SE365067B - - Google Patents
Info
- Publication number
- SE365067B SE365067B SE13268/70A SE1326870A SE365067B SE 365067 B SE365067 B SE 365067B SE 13268/70 A SE13268/70 A SE 13268/70A SE 1326870 A SE1326870 A SE 1326870A SE 365067 B SE365067 B SE 365067B
- Authority
- SE
- Sweden
Links
Classifications
-
- H10W72/00—
-
- H10W74/121—
-
- H10W74/131—
-
- H10W76/40—
-
- H10W90/00—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US86320869A | 1969-10-02 | 1969-10-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE365067B true SE365067B (enExample) | 1974-03-11 |
Family
ID=25340554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE13268/70A SE365067B (enExample) | 1969-10-02 | 1970-09-30 |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS50353B1 (enExample) |
| DE (2) | DE7036187U (enExample) |
| FR (1) | FR2064104B1 (enExample) |
| GB (1) | GB1320412A (enExample) |
| IE (1) | IE34521B1 (enExample) |
| SE (1) | SE365067B (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5623759A (en) * | 1979-08-01 | 1981-03-06 | Hitachi Ltd | Resin-sealed semiconductor device and manufacture thereof |
| JPS59198740A (ja) * | 1983-04-25 | 1984-11-10 | Mitsubishi Electric Corp | 樹脂封止形半導体複合素子 |
| JPS63193160U (enExample) * | 1987-05-30 | 1988-12-13 | ||
| CN118451792A (zh) * | 2021-12-10 | 2024-08-06 | 维谢综合半导体有限责任公司 | 具有增强的保护的堆叠式多芯片结构 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB716243A (en) * | 1951-04-05 | 1954-09-29 | Standard Telephones Cables Ltd | Improvements in or relating to electrically conducting cements |
| FR1481857A (fr) * | 1964-08-07 | 1967-05-19 | Rca Corp | Procédé de fabrication de dispositifs semiconducteurs à empilage et dispositifs semiconducteurs obtenus par ce procédé |
| US3423638A (en) * | 1964-09-02 | 1969-01-21 | Gti Corp | Micromodular package with compression means holding contacts engaged |
| US3416046A (en) * | 1965-12-13 | 1968-12-10 | Dickson Electronics Corp | Encased zener diode assembly and method of producing same |
| FR1544424A (fr) * | 1966-11-14 | 1968-10-31 | Gen Electric | Perfectionnements aux dispositifs à semiconducteurs encapsulés |
-
1970
- 1970-09-24 IE IE1188/70A patent/IE34521B1/xx unknown
- 1970-09-25 GB GB4589570A patent/GB1320412A/en not_active Expired
- 1970-09-30 DE DE7036187U patent/DE7036187U/de not_active Expired
- 1970-09-30 SE SE13268/70A patent/SE365067B/xx unknown
- 1970-09-30 DE DE19702048067 patent/DE2048067A1/de active Pending
- 1970-10-01 FR FR7035545A patent/FR2064104B1/fr not_active Expired
- 1970-10-02 JP JP45086320A patent/JPS50353B1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| GB1320412A (en) | 1973-06-13 |
| DE7036187U (de) | 1972-04-27 |
| IE34521L (en) | 1971-04-02 |
| FR2064104B1 (enExample) | 1974-04-26 |
| IE34521B1 (en) | 1975-05-28 |
| JPS50353B1 (enExample) | 1975-01-08 |
| FR2064104A1 (enExample) | 1971-07-16 |
| DE2048067A1 (de) | 1971-04-22 |