GB1404697A - Production of fine conductor path structures on ceramic substrates - Google Patents
Production of fine conductor path structures on ceramic substratesInfo
- Publication number
- GB1404697A GB1404697A GB3736273A GB3736273A GB1404697A GB 1404697 A GB1404697 A GB 1404697A GB 3736273 A GB3736273 A GB 3736273A GB 3736273 A GB3736273 A GB 3736273A GB 1404697 A GB1404697 A GB 1404697A
- Authority
- GB
- United Kingdom
- Prior art keywords
- film
- lacquer
- firing
- metal
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 title abstract 4
- 239000000919 ceramic Substances 0.000 title abstract 3
- 239000004020 conductor Substances 0.000 title abstract 3
- 229910052751 metal Inorganic materials 0.000 abstract 7
- 239000002184 metal Substances 0.000 abstract 7
- 239000004922 lacquer Substances 0.000 abstract 5
- 239000006185 dispersion Substances 0.000 abstract 4
- 238000010304 firing Methods 0.000 abstract 4
- 238000000889 atomisation Methods 0.000 abstract 2
- 238000000151 deposition Methods 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract 2
- 238000005488 sandblasting Methods 0.000 abstract 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- 229910052770 Uranium Inorganic materials 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000005868 electrolysis reaction Methods 0.000 abstract 1
- 238000004049 embossing Methods 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 238000000227 grinding Methods 0.000 abstract 1
- 229910001338 liquidmetal Inorganic materials 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 238000001465 metallisation Methods 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 229910052750 molybdenum Inorganic materials 0.000 abstract 1
- 239000011733 molybdenum Substances 0.000 abstract 1
- 235000011837 pasties Nutrition 0.000 abstract 1
- 229910052697 platinum Inorganic materials 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- 239000003870 refractory metal Substances 0.000 abstract 1
- 230000002787 reinforcement Effects 0.000 abstract 1
- 238000005096 rolling process Methods 0.000 abstract 1
- 238000005245 sintering Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 238000005507 spraying Methods 0.000 abstract 1
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/054—Continuous temporary metal layer over resist, e.g. for selective electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/045—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/146—By vapour deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19722249878 DE2249878A1 (de) | 1972-10-11 | 1972-10-11 | Verfahren zur herstellung feiner leiterbahnstrukturen auf einem keramiksubstrat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1404697A true GB1404697A (en) | 1975-09-03 |
Family
ID=5858760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB3736273A Expired GB1404697A (en) | 1972-10-11 | 1973-08-07 | Production of fine conductor path structures on ceramic substrates |
Country Status (8)
| Country | Link |
|---|---|
| JP (1) | JPS4973669A (enExample) |
| BE (1) | BE805951A (enExample) |
| DE (1) | DE2249878A1 (enExample) |
| FR (1) | FR2203258A1 (enExample) |
| GB (1) | GB1404697A (enExample) |
| IT (1) | IT995738B (enExample) |
| LU (1) | LU68577A1 (enExample) |
| NL (1) | NL7313954A (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2124037A (en) * | 1982-07-19 | 1984-02-08 | Gen Electric Co Plc | Methods of forming patterns on substrates |
| GB2126428A (en) * | 1982-09-03 | 1984-03-21 | Fluke Mfg Co Inc | Molded circuit board and manufacturing method therefor |
| GB2212332A (en) * | 1987-11-11 | 1989-07-19 | Gen Electric Co Plc | Fabrication of electrical circuits |
| US5094811A (en) * | 1983-09-21 | 1992-03-10 | Allied-Signal | Method of making a printed circuit board |
| GB2374205A (en) * | 2001-04-04 | 2002-10-09 | Rolls Royce Plc | An electrical conductor winding and a method of manufacturing an electrical conductor winding |
| CN109974305A (zh) * | 2017-12-28 | 2019-07-05 | 武汉海尔热水器有限公司 | 一种外壳及电热水器 |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55165698A (en) * | 1979-06-11 | 1980-12-24 | Cho Lsi Gijutsu Kenkyu Kumiai | Multilayer integrated circuit board |
| DE3023905C2 (de) * | 1980-06-26 | 1982-09-09 | Adam Opel AG, 6090 Rüsselsheim | Armaturentafel für Fahrzeuge, insbesondere Kraftfahrzeuge, und Verfahren zur Herstellung einer solchen |
| JPS5785289A (en) * | 1980-11-17 | 1982-05-27 | Fujitsu Ltd | Method of producing ceramic printed board |
| DE3507341A1 (de) * | 1982-12-06 | 1986-09-04 | Fine Particle Technology Corp., Camarillo, Calif. | Verfahren zum bilden von elektrisch-leitenden bahnen auf einem substrat |
| KR850700098A (ko) * | 1983-09-21 | 1985-10-21 | 로이 에이취.맷신길 | 인쇄회로판 제조방법 |
| JPS60502233A (ja) * | 1983-09-21 | 1985-12-19 | アライド コ−ポレイシヨン | プリント板の製造方法 |
| WO1985001414A1 (en) * | 1983-09-21 | 1985-03-28 | Allied Corporation | Method of making a printed circuit board |
| JPS60137092A (ja) * | 1983-12-19 | 1985-07-20 | 株式会社東芝 | 回路基板の製造方法 |
| US4614837A (en) * | 1985-04-03 | 1986-09-30 | Allied Corporation | Method for placing electrically conductive paths on a substrate |
