DE2213915A1 - Gehaeuse fuer halbleitersysteme - Google Patents

Gehaeuse fuer halbleitersysteme

Info

Publication number
DE2213915A1
DE2213915A1 DE2213915A DE2213915A DE2213915A1 DE 2213915 A1 DE2213915 A1 DE 2213915A1 DE 2213915 A DE2213915 A DE 2213915A DE 2213915 A DE2213915 A DE 2213915A DE 2213915 A1 DE2213915 A1 DE 2213915A1
Authority
DE
Germany
Prior art keywords
metal
housing
filled
floor
intermediate piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE2213915A
Other languages
German (de)
English (en)
Inventor
Burkhart Dipl Ing Diel
Heinz Hagen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Priority to DE2213915A priority Critical patent/DE2213915A1/de
Priority to CH1708472A priority patent/CH548109A/xx
Priority to AT1012972A priority patent/AT327989B/de
Priority to FR7245013A priority patent/FR2176661B1/fr
Priority to GB6005172A priority patent/GB1397330A/en
Priority to NL7302989A priority patent/NL7302989A/xx
Priority to CA166,172A priority patent/CA979122A/en
Priority to IT21712/73A priority patent/IT982542B/it
Priority to JP48031551A priority patent/JPS496880A/ja
Publication of DE2213915A1 publication Critical patent/DE2213915A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
DE2213915A 1972-03-22 1972-03-22 Gehaeuse fuer halbleitersysteme Pending DE2213915A1 (de)

Priority Applications (9)

Application Number Priority Date Filing Date Title
DE2213915A DE2213915A1 (de) 1972-03-22 1972-03-22 Gehaeuse fuer halbleitersysteme
CH1708472A CH548109A (de) 1972-03-22 1972-11-23 Gehaeuse mit einem halbleitersystem.
AT1012972A AT327989B (de) 1972-03-22 1972-11-28 Gehause fur halbleitersysteme
FR7245013A FR2176661B1 (enExample) 1972-03-22 1972-12-18
GB6005172A GB1397330A (en) 1972-03-22 1972-12-29 Housings for semiconductor systems
NL7302989A NL7302989A (enExample) 1972-03-22 1973-03-02
CA166,172A CA979122A (en) 1972-03-22 1973-03-15 Housings for semiconductor systems
IT21712/73A IT982542B (it) 1972-03-22 1973-03-16 Custodia per sistemi a semicon duttori
JP48031551A JPS496880A (enExample) 1972-03-22 1973-03-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2213915A DE2213915A1 (de) 1972-03-22 1972-03-22 Gehaeuse fuer halbleitersysteme

Publications (1)

Publication Number Publication Date
DE2213915A1 true DE2213915A1 (de) 1973-10-04

Family

ID=5839779

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2213915A Pending DE2213915A1 (de) 1972-03-22 1972-03-22 Gehaeuse fuer halbleitersysteme

Country Status (9)

Country Link
JP (1) JPS496880A (enExample)
AT (1) AT327989B (enExample)
CA (1) CA979122A (enExample)
CH (1) CH548109A (enExample)
DE (1) DE2213915A1 (enExample)
FR (1) FR2176661B1 (enExample)
GB (1) GB1397330A (enExample)
IT (1) IT982542B (enExample)
NL (1) NL7302989A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2942422A1 (de) * 1978-10-19 1980-04-30 Cii Honeywell Bull Traegerplatte fuer integrierte schaltkreise
DE3432449A1 (de) * 1983-09-06 1985-04-04 General Electric Co., Schenectady, N.Y. Hermetisch verschlossenes leistungschipgehaeuse

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2942422A1 (de) * 1978-10-19 1980-04-30 Cii Honeywell Bull Traegerplatte fuer integrierte schaltkreise
DE3432449A1 (de) * 1983-09-06 1985-04-04 General Electric Co., Schenectady, N.Y. Hermetisch verschlossenes leistungschipgehaeuse

Also Published As

Publication number Publication date
IT982542B (it) 1974-10-21
FR2176661A1 (enExample) 1973-11-02
ATA1012972A (de) 1975-05-15
JPS496880A (enExample) 1974-01-22
CH548109A (de) 1974-04-11
AT327989B (de) 1976-02-25
CA979122A (en) 1975-12-02
FR2176661B1 (enExample) 1977-12-30
GB1397330A (en) 1975-06-11
NL7302989A (enExample) 1973-09-25

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Legal Events

Date Code Title Description
OHW Rejection