital Formation, Inc. High-force spring probe with improved axial alignment
US6051982A (en) * 1996-08-02 2000-04-18 International Business Machines Corporation Electronic component test apparatus with rotational probe and conductive spaced apart means
US5804984A (en) * 1996-08-02 1998-09-08 International Business Machines Corporation Electronic component test apparatus with rotational probe
US6271672B1 (en) * 1997-11-17 2001-08-07 Delaware Capital Formation, Inc. Biased BGA contactor probe tip
US6377059B2 (en) * 1999-02-19 2002-04-23 Delaware Capital Formation, Inc. Crown shaped contact barrel configuration for spring probe
DE10001117A1 (de) * 2000-01-13 2001-07-26 Infineon Technologies Ag Testvorrichtung für ein Halbleiterbauelement
WO2003076957A1 (en) * 2002-03-05 2003-09-18 Rika Denshi America, Inc. Apparatus for interfacing electronic packages and test equipment
JP3565824B2 (ja) * 2002-05-31 2004-09-15 沖電気工業株式会社 半導体パッケージのテスト用プローブ及びテスト方法
TWI233489B (en) * 2003-01-21 2005-06-01 Leeno Ind Inc Contact apparatus and test PCB including the contact apparatus used for testing microwave device, and manufacturing method of the test PCB
US7109732B2 (en) * 2003-07-31 2006-09-19 Endicott Interconnect Technologies, Inc. Electronic component test apparatus
US6900649B1 (en) 2003-09-23 2005-05-31 Keithley Instruments, Inc. High frequency RF interconnect for semiconductor automatic test equipment
WO2006007440A1 (en) * 2004-06-16 2006-01-19 Rika Denshi America, Inc. Electrical test probes, methods of making, and methods of using
US7292055B2 (en) * 2005-04-21 2007-11-06 Endicott Interconnect Technologies, Inc. Interposer for use with test apparatus
US7501839B2 (en) * 2005-04-21 2009-03-10 Endicott Interconnect Technologies, Inc. Interposer and test assembly for testing electronic devices
US7154286B1 (en) * 2005-06-30 2006-12-26 Interconnect Devices, Inc. Dual tapered spring probe
JP2007033215A (ja) * 2005-07-26 2007-02-08 Ricoh Co Ltd 電子部品実装体検査装置
US8920097B2 (en) * 2006-11-02 2014-12-30 Globalfoundries Singapore Pte. Ltd. Wafer handling system for a loadlock
TWI451091B (zh) * 2010-03-29 2014-09-01 Hon Hai Prec Ind Co Ltd 探針結構
TWI534432B (zh) 2010-09-07 2016-05-21 瓊斯科技國際公司 用於微電路測試器之電氣傳導針腳
US20130271172A1 (en) * 2012-04-13 2013-10-17 Texas Instruments Incorporated Probe apparatus and method
KR101328581B1 (ko) * 2012-06-13 2013-11-13 리노공업주식회사 검사용 프로브 및 그 제조방법
CN109638505B (zh) * 2018-12-28 2020-09-15 廊坊市东电腾达电力工程有限公司 电线电缆耐压试验专用接头

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3068403A (en) * 1960-01-27 1962-12-11 Western Electric Co Test probe
DE1765461B2 (de) * 1968-05-22 1976-12-16 Bossert, Anneliese, 7530 Pforzheim Federkontakt
DE2344239B2 (de) * 1973-09-01 1977-11-03 Luther, Erich, 3050 Wunstorf; Maelzer, Fritz; Maelzer, Martin; 7910 Reutti Post Neu-Ulm; Türkkan, Tamer, 3011 Laatzen Kontaktvorrichtung zum anschliessen einer gedruckten schaltung an ein pruefgeraet
CH589947A5 (en) * 1974-02-13 1977-07-29 Ingun Ag Test pin for printed circuit boards - with spring loaded shank in barrel and test end with conical hollow for boards test point

Also Published As

Publication number Publication date
DE2757717B2 (de) 1980-09-18
GB1542235A (en) 1979-03-14
FR2375601B1 (cg-RX-API-DMAC7.html) 1983-10-28
DE2757717A1 (de) 1978-06-29
CA1077570A (en) 1980-05-13
US4105970A (en) 1978-08-08
JPS5383075A (en) 1978-07-22
FR2375601A1 (fr) 1978-07-21

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Legal Events

Date Code Title Description
OAP Request for examination filed
OD Request for examination
C3 Grant after two publication steps (3rd publication)
8339 Ceased/non-payment of the annual fee