| JPS63240096A (ja) * | 1987-03-27 | 1988-10-05 | 富士通株式会社 | グリ−ンシ−ト多層法 |
| DE3821121A1 (de) * | 1988-06-23 | 1990-02-08 | Ullmann Ulo Werk | Verfahren zur herstellung von kontakttraegerkoerpern |
| FR2820548A1 (fr) * | 2001-02-02 | 2002-08-09 | Schlumberger Systems & Service | Objet portatif a puce et a antenne, module destine a former un objet portatif a puce et a antenne et leurs procedes de fabrication |
| JP2006066637A (ja) * | 2004-08-26 | 2006-03-09 | Murata Mfg Co Ltd | セラミック多層基板の製造方法およびそれに用いられる押し型 |
| CN112643899A (zh) * | 2020-12-16 | 2021-04-13 | 南京缔邦新材料科技有限公司 | 一种陶瓷覆铜板的细电路切割方法 |
-
1972
- 1972-10-11 DE DE19722249878 patent/DE2249878A1/de active Pending
-
1973
- 1973-08-07 GB GB3736273A patent/GB1404697A/en not_active Expired
- 1973-10-08 FR FR7335874A patent/FR2203258A1/fr not_active Withdrawn
- 1973-10-09 LU LU68577D patent/LU68577A1/xx unknown
- 1973-10-10 NL NL7313954A patent/NL7313954A/xx unknown
- 1973-10-10 IT IT2994973A patent/IT995738B/it active
- 1973-10-11 BE BE136578A patent/BE805951A/xx unknown
- 1973-10-11 JP JP11433673A patent/JPS4973669A/ja active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2124037A (en) * | 1982-07-19 | 1984-02-08 | Gen Electric Co Plc | Methods of forming patterns on substrates |
| GB2126428A (en) * | 1982-09-03 | 1984-03-21 | Fluke Mfg Co Inc | Molded circuit board and manufacturing method therefor |
| US4604799A (en) * | 1982-09-03 | 1986-08-12 | John Fluke Mfg. Co., Inc. | Method of making molded circuit board |
| US5094811A (en) * | 1983-09-21 | 1992-03-10 | Allied-Signal | Method of making a printed circuit board |
| GB2212332A (en) * | 1987-11-11 | 1989-07-19 | Gen Electric Co Plc | Fabrication of electrical circuits |
| GB2374205A (en) * | 2001-04-04 | 2002-10-09 | Rolls Royce Plc | An electrical conductor winding and a method of manufacturing an electrical conductor winding |
| US6680667B2 (en) | 2001-04-04 | 2004-01-20 | Rolls-Royce Plc | Electrical conductor winding and a method of manufacturing an electrical conductor winding |
| GB2374205B (en) * | 2001-04-04 | 2004-12-22 | Rolls Royce Plc | An electrical conductor winding and a method of manufacturing an electrical conductor winding |
| CN109974305A (zh) * | 2017-12-28 | 2019-07-05 | 武汉海尔热水器有限公司 | 一种外壳及电热水器 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2249878A1 (de) | 1974-04-18 |
| IT995738B (it) | 1975-11-20 |
| BE805951A (fr) | 1974-02-01 |
| JPS4973669A (enExample) | 1974-07-16 |
| NL7313954A (enExample) | 1974-04-16 |
| LU68577A1 (enExample) | 1973-12-14 |
| FR2203258A1 (enExample) | 1974-05-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1404697A (en) | Production of fine conductor path structures on ceramic substrates | |
| US3042591A (en) | Process for forming electrical conductors on insulating bases | |
| EP0054165B1 (de) | Druckwalze in Verbundkörperbauweise | |
| US11168398B2 (en) | Method and device for producing metal patterns on a substrate for decorative and/or functional purposes, manufacture of objects incorporating said production and set of consumables used | |
| EP0002738B1 (de) | Verfahren zum Aufbringen einer Materialschicht auf eine Oberfläche eines plattenförmigen Werkstücks mittels eines Laserstrahls | |
| GB1461484A (en) | Method and apparatus for depositing a layer containing at least one metal or metal oxide on a refractory rigid body | |
| GB1269973A (en) | Method of forming a thin film pattern of metal or metal compounds | |
| GB1248142A (en) | Improvements in or relating to electrical circuits assemblies | |
| GB1268317A (en) | Improvements in or relating to the manufacture of conductor plates | |
| CN108511349A (zh) | 一种陶瓷基板的金属化方法 | |
| FR2288795A1 (fr) | Procede de realisation de decors de differentes structures et couleurs a partir de metal sur un substrat metallique | |
| US1494630A (en) | Method of ornamenting glassware | |
| GB1241574A (en) | A method of plating conductive metals on film-forming materials | |
| EP0199114B1 (de) | Herstellung metallischer Strukturen auf anorganischen Nichtleitern | |
| US3205155A (en) | Method of fabricating thin film resistive elements | |
| RU2071193C1 (ru) | Полуаддитивный способ изготовления двусторонних печатных плат | |
| GB1429908A (en) | Method of making coloured photomasks | |
| JPS6441194A (en) | Manufacture of thin film electroluminescent element | |
| GB1487227A (en) | Method of manufacturing photosensitive material | |
| GB2173511A (en) | Application of stop-off coating by ion plating | |
| GB1136752A (en) | Improvements relating to electrical connecting arrangements | |
| EP0121443A3 (en) | Apparatus for and method of continuously depositing a highly conductive, highly transmissive film | |
| GB1292776A (en) | Improvements in or relating to the production of small contact areas of substantially uniform thickness in thicklayer circuits | |
| FR2202955A1 (en) | Electroforming of tools - using thin metal coating and impurities in plating bath to aid separation from pattern | |
| GB1329287A (en) | Circuit patterns on substrates |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PLNP | Patent lapsed through nonpayment of renewal fees |