IE34521L - Series connection of semiconductor elements - Google Patents

Series connection of semiconductor elements

Info

Publication number
IE34521L
IE34521L IE701188A IE118870A IE34521L IE 34521 L IE34521 L IE 34521L IE 701188 A IE701188 A IE 701188A IE 118870 A IE118870 A IE 118870A IE 34521 L IE34521 L IE 34521L
Authority
IE
Ireland
Prior art keywords
stack
conductors
resin
moulded
connectors
Prior art date
Application number
IE701188A
Other versions
IE34521B1 (en
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of IE34521L publication Critical patent/IE34521L/en
Publication of IE34521B1 publication Critical patent/IE34521B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/074—Stacked arrangements of non-apertured devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
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    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
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    • H01L2924/01—Chemical elements
    • H01L2924/0101—Neon [Ne]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/01015—Phosphorus [P]
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    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
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    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
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    • H01L2924/01033—Arsenic [As]
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    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
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    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
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    • H01L2924/0106—Neodymium [Nd]
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    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
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    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
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    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12043—Photo diode
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
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    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

1320412 Semi-conductor devices GENERAL ELECTRIC CO 25 Sept 1970 [2 Oct 1969] 45895/70 Heading H1K A subassembly consisting of a stack of semiconductor junction elements bonded together in series between a pair of junctionless low resistivity semi-conductor connectors is mounted with the connectors making low-resistance connection with the formed ends of conductors projecting up from a substrate into which they are moulded or stuck, or with conductors extending on to lands projecting from the surface of a substrate and on to which the connectors also extend, the low-resistance connections in either case being made by a mass of curable plastics containing conductive particles. The curing temperature of the plastics is below the softening temperature of the stack bonding material. In all cases the stack has a passivating coating and is encapsulated in a fabricated housing or in moulded plastics. The elements are etched and rinsed and the passivation applied after attaching the stack to the conductors. In assembling the Fig. 1 arrangement notched conductors 106 are forced apart to permit insertion of the stack between them. The conductive bonding material supplements the resulting pressure contact or, Fig. 2 (not shown), may replace it entirely. A cold setting resin loaded with silver, gold, or aluminium particles may be used but to avoid thermal stress in operation it is preferred to use a resin which is cured at a temperature above those occurring in operation. Suitable passivants are resins, glass and silicon oxide or nitride over oxide but silicone varnish with an overcoat of cold setting silicone resin is preferred. The moulded encapsulation is preferably of epoxy, silicone or phenolic resin. As shown the junction elements are of PN type, but use of PIN, PNP, NPN, and NPNP elements is also suggested. [GB1320412A]
IE1188/70A 1969-10-02 1970-09-24 Semiconductor devices IE34521B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86320869A 1969-10-02 1969-10-02

Publications (2)

Publication Number Publication Date
IE34521L true IE34521L (en) 1971-04-02
IE34521B1 IE34521B1 (en) 1975-05-28

Family

ID=25340554

Family Applications (1)

Application Number Title Priority Date Filing Date
IE1188/70A IE34521B1 (en) 1969-10-02 1970-09-24 Semiconductor devices

Country Status (6)

Country Link
JP (1) JPS50353B1 (en)
DE (2) DE7036187U (en)
FR (1) FR2064104B1 (en)
GB (1) GB1320412A (en)
IE (1) IE34521B1 (en)
SE (1) SE365067B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof
JPS59198740A (en) * 1983-04-25 1984-11-10 Mitsubishi Electric Corp Resin seal type semiconductor compound element
JPS63193160U (en) * 1987-05-30 1988-12-13

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB716243A (en) * 1951-04-05 1954-09-29 Standard Telephones Cables Ltd Improvements in or relating to electrically conducting cements
FR1481857A (en) * 1964-08-07 1967-05-19 Rca Corp Method of manufacturing stacked semiconductor devices and semiconductor devices obtained by this method
US3423638A (en) * 1964-09-02 1969-01-21 Gti Corp Micromodular package with compression means holding contacts engaged
US3416046A (en) * 1965-12-13 1968-12-10 Dickson Electronics Corp Encased zener diode assembly and method of producing same
FR1544424A (en) * 1966-11-14 1968-10-31 Gen Electric Enhancements to Encapsulated Semiconductor Devices

Also Published As

Publication number Publication date
FR2064104A1 (en) 1971-07-16
GB1320412A (en) 1973-06-13
SE365067B (en) 1974-03-11
IE34521B1 (en) 1975-05-28
DE2048067A1 (en) 1971-04-22
FR2064104B1 (en) 1974-04-26
JPS50353B1 (en) 1975-01-08
DE7036187U (en) 1972-04-27

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