GB1330081A - Semiconductor components - Google Patents

Semiconductor components

Info

Publication number
GB1330081A
GB1330081A GB1000172A GB1000172A GB1330081A GB 1330081 A GB1330081 A GB 1330081A GB 1000172 A GB1000172 A GB 1000172A GB 1000172 A GB1000172 A GB 1000172A GB 1330081 A GB1330081 A GB 1330081A
Authority
GB
United Kingdom
Prior art keywords
discs
semi
flanges
urged together
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1000172A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of GB1330081A publication Critical patent/GB1330081A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type

Landscapes

  • Die Bonding (AREA)
GB1000172A 1971-04-15 1972-03-03 Semiconductor components Expired GB1330081A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19712118356 DE2118356A1 (de) 1971-04-15 1971-04-15 Scheibenförmiges Halbleiterbauelement

Publications (1)

Publication Number Publication Date
GB1330081A true GB1330081A (en) 1973-09-12

Family

ID=5804825

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1000172A Expired GB1330081A (en) 1971-04-15 1972-03-03 Semiconductor components

Country Status (6)

Country Link
DE (1) DE2118356A1 (https=)
FR (1) FR2133561B1 (https=)
GB (1) GB1330081A (https=)
IT (1) IT957175B (https=)
NL (1) NL7202856A (https=)
SE (1) SE383583B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011017563B4 (de) * 2010-04-27 2015-10-22 Mitsubishi Electric Corp. Druckkontakthalbleitervorrichtung

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2654532C3 (de) * 1976-12-02 1982-03-11 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Scheibenförmige Halbleiterzelle
FR2440077A1 (fr) * 1978-10-23 1980-05-23 Transformation En Cie Indle Conteneur pour composant electronique de puissance a semi-conducteur et son procede de fabrication
DE3221794A1 (de) * 1982-06-09 1983-12-15 Brown, Boveri & Cie Ag, 6800 Mannheim Scheibenfoermige halbleiterzelle fuer druckkontaktierbare leistungshalbleiterbauelemente
USRE34696E (en) * 1985-11-29 1994-08-16 Mitsubishi Denki Kabushiki Semiconductor device housing with electrodes in press contact with the opposite sides of chip
US4829364A (en) * 1985-11-29 1989-05-09 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
DE102015113111B4 (de) * 2015-08-10 2020-01-30 Infineon Technologies Ag Leistungshalbleitermodul mit verbesserter Abdichtung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE316534B (https=) * 1965-07-09 1969-10-27 Asea Ab
US3476986A (en) * 1966-09-17 1969-11-04 Nippon Electric Co Pressure contact semiconductor devices
GB1189062A (en) * 1967-03-23 1970-04-22 Motorola Inc Semiconductor Rectifier Assembly
GB1219570A (en) * 1967-08-04 1971-01-20 Lucas Industries Ltd Diode units
CH494471A (de) * 1967-11-09 1970-07-31 Ckd Praha Halbleiterbauelement

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011017563B4 (de) * 2010-04-27 2015-10-22 Mitsubishi Electric Corp. Druckkontakthalbleitervorrichtung

Also Published As

Publication number Publication date
NL7202856A (https=) 1972-10-17
SE383583B (sv) 1976-03-15
FR2133561A1 (https=) 1972-12-01
IT957175B (it) 1973-10-10
DE2118356A1 (de) 1972-10-26
FR2133561B1 (https=) 1977-03-18

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee