DE69032849T2 - Verwendung einer Reinigungsplatte für Halbleiterherstellungsvorrichtung - Google Patents

Verwendung einer Reinigungsplatte für Halbleiterherstellungsvorrichtung

Info

Publication number
DE69032849T2
DE69032849T2 DE69032849T DE69032849T DE69032849T2 DE 69032849 T2 DE69032849 T2 DE 69032849T2 DE 69032849 T DE69032849 T DE 69032849T DE 69032849 T DE69032849 T DE 69032849T DE 69032849 T2 DE69032849 T2 DE 69032849T2
Authority
DE
Germany
Prior art keywords
semiconductor manufacturing
manufacturing device
cleaning plate
cleaning
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69032849T
Other languages
English (en)
Other versions
DE69032849D1 (de
Inventor
Yutaka Kamata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE69032849D1 publication Critical patent/DE69032849D1/de
Application granted granted Critical
Publication of DE69032849T2 publication Critical patent/DE69032849T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
DE69032849T 1989-09-08 1990-09-07 Verwendung einer Reinigungsplatte für Halbleiterherstellungsvorrichtung Expired - Fee Related DE69032849T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23164989A JPH0612784B2 (ja) 1989-09-08 1989-09-08 半導体製造装置クリーニング用基体

Publications (2)

Publication Number Publication Date
DE69032849D1 DE69032849D1 (de) 1999-02-04
DE69032849T2 true DE69032849T2 (de) 1999-06-02

Family

ID=16926808

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69032849T Expired - Fee Related DE69032849T2 (de) 1989-09-08 1990-09-07 Verwendung einer Reinigungsplatte für Halbleiterherstellungsvorrichtung

Country Status (4)

Country Link
EP (1) EP0416645B1 (de)
JP (1) JPH0612784B2 (de)
KR (1) KR930011028B1 (de)
DE (1) DE69032849T2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU6368896A (en) * 1995-07-10 1997-02-10 Precision System Science Co., Ltd. Measuring instrument
US7713356B2 (en) 2000-06-06 2010-05-11 Nitto Denko Corporation Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them
US7793668B2 (en) 2000-06-06 2010-09-14 Nitto Denko Corporation Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them
US20050118414A1 (en) 2002-06-19 2005-06-02 Nitto Denko Corporation Cleaning sheets, transfer member having cleaning function, and method of cleaning substrate-processing apparatus with these
US7718255B2 (en) 2003-08-19 2010-05-18 Nitto Denko Corporation Cleaning sheets and method of cleaning with the same
JP4557229B2 (ja) * 2006-05-30 2010-10-06 日東電工株式会社 クリーニング機能付搬送部材の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61124139A (ja) * 1984-11-21 1986-06-11 Hitachi Ltd 電子素子の製造方法
JPS61242389A (ja) * 1985-04-19 1986-10-28 Hitachi Ltd 電磁記憶デバイスの異物除去方法
JPS61245536A (ja) * 1985-04-24 1986-10-31 Hitachi Ltd 電子素子の製造方法
JPS63124531A (ja) * 1986-11-14 1988-05-28 Hitachi Ltd 平滑面清掃方法
JPH0695508B2 (ja) * 1986-11-28 1994-11-24 大日本スクリ−ン製造株式会社 基板の両面洗浄装置
JPH01135574A (ja) * 1987-11-24 1989-05-29 Osaka Shinku Kogyo Kk 蒸着薄膜形成用基板の清浄方法

Also Published As

Publication number Publication date
JPH0612784B2 (ja) 1994-02-16
EP0416645A3 (en) 1991-04-03
JPH0395951A (ja) 1991-04-22
DE69032849D1 (de) 1999-02-04
KR930011028B1 (ko) 1993-11-19
EP0416645B1 (de) 1998-12-23
KR910007091A (ko) 1991-04-30
EP0416645A2 (de) 1991-03-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee