DE2118356A1 - Scheibenförmiges Halbleiterbauelement - Google Patents

Scheibenförmiges Halbleiterbauelement

Info

Publication number
DE2118356A1
DE2118356A1 DE19712118356 DE2118356A DE2118356A1 DE 2118356 A1 DE2118356 A1 DE 2118356A1 DE 19712118356 DE19712118356 DE 19712118356 DE 2118356 A DE2118356 A DE 2118356A DE 2118356 A1 DE2118356 A1 DE 2118356A1
Authority
DE
Germany
Prior art keywords
semiconductor component
cover plates
ring
component according
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19712118356
Other languages
German (de)
English (en)
Inventor
Reimer Dipl.-Phys.Dr.; Martin Heinz; 8000 München Emeis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19712118356 priority Critical patent/DE2118356A1/de
Priority to FR7146963A priority patent/FR2133561B1/fr
Priority to NL7202856A priority patent/NL7202856A/xx
Priority to GB1000172A priority patent/GB1330081A/en
Priority to IT7212/72A priority patent/IT957175B/it
Priority to SE7204808A priority patent/SE383583B/xx
Publication of DE2118356A1 publication Critical patent/DE2118356A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type

Landscapes

  • Die Bonding (AREA)
DE19712118356 1971-04-15 1971-04-15 Scheibenförmiges Halbleiterbauelement Pending DE2118356A1 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE19712118356 DE2118356A1 (de) 1971-04-15 1971-04-15 Scheibenförmiges Halbleiterbauelement
FR7146963A FR2133561B1 (https=) 1971-04-15 1971-12-28
NL7202856A NL7202856A (https=) 1971-04-15 1972-03-03
GB1000172A GB1330081A (en) 1971-04-15 1972-03-03 Semiconductor components
IT7212/72A IT957175B (it) 1971-04-15 1972-04-12 Componente dischiforme e semicon duttori
SE7204808A SE383583B (sv) 1971-04-15 1972-04-13 Skivformad halvledarkomponent innefattande ett halvledarelement och ett holje

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19712118356 DE2118356A1 (de) 1971-04-15 1971-04-15 Scheibenförmiges Halbleiterbauelement

Publications (1)

Publication Number Publication Date
DE2118356A1 true DE2118356A1 (de) 1972-10-26

Family

ID=5804825

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19712118356 Pending DE2118356A1 (de) 1971-04-15 1971-04-15 Scheibenförmiges Halbleiterbauelement

Country Status (6)

Country Link
DE (1) DE2118356A1 (https=)
FR (1) FR2133561B1 (https=)
GB (1) GB1330081A (https=)
IT (1) IT957175B (https=)
NL (1) NL7202856A (https=)
SE (1) SE383583B (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2654532A1 (de) * 1976-12-02 1978-06-08 Licentia Gmbh Scheibenfoermige halbleiterzelle
DE3640801A1 (de) * 1985-11-29 1987-06-04 Mitsubishi Electric Corp Halbleiterbauelement
USRE34696E (en) * 1985-11-29 1994-08-16 Mitsubishi Denki Kabushiki Semiconductor device housing with electrodes in press contact with the opposite sides of chip
DE102015113111A1 (de) * 2015-08-10 2017-02-16 Infineon Technologies Ag Leistungshalbleitermodul mit verbesserter Abdichtung

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2440077A1 (fr) * 1978-10-23 1980-05-23 Transformation En Cie Indle Conteneur pour composant electronique de puissance a semi-conducteur et son procede de fabrication
DE3221794A1 (de) * 1982-06-09 1983-12-15 Brown, Boveri & Cie Ag, 6800 Mannheim Scheibenfoermige halbleiterzelle fuer druckkontaktierbare leistungshalbleiterbauelemente
JP5187343B2 (ja) * 2010-04-27 2013-04-24 三菱電機株式会社 圧接型半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE316534B (https=) * 1965-07-09 1969-10-27 Asea Ab
US3476986A (en) * 1966-09-17 1969-11-04 Nippon Electric Co Pressure contact semiconductor devices
GB1189062A (en) * 1967-03-23 1970-04-22 Motorola Inc Semiconductor Rectifier Assembly
GB1219570A (en) * 1967-08-04 1971-01-20 Lucas Industries Ltd Diode units
CH494471A (de) * 1967-11-09 1970-07-31 Ckd Praha Halbleiterbauelement

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2654532A1 (de) * 1976-12-02 1978-06-08 Licentia Gmbh Scheibenfoermige halbleiterzelle
DE3640801A1 (de) * 1985-11-29 1987-06-04 Mitsubishi Electric Corp Halbleiterbauelement
USRE34696E (en) * 1985-11-29 1994-08-16 Mitsubishi Denki Kabushiki Semiconductor device housing with electrodes in press contact with the opposite sides of chip
DE102015113111A1 (de) * 2015-08-10 2017-02-16 Infineon Technologies Ag Leistungshalbleitermodul mit verbesserter Abdichtung
DE102015113111B4 (de) * 2015-08-10 2020-01-30 Infineon Technologies Ag Leistungshalbleitermodul mit verbesserter Abdichtung

Also Published As

Publication number Publication date
NL7202856A (https=) 1972-10-17
SE383583B (sv) 1976-03-15
FR2133561A1 (https=) 1972-12-01
IT957175B (it) 1973-10-10
GB1330081A (en) 1973-09-12
FR2133561B1 (https=) 1977-03-18

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Legal Events

Date Code Title Description
OHA Expiration of time for request for examination