DE2249878A1 - Verfahren zur herstellung feiner leiterbahnstrukturen auf einem keramiksubstrat - Google Patents
Verfahren zur herstellung feiner leiterbahnstrukturen auf einem keramiksubstratInfo
- Publication number
- DE2249878A1 DE2249878A1 DE19722249878 DE2249878A DE2249878A1 DE 2249878 A1 DE2249878 A1 DE 2249878A1 DE 19722249878 DE19722249878 DE 19722249878 DE 2249878 A DE2249878 A DE 2249878A DE 2249878 A1 DE2249878 A1 DE 2249878A1
- Authority
- DE
- Germany
- Prior art keywords
- ceramic substrate
- conductor track
- parts
- raised
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims description 41
- 239000004020 conductor Substances 0.000 title claims description 38
- 239000000758 substrate Substances 0.000 title claims description 34
- 238000000034 method Methods 0.000 title claims description 19
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 238000001465 metallisation Methods 0.000 claims description 9
- 239000006185 dispersion Substances 0.000 claims description 8
- 238000004049 embossing Methods 0.000 claims description 8
- 238000005488 sandblasting Methods 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 238000007740 vapor deposition Methods 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 238000010304 firing Methods 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 229910001338 liquidmetal Inorganic materials 0.000 claims description 3
- 235000011837 pasties Nutrition 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 239000002966 varnish Substances 0.000 claims description 2
- 239000004922 lacquer Substances 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- 238000010410 dusting Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000003870 refractory metal Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009760 electrical discharge machining Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/054—Continuous temporary metal layer over resist, e.g. for selective electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/045—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/146—By vapour deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19722249878 DE2249878A1 (de) | 1972-10-11 | 1972-10-11 | Verfahren zur herstellung feiner leiterbahnstrukturen auf einem keramiksubstrat |
| GB3736273A GB1404697A (en) | 1972-10-11 | 1973-08-07 | Production of fine conductor path structures on ceramic substrates |
| FR7335874A FR2203258A1 (enExample) | 1972-10-11 | 1973-10-08 | |
| LU68577D LU68577A1 (enExample) | 1972-10-11 | 1973-10-09 | |
| NL7313954A NL7313954A (enExample) | 1972-10-11 | 1973-10-10 | |
| IT2994973A IT995738B (it) | 1972-10-11 | 1973-10-10 | Procedimento per formare fini strutture di piste conduttrici su un substrato di ceramica |
| JP11433673A JPS4973669A (enExample) | 1972-10-11 | 1973-10-11 | |
| BE136578A BE805951A (fr) | 1972-10-11 | 1973-10-11 | Procede pour realiser des structures fines de voies conductrices sur un substrat en ceramique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19722249878 DE2249878A1 (de) | 1972-10-11 | 1972-10-11 | Verfahren zur herstellung feiner leiterbahnstrukturen auf einem keramiksubstrat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2249878A1 true DE2249878A1 (de) | 1974-04-18 |
Family
ID=5858760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19722249878 Pending DE2249878A1 (de) | 1972-10-11 | 1972-10-11 | Verfahren zur herstellung feiner leiterbahnstrukturen auf einem keramiksubstrat |
Country Status (8)
| Country | Link |
|---|---|
| JP (1) | JPS4973669A (enExample) |
| BE (1) | BE805951A (enExample) |
| DE (1) | DE2249878A1 (enExample) |
| FR (1) | FR2203258A1 (enExample) |
| GB (1) | GB1404697A (enExample) |
| IT (1) | IT995738B (enExample) |
| LU (1) | LU68577A1 (enExample) |
| NL (1) | NL7313954A (enExample) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3023905A1 (de) * | 1980-06-26 | 1982-01-14 | Adam Opel AG, 6090 Rüsselsheim | Armaturentafel fuer fahrzeuge, insbesondere kraftfahrzeuge, und verfahren zur herstellung einer solchen |
| EP0138672A3 (en) * | 1983-09-21 | 1986-07-30 | Allied Corporation | Method of making a printed circuit board |
| EP0138673A3 (en) * | 1983-09-21 | 1986-07-30 | Allied Corporation | Method of making a printed circuit board |
| EP0138671A3 (en) * | 1983-09-21 | 1986-08-06 | Allied Corporation | Method of making a printed circuit board |
| DE3507341A1 (de) * | 1982-12-06 | 1986-09-04 | Fine Particle Technology Corp., Camarillo, Calif. | Verfahren zum bilden von elektrisch-leitenden bahnen auf einem substrat |
| EP0146241A3 (en) * | 1983-12-19 | 1987-01-07 | Kabushiki Kaisha Toshiba | Circuit board |
| DE3821121A1 (de) * | 1988-06-23 | 1990-02-08 | Ullmann Ulo Werk | Verfahren zur herstellung von kontakttraegerkoerpern |
| EP0289137A3 (en) * | 1987-03-27 | 1990-07-25 | Fujitsu Limited | Manufacturing printed-circuit components |
| EP1360645A1 (en) * | 2001-02-02 | 2003-11-12 | SCHLUMBERGER Systèmes | Portable object with chip and antenna |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55165698A (en) * | 1979-06-11 | 1980-12-24 | Cho Lsi Gijutsu Kenkyu Kumiai | Multilayer integrated circuit board |
| JPS5785289A (en) * | 1980-11-17 | 1982-05-27 | Fujitsu Ltd | Method of producing ceramic printed board |
| GB2124037B (en) * | 1982-07-19 | 1986-02-26 | Gen Electric Co Plc | Methods of forming patterns on substrates |
| US4604799A (en) * | 1982-09-03 | 1986-08-12 | John Fluke Mfg. Co., Inc. | Method of making molded circuit board |
| US5094811A (en) * | 1983-09-21 | 1992-03-10 | Allied-Signal | Method of making a printed circuit board |
| US4614837A (en) * | 1985-04-03 | 1986-09-30 | Allied Corporation | Method for placing electrically conductive paths on a substrate |
| GB2212332A (en) * | 1987-11-11 | 1989-07-19 | Gen Electric Co Plc | Fabrication of electrical circuits |
| GB2374205B (en) | 2001-04-04 | 2004-12-22 | Rolls Royce Plc | An electrical conductor winding and a method of manufacturing an electrical conductor winding |
| JP2006066637A (ja) * | 2004-08-26 | 2006-03-09 | Murata Mfg Co Ltd | セラミック多層基板の製造方法およびそれに用いられる押し型 |
| CN109974305B (zh) * | 2017-12-28 | 2022-09-16 | 武汉海尔热水器有限公司 | 一种外壳及电热水器 |
| CN112643899A (zh) * | 2020-12-16 | 2021-04-13 | 南京缔邦新材料科技有限公司 | 一种陶瓷覆铜板的细电路切割方法 |
-
1972
- 1972-10-11 DE DE19722249878 patent/DE2249878A1/de active Pending
-
1973
- 1973-08-07 GB GB3736273A patent/GB1404697A/en not_active Expired
- 1973-10-08 FR FR7335874A patent/FR2203258A1/fr not_active Withdrawn
- 1973-10-09 LU LU68577D patent/LU68577A1/xx unknown
- 1973-10-10 NL NL7313954A patent/NL7313954A/xx unknown
- 1973-10-10 IT IT2994973A patent/IT995738B/it active
- 1973-10-11 BE BE136578A patent/BE805951A/xx unknown
- 1973-10-11 JP JP11433673A patent/JPS4973669A/ja active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3023905A1 (de) * | 1980-06-26 | 1982-01-14 | Adam Opel AG, 6090 Rüsselsheim | Armaturentafel fuer fahrzeuge, insbesondere kraftfahrzeuge, und verfahren zur herstellung einer solchen |
| DE3507341A1 (de) * | 1982-12-06 | 1986-09-04 | Fine Particle Technology Corp., Camarillo, Calif. | Verfahren zum bilden von elektrisch-leitenden bahnen auf einem substrat |
| EP0138672A3 (en) * | 1983-09-21 | 1986-07-30 | Allied Corporation | Method of making a printed circuit board |
| EP0138673A3 (en) * | 1983-09-21 | 1986-07-30 | Allied Corporation | Method of making a printed circuit board |
| EP0138671A3 (en) * | 1983-09-21 | 1986-08-06 | Allied Corporation | Method of making a printed circuit board |
| EP0146241A3 (en) * | 1983-12-19 | 1987-01-07 | Kabushiki Kaisha Toshiba | Circuit board |
| EP0289137A3 (en) * | 1987-03-27 | 1990-07-25 | Fujitsu Limited | Manufacturing printed-circuit components |
| DE3821121A1 (de) * | 1988-06-23 | 1990-02-08 | Ullmann Ulo Werk | Verfahren zur herstellung von kontakttraegerkoerpern |
| EP1360645A1 (en) * | 2001-02-02 | 2003-11-12 | SCHLUMBERGER Systèmes | Portable object with chip and antenna |
Also Published As
| Publication number | Publication date |
|---|---|
| IT995738B (it) | 1975-11-20 |
| GB1404697A (en) | 1975-09-03 |
| BE805951A (fr) | 1974-02-01 |
| JPS4973669A (enExample) | 1974-07-16 |
| NL7313954A (enExample) | 1974-04-16 |
| LU68577A1 (enExample) | 1973-12-14 |
| FR2203258A1 (enExample) | 1974-05-10 |
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