AT327989B - Gehause fur halbleitersysteme - Google Patents

Gehause fur halbleitersysteme

Info

Publication number
AT327989B
AT327989B AT1012972A AT1012972A AT327989B AT 327989 B AT327989 B AT 327989B AT 1012972 A AT1012972 A AT 1012972A AT 1012972 A AT1012972 A AT 1012972A AT 327989 B AT327989 B AT 327989B
Authority
AT
Austria
Prior art keywords
semi
housing
conductor systems
conductor
systems
Prior art date
Application number
AT1012972A
Other languages
English (en)
Other versions
ATA1012972A (de
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of ATA1012972A publication Critical patent/ATA1012972A/de
Application granted granted Critical
Publication of AT327989B publication Critical patent/AT327989B/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
AT1012972A 1972-03-22 1972-11-28 Gehause fur halbleitersysteme AT327989B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2213915A DE2213915A1 (de) 1972-03-22 1972-03-22 Gehaeuse fuer halbleitersysteme

Publications (2)

Publication Number Publication Date
ATA1012972A ATA1012972A (de) 1975-05-15
AT327989B true AT327989B (de) 1976-02-25

Family

ID=5839779

Family Applications (1)

Application Number Title Priority Date Filing Date
AT1012972A AT327989B (de) 1972-03-22 1972-11-28 Gehause fur halbleitersysteme

Country Status (9)

Country Link
JP (1) JPS496880A (de)
AT (1) AT327989B (de)
CA (1) CA979122A (de)
CH (1) CH548109A (de)
DE (1) DE2213915A1 (de)
FR (1) FR2176661B1 (de)
GB (1) GB1397330A (de)
IT (1) IT982542B (de)
NL (1) NL7302989A (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2439478A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Boitier plat pour dispositifs a circuits integres
GB2146174B (en) * 1983-09-06 1987-04-23 Gen Electric Hermetic power chip packages

Also Published As

Publication number Publication date
CH548109A (de) 1974-04-11
IT982542B (it) 1974-10-21
GB1397330A (en) 1975-06-11
DE2213915A1 (de) 1973-10-04
FR2176661A1 (de) 1973-11-02
ATA1012972A (de) 1975-05-15
FR2176661B1 (de) 1977-12-30
CA979122A (en) 1975-12-02
NL7302989A (de) 1973-09-25
JPS496880A (de) 1974-01-22

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee