DE2728771C2 - Verfahren zur epitaktischen Ablagerung einer Schicht aus Verbindungshalbleitermaterial - Google Patents
Verfahren zur epitaktischen Ablagerung einer Schicht aus VerbindungshalbleitermaterialInfo
- Publication number
- DE2728771C2 DE2728771C2 DE2728771A DE2728771A DE2728771C2 DE 2728771 C2 DE2728771 C2 DE 2728771C2 DE 2728771 A DE2728771 A DE 2728771A DE 2728771 A DE2728771 A DE 2728771A DE 2728771 C2 DE2728771 C2 DE 2728771C2
- Authority
- DE
- Germany
- Prior art keywords
- deposition
- current density
- value
- liquid phase
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000008021 deposition Effects 0.000 title claims description 31
- 238000000034 method Methods 0.000 title claims description 11
- 150000001875 compounds Chemical class 0.000 title claims description 8
- 239000004065 semiconductor Substances 0.000 title claims description 8
- 239000000463 material Substances 0.000 title claims description 7
- 239000007791 liquid phase Substances 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 18
- 238000001816 cooling Methods 0.000 claims description 7
- 230000003247 decreasing effect Effects 0.000 claims 1
- 238000000151 deposition Methods 0.000 description 24
- 230000010287 polarization Effects 0.000 description 18
- 230000005679 Peltier effect Effects 0.000 description 11
- 230000000694 effects Effects 0.000 description 6
- 239000007790 solid phase Substances 0.000 description 6
- 239000012535 impurity Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 4
- MDPILPRLPQYEEN-UHFFFAOYSA-N aluminium arsenide Chemical compound [As]#[Al] MDPILPRLPQYEEN-UHFFFAOYSA-N 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000000407 epitaxy Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 235000012550 Pimpinella anisum Nutrition 0.000 description 1
- 240000004760 Pimpinella anisum Species 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000012886 linear function Methods 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B19/00—Liquid-phase epitaxial-layer growth
- C30B19/08—Heating of the reaction chamber or the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B19/00—Liquid-phase epitaxial-layer growth
- C30B19/10—Controlling or regulating
- C30B19/103—Current controlled or induced growth
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02395—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02546—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02623—Liquid deposition
- H01L21/02625—Liquid deposition using melted materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02623—Liquid deposition
- H01L21/02628—Liquid deposition using solutions
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7621107A FR2358021A1 (fr) | 1976-07-09 | 1976-07-09 | Procede de depot epitaxique d'un semi-conducteur par polarisation electrique d'une phase liquide |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE2728771A1 DE2728771A1 (de) | 1978-01-12 |
| DE2728771C2 true DE2728771C2 (de) | 1986-07-24 |
Family
ID=9175520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2728771A Expired DE2728771C2 (de) | 1976-07-09 | 1977-06-25 | Verfahren zur epitaktischen Ablagerung einer Schicht aus Verbindungshalbleitermaterial |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4133705A (enExample) |
| JP (1) | JPS538563A (enExample) |
| DE (1) | DE2728771C2 (enExample) |
| FR (1) | FR2358021A1 (enExample) |
| GB (1) | GB1581457A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4381598A (en) * | 1981-06-11 | 1983-05-03 | General Electric Company | Method of making anode and cathode connections for electromigration |
| US4549912A (en) * | 1981-06-11 | 1985-10-29 | General Electric Company | Anode and cathode connections for the practice of electromigration |
| EP0140565B1 (en) * | 1983-09-19 | 1989-08-23 | Fujitsu Limited | Method for growing multicomponent compound semiconductor crystals |
| US6090651A (en) * | 1999-11-05 | 2000-07-18 | Lsi Logic Corporation | Depletion free polysilicon gate electrodes |
| US11140838B2 (en) | 2017-08-10 | 2021-10-12 | Valmont Industries, Inc. | System and method for variable rate, high speed irrigation control |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2842467A (en) * | 1954-04-28 | 1958-07-08 | Ibm | Method of growing semi-conductors |
| US2999776A (en) * | 1955-01-13 | 1961-09-12 | Siemens Ag | Method of producing differentiated doping zones in semiconductor crystals |
| BE562932A (enExample) * | 1957-01-23 | |||
| NL301226A (enExample) * | 1962-12-03 | |||
| GB1034503A (en) * | 1963-05-14 | 1966-06-29 | Nat Res Dev | Improvements in or relating to the production of crystalline material |
| US3411946A (en) * | 1963-09-05 | 1968-11-19 | Raytheon Co | Process and apparatus for producing an intermetallic compound |
| US3752713A (en) * | 1970-02-14 | 1973-08-14 | Oki Electric Ind Co Ltd | Method of manufacturing semiconductor elements by liquid phase epitaxial growing method |
| US3879235A (en) * | 1973-06-11 | 1975-04-22 | Massachusetts Inst Technology | Method of growing from solution materials exhibiting a peltier effect at the solid-melt interface |
| US4012242A (en) * | 1973-11-14 | 1977-03-15 | International Rectifier Corporation | Liquid epitaxy technique |
| US3948692A (en) * | 1974-06-24 | 1976-04-06 | Lev Vasilievich Golubev | Method of preparing multi-layer semiconductor hetero-structures on the basis of compounds AIII BV where AIII is a metal of group three and BV is a non-metal of group five |
| US3993511A (en) * | 1975-05-30 | 1976-11-23 | North American Philips Corporation | High temperature electrical contact for Peltier-induced liquid phase epitaxy on intermetallic III-V compounds of gallium |
-
1976
- 1976-07-09 FR FR7621107A patent/FR2358021A1/fr active Granted
-
1977
- 1977-06-25 DE DE2728771A patent/DE2728771C2/de not_active Expired
- 1977-07-01 US US05/812,262 patent/US4133705A/en not_active Expired - Lifetime
- 1977-07-06 JP JP8004577A patent/JPS538563A/ja active Granted
- 1977-07-06 GB GB28294/77A patent/GB1581457A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2358021A1 (fr) | 1978-02-03 |
| DE2728771A1 (de) | 1978-01-12 |
| JPS5516532B2 (enExample) | 1980-05-02 |
| US4133705A (en) | 1979-01-09 |
| JPS538563A (en) | 1978-01-26 |
| GB1581457A (en) | 1980-12-17 |
| FR2358021B1 (enExample) | 1978-12-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |