GB1404697A - Production of fine conductor path structures on ceramic substrates - Google Patents
Production of fine conductor path structures on ceramic substratesInfo
- Publication number
- GB1404697A GB1404697A GB3736273A GB3736273A GB1404697A GB 1404697 A GB1404697 A GB 1404697A GB 3736273 A GB3736273 A GB 3736273A GB 3736273 A GB3736273 A GB 3736273A GB 1404697 A GB1404697 A GB 1404697A
- Authority
- GB
- United Kingdom
- Prior art keywords
- film
- lacquer
- firing
- metal
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/054—Continuous temporary metal layer over resist, e.g. for selective electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/045—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/146—By vapour deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
1404697 Printed circuits SIEMENS AG 7 Aug 1973 [11 Oct 1972] 37362/73 Heading H1R [Also in Division B6] A method of producing an electrical conductor path in a predetermined pattern on a ceramic substrate comprises producing the pattern in intaglio or relief on the surface of an unfired ceramic substrate by embossing, subsequently firing the substrate, and metallizing the raised or recessed parts forming the pattern either before, during or after firing. The recessed parts may be filled before or after firing with a pasty metal dispersion which is then sintered, any metal present on the raised parts being removed by an abrasive process such as sandblasting or grinding. Alternatively the entire surface may be coated with a thin metal film by applying a liquid metal dispersion by vapour deposition, atomization or spraying, the raised parts of the film are coated with lacquer resistant to electrolytic baths, and the exposed metal reinforced by electrolysis, the lacquer then being removed and the film removed from the raised parts by etching or sand-blasting. The resistant lacquer may be replaced by a solder stop lacquer and the exposed metal reinforced by coating with tin. If a refractory metal dispersion, e.g. molybdenum, uranium or platinum, is used for the film, the conductor paths can be produced in the form of metals having a high melting point, after the film on the raised parts has been removed, and sintering can be carried out simultaneously with firing. If the pattern is produced in relief, metallization can be carried out by rolling a metal dispersion, or by covering the recessed areas with a protective lacquer and then metallizing by vapour deposition or atomization, which may be followed by electrolytic reinforcement.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19722249878 DE2249878A1 (en) | 1972-10-11 | 1972-10-11 | METHOD FOR MANUFACTURING FINE CONDUCTOR TRACK STRUCTURES ON A CERAMIC SUBSTRATE |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1404697A true GB1404697A (en) | 1975-09-03 |
Family
ID=5858760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB3736273A Expired GB1404697A (en) | 1972-10-11 | 1973-08-07 | Production of fine conductor path structures on ceramic substrates |
Country Status (8)
Country | Link |
---|---|
JP (1) | JPS4973669A (en) |
BE (1) | BE805951A (en) |
DE (1) | DE2249878A1 (en) |
FR (1) | FR2203258A1 (en) |
GB (1) | GB1404697A (en) |
IT (1) | IT995738B (en) |
LU (1) | LU68577A1 (en) |
NL (1) | NL7313954A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2124037A (en) * | 1982-07-19 | 1984-02-08 | Gen Electric Co Plc | Methods of forming patterns on substrates |
GB2126428A (en) * | 1982-09-03 | 1984-03-21 | Fluke Mfg Co Inc | Molded circuit board and manufacturing method therefor |
GB2212332A (en) * | 1987-11-11 | 1989-07-19 | Gen Electric Co Plc | Fabrication of electrical circuits |
US5094811A (en) * | 1983-09-21 | 1992-03-10 | Allied-Signal | Method of making a printed circuit board |
GB2374205A (en) * | 2001-04-04 | 2002-10-09 | Rolls Royce Plc | An electrical conductor winding and a method of manufacturing an electrical conductor winding |
CN109974305A (en) * | 2017-12-28 | 2019-07-05 | 武汉海尔热水器有限公司 | Shell and electric water heater |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55165698A (en) * | 1979-06-11 | 1980-12-24 | Cho Lsi Gijutsu Kenkyu Kumiai | Multilayer integrated circuit board |
DE3023905C2 (en) * | 1980-06-26 | 1982-09-09 | Adam Opel AG, 6090 Rüsselsheim | Instrument panel for vehicles, in particular motor vehicles, and methods for producing the same |
JPS5785289A (en) * | 1980-11-17 | 1982-05-27 | Fujitsu Ltd | Method of producing ceramic printed board |
DE3507341A1 (en) * | 1982-12-06 | 1986-09-04 | Fine Particle Technology Corp., Camarillo, Calif. | Method for forming electrically conductive tracks on a substrate |
JPS60502233A (en) * | 1983-09-21 | 1985-12-19 | アライド コ−ポレイシヨン | Printed board manufacturing method |
JPS60502282A (en) * | 1983-09-21 | 1985-12-26 | アライド コ−ポレイシヨン | Printed circuit board manufacturing method |
WO1985001414A1 (en) * | 1983-09-21 | 1985-03-28 | Allied Corporation | Method of making a printed circuit board |
JPS60137092A (en) * | 1983-12-19 | 1985-07-20 | 株式会社東芝 | Circuit board |
US4614837A (en) * | 1985-04-03 | 1986-09-30 | Allied Corporation | Method for placing electrically conductive paths on a substrate |
JPS63240096A (en) * | 1987-03-27 | 1988-10-05 | 富士通株式会社 | Method of forming multilayer green sheet |
DE3821121A1 (en) * | 1988-06-23 | 1990-02-08 | Ullmann Ulo Werk | Method of manufacture of contact carriers |
FR2820548A1 (en) * | 2001-02-02 | 2002-08-09 | Schlumberger Systems & Service | PORTABLE CHIP AND ANTENNA OBJECT, MODULE FOR FORMING PORTABLE CHIP AND ANTENNA OBJECT AND METHODS OF MAKING SAME |
JP2006066637A (en) * | 2004-08-26 | 2006-03-09 | Murata Mfg Co Ltd | Manufacturing method of ceramic multilayer substrate and pressing die used therefor |
CN112643899A (en) * | 2020-12-16 | 2021-04-13 | 南京缔邦新材料科技有限公司 | Fine circuit cutting method for ceramic copper-clad plate |
-
1972
- 1972-10-11 DE DE19722249878 patent/DE2249878A1/en active Pending
-
1973
- 1973-08-07 GB GB3736273A patent/GB1404697A/en not_active Expired
- 1973-10-08 FR FR7335874A patent/FR2203258A1/fr not_active Withdrawn
- 1973-10-09 LU LU68577D patent/LU68577A1/xx unknown
- 1973-10-10 IT IT2994973A patent/IT995738B/en active
- 1973-10-10 NL NL7313954A patent/NL7313954A/xx unknown
- 1973-10-11 JP JP11433673A patent/JPS4973669A/ja active Pending
- 1973-10-11 BE BE136578A patent/BE805951A/en unknown
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2124037A (en) * | 1982-07-19 | 1984-02-08 | Gen Electric Co Plc | Methods of forming patterns on substrates |
GB2126428A (en) * | 1982-09-03 | 1984-03-21 | Fluke Mfg Co Inc | Molded circuit board and manufacturing method therefor |
US4604799A (en) * | 1982-09-03 | 1986-08-12 | John Fluke Mfg. Co., Inc. | Method of making molded circuit board |
US5094811A (en) * | 1983-09-21 | 1992-03-10 | Allied-Signal | Method of making a printed circuit board |
GB2212332A (en) * | 1987-11-11 | 1989-07-19 | Gen Electric Co Plc | Fabrication of electrical circuits |
GB2374205A (en) * | 2001-04-04 | 2002-10-09 | Rolls Royce Plc | An electrical conductor winding and a method of manufacturing an electrical conductor winding |
US6680667B2 (en) | 2001-04-04 | 2004-01-20 | Rolls-Royce Plc | Electrical conductor winding and a method of manufacturing an electrical conductor winding |
GB2374205B (en) * | 2001-04-04 | 2004-12-22 | Rolls Royce Plc | An electrical conductor winding and a method of manufacturing an electrical conductor winding |
CN109974305A (en) * | 2017-12-28 | 2019-07-05 | 武汉海尔热水器有限公司 | Shell and electric water heater |
Also Published As
Publication number | Publication date |
---|---|
DE2249878A1 (en) | 1974-04-18 |
NL7313954A (en) | 1974-04-16 |
IT995738B (en) | 1975-11-20 |
JPS4973669A (en) | 1974-07-16 |
BE805951A (en) | 1974-02-01 |
FR2203258A1 (en) | 1974-05-10 |
LU68577A1 (en) | 1973-12-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PLNP | Patent lapsed through nonpayment of renewal fees |