IT1285396B1 - Dispositivo dissipatore per circuiti integrati. - Google Patents

Dispositivo dissipatore per circuiti integrati.

Info

Publication number
IT1285396B1
IT1285396B1 IT96TO000486A ITTO960486A IT1285396B1 IT 1285396 B1 IT1285396 B1 IT 1285396B1 IT 96TO000486 A IT96TO000486 A IT 96TO000486A IT TO960486 A ITTO960486 A IT TO960486A IT 1285396 B1 IT1285396 B1 IT 1285396B1
Authority
IT
Italy
Prior art keywords
integrated circuits
dissipator device
dissipator
circuits
integrated
Prior art date
Application number
IT96TO000486A
Other languages
English (en)
Inventor
Marco Nardoni
Luca Nitopi
Original Assignee
Magneti Marelli Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Magneti Marelli Spa filed Critical Magneti Marelli Spa
Priority to IT96TO000486A priority Critical patent/IT1285396B1/it
Publication of ITTO960486A0 publication Critical patent/ITTO960486A0/it
Priority to BR9702405A priority patent/BR9702405A/pt
Priority to EP97108845A priority patent/EP0812015A1/en
Publication of ITTO960486A1 publication Critical patent/ITTO960486A1/it
Application granted granted Critical
Publication of IT1285396B1 publication Critical patent/IT1285396B1/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/047—Soldering with different solders, e.g. two different solders on two sides of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
IT96TO000486A 1996-06-04 1996-06-04 Dispositivo dissipatore per circuiti integrati. IT1285396B1 (it)

Priority Applications (3)

Application Number Priority Date Filing Date Title
IT96TO000486A IT1285396B1 (it) 1996-06-04 1996-06-04 Dispositivo dissipatore per circuiti integrati.
BR9702405A BR9702405A (pt) 1996-06-04 1997-06-03 Dessipador de calor para circuitos integrados e processo de fabricação de substrato de interconexão incluindo pelo menos um circuito integrado e um dissipador de calor
EP97108845A EP0812015A1 (en) 1996-06-04 1997-06-03 A heat dissipator for integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT96TO000486A IT1285396B1 (it) 1996-06-04 1996-06-04 Dispositivo dissipatore per circuiti integrati.

Publications (3)

Publication Number Publication Date
ITTO960486A0 ITTO960486A0 (it) 1996-06-04
ITTO960486A1 ITTO960486A1 (it) 1997-12-04
IT1285396B1 true IT1285396B1 (it) 1998-06-03

Family

ID=11414693

Family Applications (1)

Application Number Title Priority Date Filing Date
IT96TO000486A IT1285396B1 (it) 1996-06-04 1996-06-04 Dispositivo dissipatore per circuiti integrati.

Country Status (3)

Country Link
EP (1) EP0812015A1 (it)
BR (1) BR9702405A (it)
IT (1) IT1285396B1 (it)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2793350B1 (fr) * 1999-05-03 2003-08-15 St Microelectronics Sa Protection d'une puce semiconductrice
SE9902998L (sv) * 1999-08-25 2001-02-26 Ericsson Telefon Ab L M Kylare
EP1374654A4 (en) * 2001-03-16 2004-10-20 Aavid Thermalloy Llc THERMAL DRAIN
WO2003094586A1 (de) * 2002-04-29 2003-11-13 Siemens Aktiengesellschaft Leiterplatte mit smd-bauelement und kühlkörper
JP3738755B2 (ja) 2002-08-01 2006-01-25 日本電気株式会社 チップ部品を備える電子装置
ITMI20111216A1 (it) 2011-06-30 2012-12-31 St Microelectronics Srl Dispositivo elettronico di potenza ad elevata dissipazione di calore e stabilita?
ITMI20111218A1 (it) 2011-06-30 2012-12-31 St Microelectronics Srl Dispositivo di potenza ad elevata velocita? di commutazione
ITMI20111219A1 (it) 2011-06-30 2012-12-31 St Microelectronics Srl Sistema con dissipatore di calore condiviso
ITMI20111214A1 (it) 2011-06-30 2012-12-31 St Microelectronics Srl Dispositivo di potenza a spessore ridotto
ITMI20111208A1 (it) * 2011-06-30 2012-12-31 St Microelectronics Srl Sistema con dissipatore di calore stabilizzato
ITMI20111217A1 (it) 2011-06-30 2012-12-31 St Microelectronics Srl Sistema contenitore/dissipatore per componente elettronico
US10497524B2 (en) 2014-03-28 2019-12-03 Black & Decker Inc. Integrated electronic switch and control module for a power tool
US10541588B2 (en) 2017-05-24 2020-01-21 Black & Decker Inc. Electronic power module for a power tool having an integrated heat sink
CN114698243A (zh) * 2018-09-07 2022-07-01 上海嘉楠捷思信息技术有限公司 一种计算电路板以及包括该计算电路板的计算设备
CN109275261A (zh) * 2018-10-18 2019-01-25 杭州嘉楠耘智信息科技有限公司 一种金属基覆铜电路板以及包括该电路板的计算设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL159818B (nl) * 1972-04-06 1979-03-15 Philips Nv Halfgeleiderinrichting, bevattende een flexibele isolerende folie, die aan een zijde is voorzien van metalen geleider- sporen.
JPS5478982A (en) * 1977-12-06 1979-06-23 Fujitsu Ltd Semiconductor device and its manufacture
JPS5721845A (en) * 1980-07-15 1982-02-04 Nec Corp Mounting structure for miniaturized electronic parts
JPH01117049A (ja) * 1987-10-30 1989-05-09 Hitachi Ltd 集積回路素子冷却装置
JPH0448768A (ja) * 1990-06-15 1992-02-18 Fujitsu Ltd 半導体装置及びその製造方法
JPH07109867B2 (ja) * 1991-04-15 1995-11-22 インターナショナル・ビジネス・マシーンズ・コーポレイション 半導体チツプの冷却構造
JP3039584B2 (ja) * 1992-07-03 2000-05-08 株式会社日立製作所 半導体集積回路モジュールの組立方法
JPH07263618A (ja) * 1994-03-24 1995-10-13 Nippondenso Co Ltd 混成集積回路装置

Also Published As

Publication number Publication date
BR9702405A (pt) 1998-09-08
ITTO960486A1 (it) 1997-12-04
ITTO960486A0 (it) 1996-06-04
EP0812015A1 (en) 1997-12-10

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