GB1320412A - Semiconductor devices - Google Patents

Semiconductor devices

Info

Publication number
GB1320412A
GB1320412A GB4589570A GB4589570A GB1320412A GB 1320412 A GB1320412 A GB 1320412A GB 4589570 A GB4589570 A GB 4589570A GB 4589570 A GB4589570 A GB 4589570A GB 1320412 A GB1320412 A GB 1320412A
Authority
GB
United Kingdom
Prior art keywords
stack
conductors
resin
moulded
connectors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4589570A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of GB1320412A publication Critical patent/GB1320412A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
GB4589570A 1969-10-02 1970-09-25 Semiconductor devices Expired GB1320412A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86320869A 1969-10-02 1969-10-02

Publications (1)

Publication Number Publication Date
GB1320412A true GB1320412A (en) 1973-06-13

Family

ID=25340554

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4589570A Expired GB1320412A (en) 1969-10-02 1970-09-25 Semiconductor devices

Country Status (6)

Country Link
JP (1) JPS50353B1 (enExample)
DE (2) DE2048067A1 (enExample)
FR (1) FR2064104B1 (enExample)
GB (1) GB1320412A (enExample)
IE (1) IE34521B1 (enExample)
SE (1) SE365067B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4523371A (en) * 1979-08-01 1985-06-18 Yoshiaki Wakashima Method of fabricating a resin mold type semiconductor device
WO2023107117A1 (en) 2021-12-10 2023-06-15 Vishay General Semiconductor, Llc Stacked multi-chip structure with enhanced protection

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59198740A (ja) * 1983-04-25 1984-11-10 Mitsubishi Electric Corp 樹脂封止形半導体複合素子
JPS63193160U (enExample) * 1987-05-30 1988-12-13

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB716243A (en) * 1951-04-05 1954-09-29 Standard Telephones Cables Ltd Improvements in or relating to electrically conducting cements
FR1481857A (fr) * 1964-08-07 1967-05-19 Rca Corp Procédé de fabrication de dispositifs semiconducteurs à empilage et dispositifs semiconducteurs obtenus par ce procédé
US3423638A (en) * 1964-09-02 1969-01-21 Gti Corp Micromodular package with compression means holding contacts engaged
US3416046A (en) * 1965-12-13 1968-12-10 Dickson Electronics Corp Encased zener diode assembly and method of producing same
FR1544424A (fr) * 1966-11-14 1968-10-31 Gen Electric Perfectionnements aux dispositifs à semiconducteurs encapsulés

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4523371A (en) * 1979-08-01 1985-06-18 Yoshiaki Wakashima Method of fabricating a resin mold type semiconductor device
WO2023107117A1 (en) 2021-12-10 2023-06-15 Vishay General Semiconductor, Llc Stacked multi-chip structure with enhanced protection
EP4430926A4 (en) * 2021-12-10 2025-07-16 Vishay Gen Semiconductor Llc STACKED MULTI-LAYER STRUCTURE WITH ENHANCED PROTECTION

Also Published As

Publication number Publication date
SE365067B (enExample) 1974-03-11
DE7036187U (de) 1972-04-27
IE34521B1 (en) 1975-05-28
IE34521L (en) 1971-04-02
DE2048067A1 (de) 1971-04-22
FR2064104A1 (enExample) 1971-07-16
JPS50353B1 (enExample) 1975-01-08
FR2064104B1 (enExample) 1974-04-26

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees