GB1397330A - Housings for semiconductor systems - Google Patents

Housings for semiconductor systems

Info

Publication number
GB1397330A
GB1397330A GB6005172A GB6005172A GB1397330A GB 1397330 A GB1397330 A GB 1397330A GB 6005172 A GB6005172 A GB 6005172A GB 6005172 A GB6005172 A GB 6005172A GB 1397330 A GB1397330 A GB 1397330A
Authority
GB
United Kingdom
Prior art keywords
bores
metal
housings
ring
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB6005172A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of GB1397330A publication Critical patent/GB1397330A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
GB6005172A 1972-03-22 1972-12-29 Housings for semiconductor systems Expired GB1397330A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2213915A DE2213915A1 (de) 1972-03-22 1972-03-22 Gehaeuse fuer halbleitersysteme

Publications (1)

Publication Number Publication Date
GB1397330A true GB1397330A (en) 1975-06-11

Family

ID=5839779

Family Applications (1)

Application Number Title Priority Date Filing Date
GB6005172A Expired GB1397330A (en) 1972-03-22 1972-12-29 Housings for semiconductor systems

Country Status (9)

Country Link
JP (1) JPS496880A (enExample)
AT (1) AT327989B (enExample)
CA (1) CA979122A (enExample)
CH (1) CH548109A (enExample)
DE (1) DE2213915A1 (enExample)
FR (1) FR2176661B1 (enExample)
GB (1) GB1397330A (enExample)
IT (1) IT982542B (enExample)
NL (1) NL7302989A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2439478A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Boitier plat pour dispositifs a circuits integres
GB2146174B (en) * 1983-09-06 1987-04-23 Gen Electric Hermetic power chip packages

Also Published As

Publication number Publication date
IT982542B (it) 1974-10-21
FR2176661A1 (enExample) 1973-11-02
ATA1012972A (de) 1975-05-15
JPS496880A (enExample) 1974-01-22
CH548109A (de) 1974-04-11
AT327989B (de) 1976-02-25
CA979122A (en) 1975-12-02
FR2176661B1 (enExample) 1977-12-30
DE2213915A1 (de) 1973-10-04
NL7302989A (enExample) 1973-09-25

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee