DE2050145A1 - Verfahren zum elektrolytischen Nieder schlagen einer Zinn Wismut Verbindung und elektrolytisches Bad zur Durchfuhrung des Verfahrens - Google Patents
Verfahren zum elektrolytischen Nieder schlagen einer Zinn Wismut Verbindung und elektrolytisches Bad zur Durchfuhrung des VerfahrensInfo
- Publication number
- DE2050145A1 DE2050145A1 DE19702050145 DE2050145A DE2050145A1 DE 2050145 A1 DE2050145 A1 DE 2050145A1 DE 19702050145 DE19702050145 DE 19702050145 DE 2050145 A DE2050145 A DE 2050145A DE 2050145 A1 DE2050145 A1 DE 2050145A1
- Authority
- DE
- Germany
- Prior art keywords
- tin
- bismuth
- liter
- electrolytic bath
- electrolytic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 16
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 title claims description 7
- 238000001556 precipitation Methods 0.000 title description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 26
- 229910052797 bismuth Inorganic materials 0.000 claims description 13
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 10
- -1 polypropylene Polymers 0.000 claims description 7
- 229910001152 Bi alloy Inorganic materials 0.000 claims description 6
- 229910000416 bismuth oxide Inorganic materials 0.000 claims description 6
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 claims description 6
- 229910000380 bismuth sulfate Inorganic materials 0.000 claims description 5
- BEQZMQXCOWIHRY-UHFFFAOYSA-H dibismuth;trisulfate Chemical compound [Bi+3].[Bi+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O BEQZMQXCOWIHRY-UHFFFAOYSA-H 0.000 claims description 5
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 3
- 239000004327 boric acid Substances 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 3
- 229960004279 formaldehyde Drugs 0.000 claims description 3
- 235000019256 formaldehyde Nutrition 0.000 claims description 3
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 230000002378 acidificating effect Effects 0.000 claims description 2
- 229910001451 bismuth ion Inorganic materials 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- SFKFRLRQWLYBDM-UHFFFAOYSA-J S(=O)(=O)([O-])[O-].[Bi+3].[Bi+]=O.S(=O)(=O)([O-])[O-] Chemical compound S(=O)(=O)([O-])[O-].[Bi+3].[Bi+]=O.S(=O)(=O)([O-])[O-] SFKFRLRQWLYBDM-UHFFFAOYSA-J 0.000 claims 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 description 5
- 206010035148 Plague Diseases 0.000 description 4
- 241000607479 Yersinia pestis Species 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 1
- 239000001828 Gelatine Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001432 tin ion Inorganic materials 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR6944284A FR2071199A5 (enrdf_load_stackoverflow) | 1969-12-19 | 1969-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2050145A1 true DE2050145A1 (de) | 1971-06-24 |
Family
ID=9044910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19702050145 Pending DE2050145A1 (de) | 1969-12-19 | 1970-10-13 | Verfahren zum elektrolytischen Nieder schlagen einer Zinn Wismut Verbindung und elektrolytisches Bad zur Durchfuhrung des Verfahrens |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3663384A (enrdf_load_stackoverflow) |
| JP (1) | JPS4931606B1 (enrdf_load_stackoverflow) |
| DE (1) | DE2050145A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2071199A5 (enrdf_load_stackoverflow) |
| GB (1) | GB1299519A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4331518A (en) * | 1981-01-09 | 1982-05-25 | Vulcan Materials Company | Bismuth composition, method of electroplating a tin-bismuth alloy and electroplating bath therefor |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4162205A (en) * | 1978-10-19 | 1979-07-24 | Vulcan Materials Company | Method of electroplating tin and alkaline electroplating bath therefor |
