CA1075579A - Process for cementing semiconductor discs to carrier plates and product so obtained - Google Patents
Process for cementing semiconductor discs to carrier plates and product so obtainedInfo
- Publication number
- CA1075579A CA1075579A CA271,285A CA271285A CA1075579A CA 1075579 A CA1075579 A CA 1075579A CA 271285 A CA271285 A CA 271285A CA 1075579 A CA1075579 A CA 1075579A
- Authority
- CA
- Canada
- Prior art keywords
- cementing
- temperature
- cement
- range
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims abstract description 27
- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 229920005989 resin Polymers 0.000 claims abstract description 41
- 239000011347 resin Substances 0.000 claims abstract description 41
- 238000002844 melting Methods 0.000 claims abstract description 23
- 230000008018 melting Effects 0.000 claims abstract description 23
- 239000002904 solvent Substances 0.000 claims abstract description 18
- 239000004014 plasticizer Substances 0.000 claims abstract description 10
- 239000000155 melt Substances 0.000 claims abstract description 4
- 239000000126 substance Substances 0.000 claims abstract description 3
- 239000004568 cement Substances 0.000 claims description 61
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000009835 boiling Methods 0.000 claims description 5
- WURBFLDFSFBTLW-UHFFFAOYSA-N benzil Chemical compound C=1C=CC=CC=1C(=O)C(=O)C1=CC=CC=C1 WURBFLDFSFBTLW-UHFFFAOYSA-N 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims description 2
- 239000000306 component Substances 0.000 claims 5
- 238000001816 cooling Methods 0.000 claims 2
- 230000002311 subsequent effect Effects 0.000 claims 2
- 238000005498 polishing Methods 0.000 abstract description 9
- 239000000243 solution Substances 0.000 description 18
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 4
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 3
- FBOFHVFMPNNIKN-UHFFFAOYSA-N 2,3-dimethylquinoline Chemical compound C1=CC=C2N=C(C)C(C)=CC2=C1 FBOFHVFMPNNIKN-UHFFFAOYSA-N 0.000 description 2
- YCOXTKKNXUZSKD-UHFFFAOYSA-N 3,4-xylenol Chemical compound CC1=CC=C(O)C=C1C YCOXTKKNXUZSKD-UHFFFAOYSA-N 0.000 description 2
- 239000013032 Hydrocarbon resin Substances 0.000 description 2
- GOZCEKPKECLKNO-RKQHYHRCSA-N Picein Chemical compound C1=CC(C(=O)C)=CC=C1O[C@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 GOZCEKPKECLKNO-RKQHYHRCSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 229920006270 hydrocarbon resin Polymers 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- KPAPHODVWOVUJL-UHFFFAOYSA-N 1-benzofuran;1h-indene Chemical compound C1=CC=C2CC=CC2=C1.C1=CC=C2OC=CC2=C1 KPAPHODVWOVUJL-UHFFFAOYSA-N 0.000 description 1
- JJPSZKIOGBRMHK-UHFFFAOYSA-N 2,3-dimethylquinoline Natural products N1=C(C)C=CC2=CC(C)=CC=C21 JJPSZKIOGBRMHK-UHFFFAOYSA-N 0.000 description 1
- NATVSFWWYVJTAZ-UHFFFAOYSA-N 2,4,6-trichloroaniline Chemical compound NC1=C(Cl)C=C(Cl)C=C1Cl NATVSFWWYVJTAZ-UHFFFAOYSA-N 0.000 description 1
- NKTOLZVEWDHZMU-UHFFFAOYSA-N 2,5-xylenol Chemical compound CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 1
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 1
- CDMGNVWZXRKJNS-UHFFFAOYSA-N 2-benzylphenol Chemical compound OC1=CC=CC=C1CC1=CC=CC=C1 CDMGNVWZXRKJNS-UHFFFAOYSA-N 0.000 description 1
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 1
- GOLORTLGFDVFDW-UHFFFAOYSA-N 3-(1h-benzimidazol-2-yl)-7-(diethylamino)chromen-2-one Chemical compound C1=CC=C2NC(C3=CC4=CC=C(C=C4OC3=O)N(CC)CC)=NC2=C1 GOLORTLGFDVFDW-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 241001527806 Iti Species 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 241000206607 Porphyra umbilicalis Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- TXCDCPKCNAJMEE-UHFFFAOYSA-N dibenzofuran Chemical compound C1=CC=C2C3=CC=CC=C3OC2=C1 TXCDCPKCNAJMEE-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229940056211 paraffin Drugs 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 150000003097 polyterpenes Chemical class 0.000 description 1
- 229940058401 polytetrafluoroethylene Drugs 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 239000012858 resilient material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 210000003813 thumb Anatomy 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
- Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
- Y10T156/1092—All laminae planar and face to face
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2608427A DE2608427C2 (de) | 1976-03-01 | 1976-03-01 | Verfahren zum Aufkitten von Halbleiterscheiben |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1075579A true CA1075579A (en) | 1980-04-15 |
Family
ID=5971267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA271,285A Expired CA1075579A (en) | 1976-03-01 | 1977-02-08 | Process for cementing semiconductor discs to carrier plates and product so obtained |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US4300965A (enExample) |
| JP (1) | JPS52106683A (enExample) |
| BE (1) | BE851892A (enExample) |
| CA (1) | CA1075579A (enExample) |
| DE (1) | DE2608427C2 (enExample) |
| FR (1) | FR2343330A1 (enExample) |
| GB (1) | GB1505488A (enExample) |
| IT (1) | IT1083481B (enExample) |
| NL (1) | NL7614209A (enExample) |
| SE (1) | SE7702273L (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2809274A1 (de) * | 1978-03-03 | 1979-09-13 | Wacker Chemitronic | Verfahren zur vergleichmaessigung des polierabtrages von scheiben beim polieren |
| US4517041A (en) * | 1982-09-30 | 1985-05-14 | Magnetic Peripherals Inc. | Method for attaching a workpiece to a workpiece carrier |
| US4530138A (en) * | 1982-09-30 | 1985-07-23 | Westinghouse Electric Corp. | Method of making a transducer assembly |
| DE3670178D1 (de) * | 1986-08-13 | 1990-05-10 | Toshiba Kawasaki Kk | Apparat zum zusammenfuegen von halbleiterscheiben. |
| JP3537688B2 (ja) * | 1998-11-24 | 2004-06-14 | 富士通株式会社 | 磁気ヘッドの加工方法 |
| DE10052293A1 (de) * | 2000-10-20 | 2002-04-25 | B L E Lab Equipment Gmbh | Verfahren zum Aufbringen eines Substrats |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1950468A (en) * | 1930-04-18 | 1934-03-13 | Nat Aniline & Chem Co Inc | Alkyd resinous composition |
| US2394689A (en) * | 1944-01-07 | 1946-02-12 | American Viscose Corp | Method of dyeing |
| US3335087A (en) * | 1965-12-20 | 1967-08-08 | Pennsalt Chemical Corp | Method of stripping resins |
| US3452133A (en) * | 1966-03-07 | 1969-06-24 | Schjeldahl Co G T | Annealing of metal-plastic laminates |
| US3475867A (en) * | 1966-12-20 | 1969-11-04 | Monsanto Co | Processing of semiconductor wafers |
| US3449870A (en) * | 1967-01-24 | 1969-06-17 | Geoscience Instr Corp | Method and apparatus for mounting thin elements |
| US3586559A (en) * | 1968-07-01 | 1971-06-22 | Rohr Corp | Method of temporarily securing a workpiece to a workholder |
| JPS5121334B2 (enExample) * | 1971-08-27 | 1976-07-01 | ||
| DE2247067C3 (de) * | 1972-09-26 | 1979-08-09 | Wacker-Chemitronic Gesellschaft Fuer Elektronik-Grundstoffe Mbh, 8263 Burghausen | Verwendung einer Poliersuspension zum schleierfreien Polieren von Halbleiteroberflächen |
| US3888053A (en) * | 1973-05-29 | 1975-06-10 | Rca Corp | Method of shaping semiconductor workpiece |
-
1976
- 1976-03-01 DE DE2608427A patent/DE2608427C2/de not_active Expired
- 1976-12-21 NL NL7614209A patent/NL7614209A/xx not_active Application Discontinuation
-
1977
- 1977-01-20 GB GB2317/77A patent/GB1505488A/en not_active Expired
- 1977-02-07 US US05/766,457 patent/US4300965A/en not_active Expired - Lifetime
- 1977-02-08 CA CA271,285A patent/CA1075579A/en not_active Expired
- 1977-02-25 IT IT48216/77A patent/IT1083481B/it active
- 1977-02-28 FR FR7705766A patent/FR2343330A1/fr active Granted
- 1977-02-28 BE BE175315A patent/BE851892A/xx not_active IP Right Cessation
- 1977-03-01 JP JP2213677A patent/JPS52106683A/ja active Granted
- 1977-03-01 SE SE7702273A patent/SE7702273L/xx not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5641167B2 (enExample) | 1981-09-26 |
| BE851892A (fr) | 1977-08-29 |
| DE2608427C2 (de) | 1984-07-19 |
| GB1505488A (en) | 1978-03-30 |
| FR2343330B1 (enExample) | 1978-10-20 |
| JPS52106683A (en) | 1977-09-07 |
| FR2343330A1 (fr) | 1977-09-30 |
| NL7614209A (nl) | 1977-09-05 |
| IT1083481B (it) | 1985-05-21 |
| US4300965A (en) | 1981-11-17 |
| DE2608427A1 (de) | 1977-09-08 |
| SE7702273L (sv) | 1977-09-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |