DE2415487C3 - Verfahren zur Herstellung von Leiterplatten nach dem Photoätzverfahren - Google Patents

Verfahren zur Herstellung von Leiterplatten nach dem Photoätzverfahren

Info

Publication number
DE2415487C3
DE2415487C3 DE2415487A DE2415487A DE2415487C3 DE 2415487 C3 DE2415487 C3 DE 2415487C3 DE 2415487 A DE2415487 A DE 2415487A DE 2415487 A DE2415487 A DE 2415487A DE 2415487 C3 DE2415487 C3 DE 2415487C3
Authority
DE
Germany
Prior art keywords
protective layer
layer
photosensitive material
acting photosensitive
negative
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2415487A
Other languages
German (de)
English (en)
Other versions
DE2415487A1 (de
DE2415487B2 (de
Inventor
Guenter Dipl.-Ing. 8000 Muenchen Trausch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE2415487A priority Critical patent/DE2415487C3/de
Priority to GB798575A priority patent/GB1453416A/en
Priority to FR7509079A priority patent/FR2266424A1/fr
Priority to IT21559/75A priority patent/IT1034569B/it
Priority to SE7503526A priority patent/SE7503526L/xx
Priority to JP3737475A priority patent/JPS5179268A/ja
Priority to NL7503745A priority patent/NL7503745A/xx
Priority to US05/563,164 priority patent/US3991231A/en
Priority to BE154934A priority patent/BE827368A/xx
Publication of DE2415487A1 publication Critical patent/DE2415487A1/de
Publication of DE2415487B2 publication Critical patent/DE2415487B2/de
Application granted granted Critical
Publication of DE2415487C3 publication Critical patent/DE2415487C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0577—Double layer of resist having the same pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0588—Second resist used as pattern over first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0597—Resist applied over the edges or sides of conductors, e.g. for protection during etching or plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
DE2415487A 1974-03-29 1974-03-29 Verfahren zur Herstellung von Leiterplatten nach dem Photoätzverfahren Expired DE2415487C3 (de)

Priority Applications (9)

Application Number Priority Date Filing Date Title
DE2415487A DE2415487C3 (de) 1974-03-29 1974-03-29 Verfahren zur Herstellung von Leiterplatten nach dem Photoätzverfahren
GB798575A GB1453416A (en) 1974-03-29 1975-02-26 Production of printed circuit boards
IT21559/75A IT1034569B (it) 1974-03-29 1975-03-24 Procedimento per fabbricare piastre circuit ali con il processo di fotoincisione
FR7509079A FR2266424A1 (enExample) 1974-03-29 1975-03-24
SE7503526A SE7503526L (enExample) 1974-03-29 1975-03-26
JP3737475A JPS5179268A (en) 1974-03-29 1975-03-27 Hotoetsuchingunyoru dotaibankozono seizohoho
NL7503745A NL7503745A (nl) 1974-03-29 1975-03-27 Werkwijze voor de vervaardiging van geleidings- platen volgens het foto-etsprocede.
US05/563,164 US3991231A (en) 1974-03-29 1975-03-28 Process for the production of circuit boards by a photo-etching method
BE154934A BE827368A (fr) 1974-03-29 1975-03-28 Procede pour la fabrication de plaques a circuits imprimes selon le procede de photogravure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2415487A DE2415487C3 (de) 1974-03-29 1974-03-29 Verfahren zur Herstellung von Leiterplatten nach dem Photoätzverfahren

Publications (3)

Publication Number Publication Date
DE2415487A1 DE2415487A1 (de) 1975-10-16
DE2415487B2 DE2415487B2 (de) 1977-09-01
DE2415487C3 true DE2415487C3 (de) 1978-04-27

Family

ID=5911684

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2415487A Expired DE2415487C3 (de) 1974-03-29 1974-03-29 Verfahren zur Herstellung von Leiterplatten nach dem Photoätzverfahren

Country Status (9)

Country Link
US (1) US3991231A (enExample)
JP (1) JPS5179268A (enExample)
BE (1) BE827368A (enExample)
DE (1) DE2415487C3 (enExample)
FR (1) FR2266424A1 (enExample)
GB (1) GB1453416A (enExample)
IT (1) IT1034569B (enExample)
NL (1) NL7503745A (enExample)
SE (1) SE7503526L (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52117556A (en) * 1976-03-30 1977-10-03 Toshiba Corp Photo mask and its manufacturing method
JPS52136590A (en) * 1976-05-11 1977-11-15 Matsushita Electric Ind Co Ltd Production of semiconductor device
JPS5334484A (en) * 1976-09-10 1978-03-31 Toshiba Corp Forming method for multi layer wiring
US4307179A (en) * 1980-07-03 1981-12-22 International Business Machines Corporation Planar metal interconnection system and process
US4526859A (en) * 1983-12-12 1985-07-02 International Business Machines Corporation Metallization of a ceramic substrate
JPS62209210A (ja) * 1986-03-07 1987-09-14 Nippon Cable Syst Inc 操作用ワイヤの張力調節装置
JPS6435985A (en) * 1987-07-30 1989-02-07 Mitsubishi Electric Corp Manufacture of printed board
JPH0476985A (ja) * 1990-07-18 1992-03-11 Cmk Corp プリント配線板の製造法
EP0530564A1 (de) * 1991-09-05 1993-03-10 Siemens Aktiengesellschaft Verfahren zur Herstellung von Leiterplatten
US6162365A (en) * 1998-03-04 2000-12-19 International Business Machines Corporation Pd etch mask for copper circuitization
US6409312B1 (en) 2001-03-27 2002-06-25 Lexmark International, Inc. Ink jet printer nozzle plate and process therefor
US7375033B2 (en) * 2003-11-14 2008-05-20 Micron Technology, Inc. Multi-layer interconnect with isolation layer
KR101089986B1 (ko) * 2009-12-24 2011-12-05 삼성전기주식회사 캐리어기판, 그의 제조방법, 이를 이용한 인쇄회로기판 및 그의 제조방법
TWI719241B (zh) * 2017-08-18 2021-02-21 景碩科技股份有限公司 可做電性測試的多層電路板及其製法
CN112020229A (zh) * 2019-05-28 2020-12-01 庆鼎精密电子（淮安）有限公司 电路板的制作方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3666549A (en) * 1969-05-09 1972-05-30 Macdermid Inc Method of making additive printed circuit boards and product thereof
NL167277C (nl) * 1970-08-29 1981-11-16 Philips Nv Halfgeleiderinrichting met een plaatvorming half- geleiderlichaam met over althans een deel van de dikte van het halfgeleiderlichaam afgeschuinde randen, dat is voorzien van een metalen elektrode die een gelijkrichtende overgang vormt met het halfgeleider- lichaam en werkwijze ter vervaardiging van de halfgeleiderinrichting.
US3737314A (en) * 1972-02-29 1973-06-05 Ncr Co Manufacture of printing elements by a photoresist chemical etching system

Also Published As

Publication number Publication date
GB1453416A (en) 1976-10-20
BE827368A (fr) 1975-07-16
SE7503526L (enExample) 1975-09-30
DE2415487A1 (de) 1975-10-16
JPS5179268A (en) 1976-07-10
DE2415487B2 (de) 1977-09-01
NL7503745A (nl) 1975-10-01
US3991231A (en) 1976-11-09
IT1034569B (it) 1979-10-10
FR2266424A1 (enExample) 1975-10-24

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
EHJ Ceased/non-payment of the annual fee