DE2608427C2 - Verfahren zum Aufkitten von Halbleiterscheiben - Google Patents
Verfahren zum Aufkitten von HalbleiterscheibenInfo
- Publication number
- DE2608427C2 DE2608427C2 DE2608427A DE2608427A DE2608427C2 DE 2608427 C2 DE2608427 C2 DE 2608427C2 DE 2608427 A DE2608427 A DE 2608427A DE 2608427 A DE2608427 A DE 2608427A DE 2608427 C2 DE2608427 C2 DE 2608427C2
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor wafers
- temperature
- cementing
- resin
- carrier plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 235000012431 wafers Nutrition 0.000 title claims description 48
- 239000004065 semiconductor Substances 0.000 title claims description 46
- 238000000034 method Methods 0.000 title claims description 19
- 229920005989 resin Polymers 0.000 claims description 37
- 239000011347 resin Substances 0.000 claims description 37
- 239000004568 cement Substances 0.000 claims description 25
- 238000002844 melting Methods 0.000 claims description 20
- 230000008018 melting Effects 0.000 claims description 20
- 239000002904 solvent Substances 0.000 claims description 14
- 239000000126 substance Substances 0.000 claims description 14
- 238000005498 polishing Methods 0.000 claims description 9
- 239000000155 melt Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000009835 boiling Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 239000004014 plasticizer Substances 0.000 claims description 3
- 238000000137 annealing Methods 0.000 claims description 2
- 239000000654 additive Substances 0.000 claims 2
- 230000000996 additive effect Effects 0.000 claims 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 4
- 238000007517 polishing process Methods 0.000 description 3
- YCOXTKKNXUZSKD-UHFFFAOYSA-N 3,4-xylenol Chemical compound CC1=CC=C(O)C=C1C YCOXTKKNXUZSKD-UHFFFAOYSA-N 0.000 description 2
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- -1 for example Chemical class 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000005496 tempering Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- QPVRKFOKCKORDP-UHFFFAOYSA-N 1,3-dimethylcyclohexa-2,4-dien-1-ol Chemical compound CC1=CC(C)(O)CC=C1 QPVRKFOKCKORDP-UHFFFAOYSA-N 0.000 description 1
- KPAPHODVWOVUJL-UHFFFAOYSA-N 1-benzofuran;1h-indene Chemical compound C1=CC=C2CC=CC2=C1.C1=CC=C2OC=CC2=C1 KPAPHODVWOVUJL-UHFFFAOYSA-N 0.000 description 1
- AIACLXROWHONEE-UHFFFAOYSA-N 2,3-dimethylcyclohexa-2,5-diene-1,4-dione Chemical compound CC1=C(C)C(=O)C=CC1=O AIACLXROWHONEE-UHFFFAOYSA-N 0.000 description 1
- QWBBPBRQALCEIZ-UHFFFAOYSA-N 2,3-dimethylphenol Chemical compound CC1=CC=CC(O)=C1C QWBBPBRQALCEIZ-UHFFFAOYSA-N 0.000 description 1
- NATVSFWWYVJTAZ-UHFFFAOYSA-N 2,4,6-trichloroaniline Chemical compound NC1=C(Cl)C=C(Cl)C=C1Cl NATVSFWWYVJTAZ-UHFFFAOYSA-N 0.000 description 1
- KQCMTOWTPBNWDB-UHFFFAOYSA-N 2,4-dichloroaniline Chemical compound NC1=CC=C(Cl)C=C1Cl KQCMTOWTPBNWDB-UHFFFAOYSA-N 0.000 description 1
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 1
- CDMGNVWZXRKJNS-UHFFFAOYSA-N 2-benzylphenol Chemical compound OC1=CC=CC=C1CC1=CC=CC=C1 CDMGNVWZXRKJNS-UHFFFAOYSA-N 0.000 description 1
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 1
- GOLORTLGFDVFDW-UHFFFAOYSA-N 3-(1h-benzimidazol-2-yl)-7-(diethylamino)chromen-2-one Chemical compound C1=CC=C2NC(C3=CC4=CC=C(C=C4OC3=O)N(CC)CC)=NC2=C1 GOLORTLGFDVFDW-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- 101000716729 Homo sapiens Kit ligand Proteins 0.000 description 1
- 239000013032 Hydrocarbon resin Substances 0.000 description 1
- 102100020880 Kit ligand Human genes 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- WURBFLDFSFBTLW-UHFFFAOYSA-N benzil Chemical compound C=1C=CC=CC=1C(=O)C(=O)C1=CC=CC=C1 WURBFLDFSFBTLW-UHFFFAOYSA-N 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- TXCDCPKCNAJMEE-UHFFFAOYSA-N dibenzofuran Chemical compound C1=CC=C2C3=CC=CC=C3OC2=C1 TXCDCPKCNAJMEE-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000004571 lime Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000010813 municipal solid waste Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 150000003097 polyterpenes Chemical class 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 210000003813 thumb Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
- Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
- Y10T156/1092—All laminae planar and face to face
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Laminated Bodies (AREA)
Priority Applications (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2608427A DE2608427C2 (de) | 1976-03-01 | 1976-03-01 | Verfahren zum Aufkitten von Halbleiterscheiben |
| NL7614209A NL7614209A (nl) | 1976-03-01 | 1976-12-21 | Werkwijze voor het opbrengen door kitten van halfgeleiderschijven. |
| GB2317/77A GB1505488A (en) | 1976-03-01 | 1977-01-20 | Cementing semiconductor discs to carrier plates |
| US05/766,457 US4300965A (en) | 1976-03-01 | 1977-02-07 | Process for cementing semiconductor discs to carrier plates and product so obtained |
| CA271,285A CA1075579A (en) | 1976-03-01 | 1977-02-08 | Process for cementing semiconductor discs to carrier plates and product so obtained |
| IT48216/77A IT1083481B (it) | 1976-03-01 | 1977-02-25 | Procedimento per attaccare con mastice piastrine di semiconduttori |
| FR7705766A FR2343330A1 (fr) | 1976-03-01 | 1977-02-28 | Procede de masticage de disques semi-conducteurs |
| BE175315A BE851892A (fr) | 1976-03-01 | 1977-02-28 | Procede de masticage de disques semi-conducteurs |
| SE7702273A SE7702273L (sv) | 1976-03-01 | 1977-03-01 | Forfarande for pakittning av halvledarskivor |
| JP2213677A JPS52106683A (en) | 1976-03-01 | 1977-03-01 | Method of bonding semiconductor disk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2608427A DE2608427C2 (de) | 1976-03-01 | 1976-03-01 | Verfahren zum Aufkitten von Halbleiterscheiben |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE2608427A1 DE2608427A1 (de) | 1977-09-08 |
| DE2608427C2 true DE2608427C2 (de) | 1984-07-19 |
Family
ID=5971267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2608427A Expired DE2608427C2 (de) | 1976-03-01 | 1976-03-01 | Verfahren zum Aufkitten von Halbleiterscheiben |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US4300965A (enExample) |
| JP (1) | JPS52106683A (enExample) |
| BE (1) | BE851892A (enExample) |
| CA (1) | CA1075579A (enExample) |
| DE (1) | DE2608427C2 (enExample) |
| FR (1) | FR2343330A1 (enExample) |
| GB (1) | GB1505488A (enExample) |
| IT (1) | IT1083481B (enExample) |
| NL (1) | NL7614209A (enExample) |
| SE (1) | SE7702273L (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2809274A1 (de) * | 1978-03-03 | 1979-09-13 | Wacker Chemitronic | Verfahren zur vergleichmaessigung des polierabtrages von scheiben beim polieren |
| US4517041A (en) * | 1982-09-30 | 1985-05-14 | Magnetic Peripherals Inc. | Method for attaching a workpiece to a workpiece carrier |
| US4530138A (en) * | 1982-09-30 | 1985-07-23 | Westinghouse Electric Corp. | Method of making a transducer assembly |
| DE3670178D1 (de) * | 1986-08-13 | 1990-05-10 | Toshiba Kawasaki Kk | Apparat zum zusammenfuegen von halbleiterscheiben. |
| JP3537688B2 (ja) * | 1998-11-24 | 2004-06-14 | 富士通株式会社 | 磁気ヘッドの加工方法 |
| DE10052293A1 (de) * | 2000-10-20 | 2002-04-25 | B L E Lab Equipment Gmbh | Verfahren zum Aufbringen eines Substrats |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1950468A (en) * | 1930-04-18 | 1934-03-13 | Nat Aniline & Chem Co Inc | Alkyd resinous composition |
| US2394689A (en) * | 1944-01-07 | 1946-02-12 | American Viscose Corp | Method of dyeing |
| US3335087A (en) * | 1965-12-20 | 1967-08-08 | Pennsalt Chemical Corp | Method of stripping resins |
| US3452133A (en) * | 1966-03-07 | 1969-06-24 | Schjeldahl Co G T | Annealing of metal-plastic laminates |
| US3475867A (en) * | 1966-12-20 | 1969-11-04 | Monsanto Co | Processing of semiconductor wafers |
| US3449870A (en) * | 1967-01-24 | 1969-06-17 | Geoscience Instr Corp | Method and apparatus for mounting thin elements |
| US3586559A (en) * | 1968-07-01 | 1971-06-22 | Rohr Corp | Method of temporarily securing a workpiece to a workholder |
| JPS5121334B2 (enExample) * | 1971-08-27 | 1976-07-01 | ||