| US5066367B1 (en) * | 1981-09-11 | 1993-12-21 | I. Nobel Fred | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
| US5094726B1 (en) * | 1981-09-11 | 1993-12-21 | I. Nobel Fred | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
| US4599149A (en) * | 1981-09-11 | 1986-07-08 | Learonal, Inc. | Process for electroplating tin, lead and tin-lead alloys and baths therefor |
| US4871429A (en) * | 1981-09-11 | 1989-10-03 | Learonal, Inc | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
| US4717460A (en) * | 1983-12-22 | 1988-01-05 | Learonal, Inc. | Tin lead electroplating solutions |
| US4565609A (en) * | 1983-12-22 | 1986-01-21 | Learonal, Inc. | Bath and process for plating tin, lead and tin-lead alloys |
| US4617097A (en) * | 1983-12-22 | 1986-10-14 | Learonal, Inc. | Process and electrolyte for electroplating tin, lead or tin-lead alloys |
| US4565610A (en) * | 1983-12-22 | 1986-01-21 | Learonal, Inc. | Bath and process for plating lead and lead/tin alloys |
| US4701244A (en) * | 1983-12-22 | 1987-10-20 | Learonal, Inc. | Bath and process for electroplating tin, lead and tin/alloys |
| US4749626A (en) * | 1985-08-05 | 1988-06-07 | Olin Corporation | Whisker resistant tin coatings and baths and methods for making such coatings |
| KR960008155B1 (ko) * | 1988-10-14 | 1996-06-20 | 엠 앤드 티 케미칼즈, 아이엔씨. | 주석-비스무트 합금의 전기도금법 |
| US5039576A (en) * | 1989-05-22 | 1991-08-13 | Atochem North America, Inc. | Electrodeposited eutectic tin-bismuth alloy on a conductive substrate |
| US5393573A (en) * | 1991-07-16 | 1995-02-28 | Microelectronics And Computer Technology Corporation | Method of inhibiting tin whisker growth |
| US5450784A (en) * | 1993-09-28 | 1995-09-19 | Detroit Diesel Corporation | Electroplated piston skirt for improved scuff resistance |
| US5391402A (en) * | 1993-12-03 | 1995-02-21 | Motorola | Immersion plating of tin-bismuth solder |
| JP4728462B2 (ja) * | 2000-02-29 | 2011-07-20 | 日本リーロナール有限会社 | 錫電気めっき液及びめっき方法 |
| US20090145764A1 (en) * | 2007-12-11 | 2009-06-11 | Enthone Inc. | Composite coatings for whisker reduction |
| US8226807B2 (en) * | 2007-12-11 | 2012-07-24 | Enthone Inc. | Composite coatings for whisker reduction |
| JP6084112B2 (ja) * | 2013-05-09 | 2017-02-22 | 株式会社荏原製作所 | Ｓｎ合金めっき装置およびＳｎ合金めっき方法 |
| US9850588B2 (en) | 2015-09-09 | 2017-12-26 | Rohm And Haas Electronic Materials Llc | Bismuth electroplating baths and methods of electroplating bismuth on a substrate |
| KR102579360B1 (ko) * | 2018-12-04 | 2023-09-18 | 현대자동차주식회사 | 차량의 보조 브레이크 제어 시스템 |
| CN111188069A (zh) * | 2019-12-31 | 2020-05-22 | 大连长丰实业总公司 | 一种镀锡铋合金溶液及其制备方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL54999C (enrdf_load_stackoverflow) * | 1938-03-07 | |||
| US3360446A (en) * | 1964-05-08 | 1967-12-26 | M & T Chemicals Inc | Electrodepositing a tin-bismuth alloy and additives therefor |
| GB1051927A (enrdf_load_stackoverflow) * | 1964-07-10 |
-
1969
- 1969-12-19 FR FR6944284A patent/FR2071199A5/fr not_active Expired
-
1970
- 1970-10-08 US US79272A patent/US3663384A/en not_active Expired - Lifetime
- 1970-10-13 DE DE19702050145 patent/DE2050145A1/de active Pending
- 1970-11-26 GB GB56352/70A patent/GB1299519A/en not_active Expired
- 1970-11-27 JP JP45104187A patent/JPS4931606B1/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4331518A (en) * | 1981-01-09 | 1982-05-25 | Vulcan Materials Company | Bismuth composition, method of electroplating a tin-bismuth alloy and electroplating bath therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| GB1299519A (en) | 1972-12-13 |
| FR2071199A5 (enrdf_load_stackoverflow) | 1971-09-17 |
| US3663384A (en) | 1972-05-16 |
| JPS4931606B1 (enrdf_load_stackoverflow) | 1974-08-23 |
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