SE7503526L - - Google Patents

Info

Publication number
SE7503526L
SE7503526L SE7503526A SE7503526A SE7503526L SE 7503526 L SE7503526 L SE 7503526L SE 7503526 A SE7503526 A SE 7503526A SE 7503526 A SE7503526 A SE 7503526A SE 7503526 L SE7503526 L SE 7503526L
Authority
SE
Sweden
Application number
SE7503526A
Inventor
G Trausch
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of SE7503526L publication Critical patent/SE7503526L/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0577—Double layer of resist having the same pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0588—Second resist used as pattern over first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0597—Resist applied over the edges or sides of conductors, e.g. for protection during etching or plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
SE7503526A 1974-03-29 1975-03-26 SE7503526L (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2415487A DE2415487C3 (de) 1974-03-29 1974-03-29 Verfahren zur Herstellung von Leiterplatten nach dem Photoätzverfahren

Publications (1)

Publication Number Publication Date
SE7503526L true SE7503526L (xx) 1975-09-30

Family

ID=5911684

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7503526A SE7503526L (xx) 1974-03-29 1975-03-26

Country Status (9)

Country Link
US (1) US3991231A (xx)
JP (1) JPS5179268A (xx)
BE (1) BE827368A (xx)
DE (1) DE2415487C3 (xx)
FR (1) FR2266424A1 (xx)
GB (1) GB1453416A (xx)
IT (1) IT1034569B (xx)
NL (1) NL7503745A (xx)
SE (1) SE7503526L (xx)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52117556A (en) * 1976-03-30 1977-10-03 Toshiba Corp Photo mask and its manufacturing method
JPS52136590A (en) * 1976-05-11 1977-11-15 Matsushita Electric Ind Co Ltd Production of semiconductor device
JPS5334484A (en) * 1976-09-10 1978-03-31 Toshiba Corp Forming method for multi layer wiring
US4307179A (en) * 1980-07-03 1981-12-22 International Business Machines Corporation Planar metal interconnection system and process
US4526859A (en) * 1983-12-12 1985-07-02 International Business Machines Corporation Metallization of a ceramic substrate
JPS62209210A (ja) * 1986-03-07 1987-09-14 Nippon Cable Syst Inc 操作用ワイヤの張力調節装置
JPS6435985A (en) * 1987-07-30 1989-02-07 Mitsubishi Electric Corp Manufacture of printed board
JPH0476985A (ja) * 1990-07-18 1992-03-11 Cmk Corp プリント配線板の製造法
EP0530564A1 (de) * 1991-09-05 1993-03-10 Siemens Aktiengesellschaft Verfahren zur Herstellung von Leiterplatten
US6162365A (en) * 1998-03-04 2000-12-19 International Business Machines Corporation Pd etch mask for copper circuitization
US6409312B1 (en) 2001-03-27 2002-06-25 Lexmark International, Inc. Ink jet printer nozzle plate and process therefor
US7375033B2 (en) * 2003-11-14 2008-05-20 Micron Technology, Inc. Multi-layer interconnect with isolation layer
KR101089986B1 (ko) * 2009-12-24 2011-12-05 삼성전기주식회사 캐리어기판, 그의 제조방법, 이를 이용한 인쇄회로기판 및 그의 제조방법
TWI719241B (zh) * 2017-08-18 2021-02-21 景碩科技股份有限公司 可做電性測試的多層電路板及其製法
CN112020229A (zh) * 2019-05-28 2020-12-01 庆鼎精密电子（淮安）有限公司 电路板的制作方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3666549A (en) * 1969-05-09 1972-05-30 Macdermid Inc Method of making additive printed circuit boards and product thereof
NL167277C (nl) * 1970-08-29 1981-11-16 Philips Nv Halfgeleiderinrichting met een plaatvorming half- geleiderlichaam met over althans een deel van de dikte van het halfgeleiderlichaam afgeschuinde randen, dat is voorzien van een metalen elektrode die een gelijkrichtende overgang vormt met het halfgeleider- lichaam en werkwijze ter vervaardiging van de halfgeleiderinrichting.
US3737314A (en) * 1972-02-29 1973-06-05 Ncr Co Manufacture of printing elements by a photoresist chemical etching system

Also Published As

Publication number Publication date
DE2415487B2 (de) 1977-09-01
DE2415487C3 (de) 1978-04-27
IT1034569B (it) 1979-10-10
FR2266424A1 (xx) 1975-10-24
GB1453416A (en) 1976-10-20
US3991231A (en) 1976-11-09
NL7503745A (nl) 1975-10-01
DE2415487A1 (de) 1975-10-16
JPS5179268A (en) 1976-07-10
BE827368A (fr) 1975-07-16

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