DE2048067A1 - Halbleiteranordnung - Google Patents

Halbleiteranordnung

Info

Publication number
DE2048067A1
DE2048067A1 DE19702048067 DE2048067A DE2048067A1 DE 2048067 A1 DE2048067 A1 DE 2048067A1 DE 19702048067 DE19702048067 DE 19702048067 DE 2048067 A DE2048067 A DE 2048067A DE 2048067 A1 DE2048067 A1 DE 2048067A1
Authority
DE
Germany
Prior art keywords
semiconductor
assembly
stack
elements
semiconductor elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19702048067
Other languages
German (de)
English (en)
Inventor
Edwin Studlev Carmllus N Y Smith jun (VStA)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of DE2048067A1 publication Critical patent/DE2048067A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE19702048067 1969-10-02 1970-09-30 Halbleiteranordnung Pending DE2048067A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86320869A 1969-10-02 1969-10-02

Publications (1)

Publication Number Publication Date
DE2048067A1 true DE2048067A1 (de) 1971-04-22

Family

ID=25340554

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19702048067 Pending DE2048067A1 (de) 1969-10-02 1970-09-30 Halbleiteranordnung
DE7036187U Expired DE7036187U (de) 1969-10-02 1970-09-30 Halbleiteranordnung.

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE7036187U Expired DE7036187U (de) 1969-10-02 1970-09-30 Halbleiteranordnung.

Country Status (6)

Country Link
JP (1) JPS50353B1 (enExample)
DE (2) DE2048067A1 (enExample)
FR (1) FR2064104B1 (enExample)
GB (1) GB1320412A (enExample)
IE (1) IE34521B1 (enExample)
SE (1) SE365067B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3415446A1 (de) * 1983-04-25 1984-10-25 Mitsubishi Denki K.K., Tokio/Tokyo Gegossene harz-halbleitervorrichtung

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof
JPS63193160U (enExample) * 1987-05-30 1988-12-13
WO2023107117A1 (en) 2021-12-10 2023-06-15 Vishay General Semiconductor, Llc Stacked multi-chip structure with enhanced protection

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB716243A (en) * 1951-04-05 1954-09-29 Standard Telephones Cables Ltd Improvements in or relating to electrically conducting cements
FR1481857A (fr) * 1964-08-07 1967-05-19 Rca Corp Procédé de fabrication de dispositifs semiconducteurs à empilage et dispositifs semiconducteurs obtenus par ce procédé
US3423638A (en) * 1964-09-02 1969-01-21 Gti Corp Micromodular package with compression means holding contacts engaged
US3416046A (en) * 1965-12-13 1968-12-10 Dickson Electronics Corp Encased zener diode assembly and method of producing same
FR1544424A (fr) * 1966-11-14 1968-10-31 Gen Electric Perfectionnements aux dispositifs à semiconducteurs encapsulés

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3415446A1 (de) * 1983-04-25 1984-10-25 Mitsubishi Denki K.K., Tokio/Tokyo Gegossene harz-halbleitervorrichtung
US4849803A (en) * 1983-04-25 1989-07-18 Mitsubishi Denki Kabushiki Kaisha Molded resin semiconductor device

Also Published As

Publication number Publication date
GB1320412A (en) 1973-06-13
SE365067B (enExample) 1974-03-11
DE7036187U (de) 1972-04-27
IE34521B1 (en) 1975-05-28
IE34521L (en) 1971-04-02
FR2064104A1 (enExample) 1971-07-16
JPS50353B1 (enExample) 1975-01-08
FR2064104B1 (enExample) 1974-04-26

Similar Documents

Publication Publication Date Title
DE2542518C3 (enExample)
DE1933731A1 (de) Verbindungselemente fuer Halbleiterschaltungselemente und integrierte Schaltungsanordnungen
DE2137211A1 (de) Hybrider Leistungsbaustein
DE2116828A1 (de) Elektrischer (Sicherungs ) Schmelzeinsatz
DE69422463T2 (de) Halbleiteranordnung mit einem Halbleiterchip mit Rückseitenelektrode
DE3233195A1 (de) Halbleitervorrichtung
DE1965546A1 (de) Halbleiterbauelement
DE1955221A1 (de) Integrierte Halbleiter-Schaltkreise
DE2559360A1 (de) Halbleiterbauteil mit integrierten schaltkreisen
DE2226613A1 (de) Halbleiterbauelement
DE112019003036B4 (de) Aluminiumkompatibler dünnfilmwiderstand (tfr) und herstellungsverfahren
DE1961314A1 (de) Geschuetztes Halbleiterbauelement und Verfahren zu seiner Herstellung
DE2109191A1 (de) Halbleiterbauelement und Verfahren zu seiner Herstellung
DE1627762A1 (de) Verfahren zum Herstellen von Halbleiterbauelementen
DE69330249T2 (de) Leistungsverpackung mit hoher Zuverlässigkeit für eine elektronische Halbleiterschaltung
DE1589695A1 (de) Verfahren zum Herstellen von Halbleiterbauelementen aus einer Halbleiterplatte
DE2238185A1 (de) Metalloxid-varistorkoerper mit elektronischer schaltungseinheit
DE3109074A1 (de) Halbleitervorrichtung und verfahren zu ihrer herstellung
DE2649935A1 (de) Referenzdiode
DE2004776C2 (de) Halbleiterbauelement
DE2117365A1 (de) Integrierte Schaltung und Verfahren zu ihrer Herstellung
DE112009005017T5 (de) Halbleitervorrichtung und Verfahren zur Herstellung einer Halbleitervorrichtung
DE102004048688A1 (de) Halbleitervorrichtung
DE2048067A1 (de) Halbleiteranordnung
DE2608813C3 (de) Niedrigsperrende Zenerdiode