FR1544424A - Enhancements to Encapsulated Semiconductor Devices - Google Patents

Enhancements to Encapsulated Semiconductor Devices

Info

Publication number
FR1544424A
FR1544424A FR128063A FR128063A FR1544424A FR 1544424 A FR1544424 A FR 1544424A FR 128063 A FR128063 A FR 128063A FR 128063 A FR128063 A FR 128063A FR 1544424 A FR1544424 A FR 1544424A
Authority
FR
France
Prior art keywords
enhancements
semiconductor devices
encapsulated semiconductor
encapsulated
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR128063A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Priority to FR128063A priority Critical patent/FR1544424A/en
Application granted granted Critical
Publication of FR1544424A publication Critical patent/FR1544424A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
FR128063A 1966-11-14 1967-11-14 Enhancements to Encapsulated Semiconductor Devices Expired FR1544424A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR128063A FR1544424A (en) 1966-11-14 1967-11-14 Enhancements to Encapsulated Semiconductor Devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US59389966A 1966-11-14 1966-11-14
FR128063A FR1544424A (en) 1966-11-14 1967-11-14 Enhancements to Encapsulated Semiconductor Devices

Publications (1)

Publication Number Publication Date
FR1544424A true FR1544424A (en) 1968-10-31

Family

ID=26180755

Family Applications (1)

Application Number Title Priority Date Filing Date
FR128063A Expired FR1544424A (en) 1966-11-14 1967-11-14 Enhancements to Encapsulated Semiconductor Devices

Country Status (1)

Country Link
FR (1) FR1544424A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2064104A1 (en) * 1969-10-02 1971-07-16 Gen Electric
US3986201A (en) * 1973-12-27 1976-10-12 Licentia Patent-Verwaltungs-G.M.B.H. High output wafer-shaped semiconductor component with plastic coating

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2064104A1 (en) * 1969-10-02 1971-07-16 Gen Electric
US3986201A (en) * 1973-12-27 1976-10-12 Licentia Patent-Verwaltungs-G.M.B.H. High output wafer-shaped semiconductor component with plastic coating

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