| DE2247067C3 (de) * | 1972-09-26 | 1979-08-09 | Wacker-Chemitronic Gesellschaft Fuer Elektronik-Grundstoffe Mbh, 8263 Burghausen | Verwendung einer Poliersuspension zum schleierfreien Polieren von Halbleiteroberflächen |
| US3888053A (en) * | 1973-05-29 | 1975-06-10 | Rca Corp | Method of shaping semiconductor workpiece |
-
1976
- 1976-03-01 DE DE2608427A patent/DE2608427C2/de not_active Expired
- 1976-12-21 NL NL7614209A patent/NL7614209A/xx not_active Application Discontinuation
-
1977
- 1977-01-20 GB GB2317/77A patent/GB1505488A/en not_active Expired
- 1977-02-07 US US05/766,457 patent/US4300965A/en not_active Expired - Lifetime
- 1977-02-08 CA CA271,285A patent/CA1075579A/en not_active Expired
- 1977-02-25 IT IT48216/77A patent/IT1083481B/it active
- 1977-02-28 FR FR7705766A patent/FR2343330A1/fr active Granted
- 1977-02-28 BE BE175315A patent/BE851892A/xx not_active IP Right Cessation
- 1977-03-01 JP JP2213677A patent/JPS52106683A/ja active Granted
- 1977-03-01 SE SE7702273A patent/SE7702273L/xx not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5641167B2 (enExample) | 1981-09-26 |
| BE851892A (fr) | 1977-08-29 |
| GB1505488A (en) | 1978-03-30 |
| FR2343330B1 (enExample) | 1978-10-20 |
| JPS52106683A (en) | 1977-09-07 |
| FR2343330A1 (fr) | 1977-09-30 |
| NL7614209A (nl) | 1977-09-05 |
| CA1075579A (en) | 1980-04-15 |
| IT1083481B (it) | 1985-05-21 |
| US4300965A (en) | 1981-11-17 |
| DE2608427A1 (de) | 1977-09-08 |
| SE7702273L (sv) | 1977-09-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE69311005T2 (de) | Elastische Schaumfolie und Aufspannvorrichtung zum Polieren von Waffeln, die diese Folie verwendet | |
| DE68911621T2 (de) | Verfahren zum Herstellen einer Einrichtung. | |
| DE69835469T2 (de) | Verfahren zur Herstellung eines geklebten Substrates | |
| DE4105145C2 (de) | Verfahren und Vorrichtung zum Planarisieren der Oberfläche eines Dielektrikums | |
| DE68920365T2 (de) | Verfahren zur Polierung eines Halbleiter-Plättchens. | |
| EP0916450B1 (de) | Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben | |
| DE69611851T2 (de) | Haltevorrichtung für ein Substrat und Verfahren und Vorrichtung zum Polieren eines Substrates | |
| DE69707219T2 (de) | Verfahren zum Herstellen von Silizium-Halbleiter Einzelsubstrat | |
| DE68910368T2 (de) | Verfahren zum Herstellen eines Halbleiterkörpers. | |
| DE69722873T2 (de) | Hoch korrosionsbeständiges Siliziumcarbidprodukt | |
| DE2802654B2 (de) | Befestigung einer Halbleiterplatte an einer Läppscheibe | |
| DE3027588A1 (de) | Verfahren und vorrichtung zum herstellen eines kunststoffinformationstraegers | |
| DE2712521A1 (de) | Verfahren zum aufkitten von scheiben | |
| DE2608427C2 (de) | Verfahren zum Aufkitten von Halbleiterscheiben | |
| DE10208414B4 (de) | Vorrichtung mit einem verbesserten Polierkissenaufbereiter für das chemisch mechanische Polieren | |
| EP0031880A2 (de) | Verfahren zum Herstellen eines Faserverbundbauteils | |
| DE19755437C1 (de) | Verfahren zur zumindest partiellen direkten Beschichtung eines dehnfähigen Trägermaterials mit einer Haftklebemasse sowie Vorrichtung zur Durchführung des Verfahrens | |
| DE3016310C2 (enExample) | ||
| DE60129650T2 (de) | Vorrichtung zum Abrichten eines Polierkissens und Verfahren zum Herstellen des Polierkissens | |
| DE60212992T2 (de) | Verbindungssystem zum befestigen von halbleiterplatten sowie verfahren zur herstellung von halbleiterplatten | |
| DE4341216A1 (de) | Dichtungsbauteil für Spalt- oder Labyrinthdichtungen und Verfahren zu seiner Herstellung | |
| DE69032849T2 (de) | Verwendung einer Reinigungsplatte für Halbleiterherstellungsvorrichtung | |
| DE69711818T2 (de) | Verfahren und Vorrichtung zum Polieren einer dünnen Platte | |
| DE3934140A1 (de) | Verfahren zur die ausbildung von getterfaehigen zentren induzierenden oberflaechenbehandlung von halbleiterscheiben und dadurch erhaeltliche beidseitig polierte scheiben | |
| DE2415255C3 (de) | Verfahren zur Herstellung von"**5·1™11 Feststoff-Trockenschmierfilmen |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OD | Request for examination | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |