GB1453416A - Production of printed circuit boards - Google Patents

Production of printed circuit boards

Info

Publication number
GB1453416A
GB1453416A GB798575A GB798575A GB1453416A GB 1453416 A GB1453416 A GB 1453416A GB 798575 A GB798575 A GB 798575A GB 798575 A GB798575 A GB 798575A GB 1453416 A GB1453416 A GB 1453416A
Authority
GB
United Kingdom
Prior art keywords
layer
foil
exposed
mask
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB798575A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of GB1453416A publication Critical patent/GB1453416A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0577—Double layer of resist having the same pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0588—Second resist used as pattern over first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0597—Resist applied over the edges or sides of conductors, e.g. for protection during etching or plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
GB798575A 1974-03-29 1975-02-26 Production of printed circuit boards Expired GB1453416A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2415487A DE2415487C3 (de) 1974-03-29 1974-03-29 Verfahren zur Herstellung von Leiterplatten nach dem Photoätzverfahren

Publications (1)

Publication Number Publication Date
GB1453416A true GB1453416A (en) 1976-10-20

Family

ID=5911684

Family Applications (1)

Application Number Title Priority Date Filing Date
GB798575A Expired GB1453416A (en) 1974-03-29 1975-02-26 Production of printed circuit boards

Country Status (9)

Country Link
US (1) US3991231A (enExample)
JP (1) JPS5179268A (enExample)
BE (1) BE827368A (enExample)
DE (1) DE2415487C3 (enExample)
FR (1) FR2266424A1 (enExample)
GB (1) GB1453416A (enExample)
IT (1) IT1034569B (enExample)
NL (1) NL7503745A (enExample)
SE (1) SE7503526L (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2247784A (en) * 1990-07-18 1992-03-11 Nippon Cmk Kk P.C.B. Manufacture with electrodeposited resist

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52117556A (en) * 1976-03-30 1977-10-03 Toshiba Corp Photo mask and its manufacturing method
JPS52136590A (en) * 1976-05-11 1977-11-15 Matsushita Electric Ind Co Ltd Production of semiconductor device
JPS5334484A (en) * 1976-09-10 1978-03-31 Toshiba Corp Forming method for multi layer wiring
US4307179A (en) * 1980-07-03 1981-12-22 International Business Machines Corporation Planar metal interconnection system and process
US4526859A (en) * 1983-12-12 1985-07-02 International Business Machines Corporation Metallization of a ceramic substrate
JPS62209210A (ja) * 1986-03-07 1987-09-14 Nippon Cable Syst Inc 操作用ワイヤの張力調節装置
JPS6435985A (en) * 1987-07-30 1989-02-07 Mitsubishi Electric Corp Manufacture of printed board
EP0530564A1 (de) * 1991-09-05 1993-03-10 Siemens Aktiengesellschaft Verfahren zur Herstellung von Leiterplatten
US6162365A (en) * 1998-03-04 2000-12-19 International Business Machines Corporation Pd etch mask for copper circuitization
US6409312B1 (en) 2001-03-27 2002-06-25 Lexmark International, Inc. Ink jet printer nozzle plate and process therefor
US7375033B2 (en) * 2003-11-14 2008-05-20 Micron Technology, Inc. Multi-layer interconnect with isolation layer
KR101089986B1 (ko) * 2009-12-24 2011-12-05 삼성전기주식회사 캐리어기판, 그의 제조방법, 이를 이용한 인쇄회로기판 및 그의 제조방법
TWI719241B (zh) * 2017-08-18 2021-02-21 景碩科技股份有限公司 可做電性測試的多層電路板及其製法
CN112020229A (zh) * 2019-05-28 2020-12-01 庆鼎精密电子（淮安）有限公司 电路板的制作方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3666549A (en) * 1969-05-09 1972-05-30 Macdermid Inc Method of making additive printed circuit boards and product thereof
NL167277C (nl) * 1970-08-29 1981-11-16 Philips Nv Halfgeleiderinrichting met een plaatvorming half- geleiderlichaam met over althans een deel van de dikte van het halfgeleiderlichaam afgeschuinde randen, dat is voorzien van een metalen elektrode die een gelijkrichtende overgang vormt met het halfgeleider- lichaam en werkwijze ter vervaardiging van de halfgeleiderinrichting.
US3737314A (en) * 1972-02-29 1973-06-05 Ncr Co Manufacture of printing elements by a photoresist chemical etching system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2247784A (en) * 1990-07-18 1992-03-11 Nippon Cmk Kk P.C.B. Manufacture with electrodeposited resist

Also Published As

Publication number Publication date
BE827368A (fr) 1975-07-16
SE7503526L (enExample) 1975-09-30
DE2415487A1 (de) 1975-10-16
JPS5179268A (en) 1976-07-10
DE2415487B2 (de) 1977-09-01
DE2415487C3 (de) 1978-04-27
NL7503745A (nl) 1975-10-01
US3991231A (en) 1976-11-09
IT1034569B (it) 1979-10-10
FR2266424A1 (enExample) 1975-10-24

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee