GB1353310A - Semiconductor device mounting arrangement - Google Patents

Semiconductor device mounting arrangement

Info

Publication number
GB1353310A
GB1353310A GB1353310DA GB1353310A GB 1353310 A GB1353310 A GB 1353310A GB 1353310D A GB1353310D A GB 1353310DA GB 1353310 A GB1353310 A GB 1353310A
Authority
GB
United Kingdom
Prior art keywords
wafer
base
conductive
semiconductor device
device mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Publication of GB1353310A publication Critical patent/GB1353310A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

1353310 Semi-conductor devices STANDARD TELEPHONES & CABLES Ltd 27 July 1972 35088/72 Heading H1K A semi-conductor wafer 1, e.g. comprising a GaAs Gunn diode, is contacted on opposite faces by a conductive base 2 and a conductive post 3, e.g. both of Cu, the post 3 being a close fit within a conductive collar 5 aligned with and pre-fitted to an insulating collar 4, e.g. of alumina, surrounding the wafer 1 and attached to the base 2. The base 2 may include a flexible diaphragm portion 8 to relieve strain in the wafer 1.
GB1353310D 1972-07-27 1972-07-27 Semiconductor device mounting arrangement Expired GB1353310A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3508872 1972-07-27

Publications (1)

Publication Number Publication Date
GB1353310A true GB1353310A (en) 1974-05-15

Family

ID=10373662

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1353310D Expired GB1353310A (en) 1972-07-27 1972-07-27 Semiconductor device mounting arrangement

Country Status (1)

Country Link
GB (1) GB1353310A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0046107A1 (en) * 1980-08-08 1982-02-17 Thomson-Csf Semiconductor device utilizable at very high frequencies, and method of making the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0046107A1 (en) * 1980-08-08 1982-02-17 Thomson-Csf Semiconductor device utilizable at very high frequencies, and method of making the same

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Legal Events

Date Code Title Description
PS Patent sealed
435 Patent endorsed 'licences of right' on the date specified (sect. 35/1949)
PCNP Patent ceased through non-payment of renewal fee