DE69117480D1 - Sensor für die Kontrolle des Fabrikationsprozesses einer Halbleitervorrichtung - Google Patents
Sensor für die Kontrolle des Fabrikationsprozesses einer HalbleitervorrichtungInfo
- Publication number
- DE69117480D1 DE69117480D1 DE69117480T DE69117480T DE69117480D1 DE 69117480 D1 DE69117480 D1 DE 69117480D1 DE 69117480 T DE69117480 T DE 69117480T DE 69117480 T DE69117480 T DE 69117480T DE 69117480 D1 DE69117480 D1 DE 69117480D1
- Authority
- DE
- Germany
- Prior art keywords
- sensor
- controlling
- semiconductor device
- manufacturing process
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
- G01B11/303—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces using photoelectric detection means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Automation & Control Theory (AREA)
- Mechanical Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Physical Vapour Deposition (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/638,472 US5293216A (en) | 1990-12-31 | 1990-12-31 | Sensor for semiconductor device manufacturing process control |
US07/638,468 US5270222A (en) | 1990-12-31 | 1990-12-31 | Method and apparatus for semiconductor device fabrication diagnosis and prognosis |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69117480D1 true DE69117480D1 (de) | 1996-04-04 |
DE69117480T2 DE69117480T2 (de) | 1996-06-13 |
Family
ID=27093091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1991617480 Expired - Fee Related DE69117480T2 (de) | 1990-12-31 | 1991-12-30 | Sensor für die Kontrolle des Fabrikationsprozesses einer Halbleitervorrichtung |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0493827B1 (de) |
JP (1) | JPH06244261A (de) |
DE (1) | DE69117480T2 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5452953A (en) * | 1993-10-12 | 1995-09-26 | Hughes Aircraft Company | Film thickness measurement of structures containing a scattering surface |
NL9401933A (nl) * | 1994-11-18 | 1996-07-01 | Tno | Documentensorteersysteem voor het sorteren van voor hercirculatie geschikte documenten, in het bijzonder bankbiljetten. |
JP3393035B2 (ja) | 1997-05-06 | 2003-04-07 | 東京エレクトロン株式会社 | 制御装置及び半導体製造装置 |
WO1999066548A1 (de) * | 1998-06-15 | 1999-12-23 | Steag Rtp Systems Gmbh | Verfahren zum bestimmen von parameterverteilungen von objekteigenschaften |
DE19913922C2 (de) * | 1998-06-15 | 2002-10-24 | Steag Rtp Systems Gmbh | Verfahren zum Bestimmen von Parameterverteilungen von Substrateigenschaften |
US6560503B1 (en) * | 1999-10-05 | 2003-05-06 | Advanced Micro Devices, Inc. | Method and apparatus for monitoring controller performance using statistical process control |
US6640151B1 (en) * | 1999-12-22 | 2003-10-28 | Applied Materials, Inc. | Multi-tool control system, method and medium |
US6342134B1 (en) * | 2000-02-11 | 2002-01-29 | Agere Systems Guardian Corp. | Method for producing piezoelectric films with rotating magnetron sputtering system |
EP1271096A1 (de) * | 2001-06-18 | 2003-01-02 | Electronic Systems S.P.A. | Verfahren und Vorrichtung zur Messung der Dicke nichtmetallischer Schichten mit Hilfe einer Halbleiter-Infrarotstrahlungsquelle |
US6985229B2 (en) * | 2002-05-30 | 2006-01-10 | Agere Systems, Inc. | Overlay metrology using scatterometry profiling |
US20050275850A1 (en) * | 2004-05-28 | 2005-12-15 | Timbre Technologies, Inc. | Shape roughness measurement in optical metrology |
JP4757456B2 (ja) * | 2004-07-01 | 2011-08-24 | 芝浦メカトロニクス株式会社 | 真空処理装置 |
WO2007092950A2 (en) * | 2006-02-09 | 2007-08-16 | Kla-Tencor Technologies Corporation | Methods and systems for determining a characteristic of a wafer |
DE102008049774B4 (de) * | 2008-09-30 | 2017-07-27 | Advanced Micro Devices, Inc. | Prozessanlage und Verfahren zur prozessinternen Überwachung der Metallkontamination während der Bearbeitung von Mikrostrukturen |
DE102013006363A1 (de) | 2013-04-12 | 2014-10-30 | Guido Bell | Sensorik für die Unterscheidung von Dünnfilm-Solarmodulen |
EP3495790A1 (de) * | 2017-12-05 | 2019-06-12 | Laser Systems & Solutions of Europe | Vorrichtung und verfahren zur messung der oberflächentemperatur eines substrats |
US20210062324A1 (en) * | 2019-08-30 | 2021-03-04 | Applied Materials, Inc. | Electron beam pvd endpoint detection and closed-loop process control systems |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4511800A (en) * | 1983-03-28 | 1985-04-16 | Rca Corporation | Optical reflectance method for determining the surface roughness of materials in semiconductor processing |
US4707132A (en) * | 1985-08-05 | 1987-11-17 | Dutton G Wayne | Process for sensing defects on a smooth cylindrical interior surface in tubing |
SU1567872A1 (ru) * | 1988-07-14 | 1990-05-30 | Предприятие П/Я А-1891 | Оптический датчик перемещений объекта |
-
1991
- 1991-12-27 JP JP34723391A patent/JPH06244261A/ja active Pending
- 1991-12-30 DE DE1991617480 patent/DE69117480T2/de not_active Expired - Fee Related
- 1991-12-30 EP EP19910122371 patent/EP0493827B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH06244261A (ja) | 1994-09-02 |
EP0493827A3 (en) | 1993-09-29 |
EP0493827B1 (de) | 1996-02-28 |
EP0493827A2 (de) | 1992-07-08 |
DE69117480T2 (de) | 1996-06-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |