DE2700265C3 - Saure Peroxid-Ätzlösung und deren Verwendung zum Ätzen von Metall, insbesondere von Kupfer - Google Patents

Saure Peroxid-Ätzlösung und deren Verwendung zum Ätzen von Metall, insbesondere von Kupfer

Info

Publication number
DE2700265C3
DE2700265C3 DE2700265A DE2700265A DE2700265C3 DE 2700265 C3 DE2700265 C3 DE 2700265C3 DE 2700265 A DE2700265 A DE 2700265A DE 2700265 A DE2700265 A DE 2700265A DE 2700265 C3 DE2700265 C3 DE 2700265C3
Authority
DE
Germany
Prior art keywords
acid
etching
concentration
etching solution
peroxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2700265A
Other languages
German (de)
English (en)
Other versions
DE2700265B2 (de
DE2700265A1 (de
Inventor
Charles Anthony Raytown Mo. Gaputis (V.St.A.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
Shipley Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc filed Critical Shipley Co Inc
Publication of DE2700265A1 publication Critical patent/DE2700265A1/de
Publication of DE2700265B2 publication Critical patent/DE2700265B2/de
Application granted granted Critical
Publication of DE2700265C3 publication Critical patent/DE2700265C3/de
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
DE2700265A 1976-01-05 1977-01-05 Saure Peroxid-Ätzlösung und deren Verwendung zum Ätzen von Metall, insbesondere von Kupfer Expired DE2700265C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US64647676A 1976-01-05 1976-01-05

Publications (3)

Publication Number Publication Date
DE2700265A1 DE2700265A1 (de) 1977-07-14
DE2700265B2 DE2700265B2 (de) 1978-06-29
DE2700265C3 true DE2700265C3 (de) 1979-02-22

Family

ID=24593221

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2700265A Expired DE2700265C3 (de) 1976-01-05 1977-01-05 Saure Peroxid-Ätzlösung und deren Verwendung zum Ätzen von Metall, insbesondere von Kupfer

Country Status (8)

Country Link
US (1) US4130454A (enExample)
JP (1) JPS52115752A (enExample)
DE (1) DE2700265C3 (enExample)
FR (1) FR2337189A1 (enExample)
GB (1) GB1546524A (enExample)
IT (1) IT1080302B (enExample)
NL (1) NL7700022A (enExample)
SE (1) SE425007B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10136078B4 (de) * 2000-07-28 2011-06-16 MEC Co., Ltd., Amagasaki Wässrige Lösung zum kontinuierlichen Mikroätzen von Kupfer oder Kupferlegierung

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1083401B (it) * 1977-05-27 1985-05-21 Alfachimici Spa Soluzione acida per l'attacco selettivo del rame
US4141850A (en) * 1977-11-08 1979-02-27 Dart Industries Inc. Dissolution of metals
US4174253A (en) * 1977-11-08 1979-11-13 Dart Industries Inc. Dissolution of metals utilizing a H2 O2 -H2 SO4 solution catalyzed with hydroxy substituted cycloparaffins
JPS55154580A (en) * 1979-05-22 1980-12-02 Yamatoya Shokai:Kk Copper etching bath
CA1209886A (en) * 1982-01-11 1986-08-19 Thomas W. Bleeks Peroxide selective stripping compositions and method
JPS58197277A (ja) * 1982-05-08 1983-11-16 Mitsubishi Gas Chem Co Inc 金属の化学的溶解処理液
US4451327A (en) * 1982-12-17 1984-05-29 Psi Star, Inc. Process and structure for etching copper
JPS61591A (ja) * 1984-06-13 1986-01-06 Fujitsu Ltd 銅のエツチング方法
US4636282A (en) * 1985-06-20 1987-01-13 Great Lakes Chemical Corporation Method for etching copper and composition useful therein
US5248386A (en) * 1991-02-08 1993-09-28 Aluminum Company Of America Milling solution and method
US5100500A (en) * 1991-02-08 1992-03-31 Aluminum Company Of America Milling solution and method
DE4402788A1 (de) * 1994-01-31 1995-08-10 Emil Krechen Industrievertretu Verfahren zum Abtragen von Metallen
JP3400558B2 (ja) * 1994-08-12 2003-04-28 メック株式会社 銅および銅合金のエッチング液
GB9425090D0 (en) * 1994-12-12 1995-02-08 Alpha Metals Ltd Copper coating
KR100379824B1 (ko) * 2000-12-20 2003-04-11 엘지.필립스 엘시디 주식회사 식각용액 및 식각용액으로 패턴된 구리배선을 가지는전자기기용 어레이기판
US6319846B1 (en) * 2001-01-05 2001-11-20 Taiwan Semiconductor Manufacturing Company, Ltd Method for removing solder bodies from a semiconductor wafer
JP2002256460A (ja) * 2001-02-09 2002-09-11 Nippon Parkerizing Co Ltd アルミニウムおよびアルミニウム合金に用いるエッチングとデスマッティング用の組成物及びその方法
US6953389B2 (en) * 2001-08-09 2005-10-11 Cheil Industries, Inc. Metal CMP slurry compositions that favor mechanical removal of oxides with reduced susceptibility to micro-scratching
TW591089B (en) * 2001-08-09 2004-06-11 Cheil Ind Inc Slurry composition for use in chemical mechanical polishing of metal wiring
DE10302596A1 (de) * 2002-01-24 2003-08-28 Shipley Company Marlborough Behandlung von Metalloberflächen mit einer modifizierten Oxidaustauschmasse
DE10313517B4 (de) 2003-03-25 2006-03-30 Atotech Deutschland Gmbh Lösung zum Ätzen von Kupfer, Verfahren zum Vorbehandeln einer Schicht aus Kupfer sowie Anwendung des Verfahrens
US20060124026A1 (en) * 2004-12-10 2006-06-15 3M Innovative Properties Company Polishing solutions
US7435162B2 (en) * 2005-10-24 2008-10-14 3M Innovative Properties Company Polishing fluids and methods for CMP
PT2111445E (pt) * 2007-02-14 2010-12-29 Mallinckrodt Baker Inc Formulações à base de oxometalato activadas por peróxido para a remoção de resíduos de gravação
KR20090002506A (ko) * 2007-06-29 2009-01-09 제일모직주식회사 상변화 메모리 소자 연마용 ｃｍｐ 슬러리 조성물 및 이를이용한 연마 방법
US20090001339A1 (en) * 2007-06-29 2009-01-01 Tae Young Lee Chemical Mechanical Polishing Slurry Composition for Polishing Phase-Change Memory Device and Method for Polishing Phase-Change Memory Device Using the Same
US8303832B2 (en) * 2009-08-17 2012-11-06 Palo Alto Research Center Incorporated Solid inks for masks for printed circuit boards and other electronic devices
US8211617B2 (en) * 2009-08-17 2012-07-03 Palo Alto Research Center Incorporated Solid inks for printed masks
WO2021220476A1 (ja) * 2020-04-30 2021-11-04 パナソニックＩｐマネジメント株式会社 エッチング液
US20250333849A1 (en) * 2024-04-30 2025-10-30 Entegris, Inc. Solvent-based compositions and related methods for molybdenum etching

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2377593A (en) * 1942-02-09 1945-06-05 Packard Motor Car Co Etching ink
US2441300A (en) * 1944-08-21 1948-05-11 Packard Motor Car Co Ink for etching metal

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10136078B4 (de) * 2000-07-28 2011-06-16 MEC Co., Ltd., Amagasaki Wässrige Lösung zum kontinuierlichen Mikroätzen von Kupfer oder Kupferlegierung

Also Published As

Publication number Publication date
DE2700265B2 (de) 1978-06-29
GB1546524A (en) 1979-05-23
JPS5440448B2 (enExample) 1979-12-04
SE7700015L (sv) 1977-07-06
JPS52115752A (en) 1977-09-28
DE2700265A1 (de) 1977-07-14
US4130454A (en) 1978-12-19
SE425007B (sv) 1982-08-23
FR2337189A1 (fr) 1977-07-29
FR2337189B1 (enExample) 1979-03-09
IT1080302B (it) 1985-05-16
NL7700022A (nl) 1977-07-07

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
8339 Ceased/non-payment of the annual fee