CH551690A - Halbleiteranordnung. - Google Patents

Halbleiteranordnung.

Info

Publication number
CH551690A
CH551690A CH475673A CH475673A CH551690A CH 551690 A CH551690 A CH 551690A CH 475673 A CH475673 A CH 475673A CH 475673 A CH475673 A CH 475673A CH 551690 A CH551690 A CH 551690A
Authority
CH
Switzerland
Prior art keywords
semi
conductor arrangement
conductor
arrangement
Prior art date
Application number
CH475673A
Other languages
English (en)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of CH551690A publication Critical patent/CH551690A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01025—Manganese [Mn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CH475673A 1972-04-06 1973-04-03 Halbleiteranordnung. CH551690A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7204574.A NL159818B (nl) 1972-04-06 1972-04-06 Halfgeleiderinrichting, bevattende een flexibele isolerende folie, die aan een zijde is voorzien van metalen geleider- sporen.

Publications (1)

Publication Number Publication Date
CH551690A true CH551690A (de) 1974-07-15

Family

ID=19815786

Family Applications (1)

Application Number Title Priority Date Filing Date
CH475673A CH551690A (de) 1972-04-06 1973-04-03 Halbleiteranordnung.

Country Status (9)

Country Link
US (1) US3825803A (de)
JP (1) JPS5113993B2 (de)
CA (1) CA974663A (de)
CH (1) CH551690A (de)
DE (1) DE2314247C3 (de)
FR (1) FR2179103B1 (de)
GB (1) GB1418520A (de)
IT (1) IT981860B (de)
NL (1) NL159818B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3300693A1 (de) * 1982-02-05 1983-09-22 Hitachi, Ltd., Tokyo Halbleiteranordnung und verfahren zu ihrer herstellung

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1478797A (en) * 1974-09-17 1977-07-06 Siemens Ag Semiconductor arrangements
JPS5649559Y2 (de) * 1976-03-25 1981-11-19
DE2742882C2 (de) * 1977-09-23 1986-10-09 Blaupunkt-Werke Gmbh, 3200 Hildesheim Elektronisches Bauelement
US4602314A (en) * 1983-10-14 1986-07-22 Intel Corporation Heat conduction mechanism for semiconductor devices
JPS6092829U (ja) * 1983-11-30 1985-06-25 アルプス電気株式会社 マイクロ波トランジスタの取付構造体
DE3402538A1 (de) * 1984-01-26 1985-08-01 Robert Bosch Gmbh, 7000 Stuttgart Waermeableitende befestigung
US4835598A (en) * 1985-06-13 1989-05-30 Matsushita Electric Works, Ltd. Wiring board
DE3627372C3 (de) * 1986-08-12 1994-04-14 Loewe Opta Gmbh Anordnung, bestehend aus einer Leiterplatte, einem Kühlkörper und zu kühlenden elektronischen Bauelementen
US4962416A (en) * 1988-04-18 1990-10-09 International Business Machines Corporation Electronic package with a device positioned above a substrate by suction force between the device and heat sink
US4849856A (en) * 1988-07-13 1989-07-18 International Business Machines Corp. Electronic package with improved heat sink
JPH0310224A (ja) * 1989-06-07 1991-01-17 Sharp Corp 表示装置
GB2237682A (en) * 1989-09-28 1991-05-08 Redpoint Limited Heatsink for semiconductor devices
GB2240425B (en) * 1990-01-20 1994-01-12 Motorola Ltd Radio transmitter power amplifier with cooling apparatus
US5263245A (en) * 1992-01-27 1993-11-23 International Business Machines Corporation Method of making an electronic package with enhanced heat sinking
US5278724A (en) * 1992-07-06 1994-01-11 International Business Machines Corporation Electronic package and method of making same
ATE203355T1 (de) * 1995-06-27 2001-08-15 Braun Gmbh Wärmeleite-befestigung eines elektronischen leistungsbauelementes auf einer leiterplatte mit kühlblech
IT1285396B1 (it) * 1996-06-04 1998-06-03 Magneti Marelli Spa Dispositivo dissipatore per circuiti integrati.
FR2764114B1 (fr) * 1997-06-02 2003-04-25 Sgs Thomson Microelectronics Dispositif semi-conducteur muni d'un dissipateur thermique
JP2915892B2 (ja) * 1997-06-27 1999-07-05 松下電子工業株式会社 樹脂封止型半導体装置およびその製造方法
US6861735B2 (en) * 1997-06-27 2005-03-01 Matsushita Electric Industrial Co., Ltd. Resin molded type semiconductor device and a method of manufacturing the same
JP3003638B2 (ja) * 1997-08-05 2000-01-31 日本電気株式会社 半導体装置、その製造方法
US7023087B1 (en) * 1998-08-05 2006-04-04 Agere Systems Inc. Integrated circuit carrier and method of manufacturing and integrated circuit
DE19853777A1 (de) * 1998-11-21 2000-05-25 Wuerth Elektronik Gmbh & Co Kg Kühlelement für Leiterplatten
DE19905055A1 (de) * 1999-02-08 2000-08-17 Siemens Ag Halbleiterbauelement mit einem Chipträger mit Öffnungen zur Kontaktierung
US6208020B1 (en) * 1999-02-24 2001-03-27 Matsushita Electronics Corporation Leadframe for use in manufacturing a resin-molded semiconductor device
US6215663B1 (en) * 2000-03-16 2001-04-10 Philips Electronics North America Corporation Printed circuit board assembly with improved thermal performance
DE102004057494A1 (de) 2004-11-29 2006-06-08 Siemens Ag Metallisierte Folie zur flächigen Kontaktierung
DE102010013334A1 (de) * 2010-03-30 2012-05-10 Borgwarner Beru Systems Gmbh Leiterplatte mit Bauelement und Verfahren zum Bestücken einer Leiterplatte
US8987875B2 (en) 2013-03-08 2015-03-24 Delphi Technologies, Inc. Balanced stress assembly for semiconductor devices

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3614832A (en) * 1966-03-09 1971-10-26 Ibm Decal connectors and methods of forming decal connections to solid state devices
US3480836A (en) * 1966-08-11 1969-11-25 Ibm Component mounted in a printed circuit
US3544857A (en) * 1966-08-16 1970-12-01 Signetics Corp Integrated circuit assembly with lead structure and method
US3624462A (en) * 1969-07-03 1971-11-30 Fairchild Camera Instr Co Face-bonded photoarray package
US3724068A (en) * 1971-02-25 1973-04-03 Du Pont Semiconductor chip packaging apparatus and method
US3711625A (en) * 1971-03-31 1973-01-16 Microsystems Int Ltd Plastic support means for lead frame ends

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3300693A1 (de) * 1982-02-05 1983-09-22 Hitachi, Ltd., Tokyo Halbleiteranordnung und verfahren zu ihrer herstellung

Also Published As

Publication number Publication date
DE2314247A1 (de) 1973-10-18
FR2179103B1 (de) 1978-05-26
GB1418520A (en) 1975-12-24
NL7204574A (de) 1973-10-09
JPS4917969A (de) 1974-02-16
FR2179103A1 (de) 1973-11-16
IT981860B (it) 1974-10-10
CA974663A (en) 1975-09-16
NL159818B (nl) 1979-03-15
DE2314247B2 (de) 1978-10-26
JPS5113993B2 (de) 1976-05-06
US3825803A (en) 1974-07-23
DE2314247C3 (de) 1979-07-05

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Legal Events

Date Code Title Description
PL Patent ceased