GB1320412A - Semiconductor devices - Google Patents
Semiconductor devicesInfo
- Publication number
- GB1320412A GB1320412A GB4589570A GB4589570A GB1320412A GB 1320412 A GB1320412 A GB 1320412A GB 4589570 A GB4589570 A GB 4589570A GB 4589570 A GB4589570 A GB 4589570A GB 1320412 A GB1320412 A GB 1320412A
- Authority
- GB
- United Kingdom
- Prior art keywords
- stack
- conductors
- resin
- moulded
- connectors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/074—Stacked arrangements of non-apertured devices
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H01L2924/01005—Boron [B]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0101—Neon [Ne]
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- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H01L2924/01015—Phosphorus [P]
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- H01L2924/01019—Potassium [K]
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- H01L2924/01027—Cobalt [Co]
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- H01L2924/01033—Arsenic [As]
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- H01L2924/01046—Palladium [Pd]
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- H01L2924/01047—Silver [Ag]
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- H01L2924/0106—Neodymium [Nd]
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- H01L2924/01078—Platinum [Pt]
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- H01L2924/01079—Gold [Au]
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- H01L2924/01082—Lead [Pb]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12043—Photo diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
1320412 Semi-conductor devices GENERAL ELECTRIC CO 25 Sept 1970 [2 Oct 1969] 45895/70 Heading H1K A subassembly consisting of a stack of semiconductor junction elements bonded together in series between a pair of junctionless low resistivity semi-conductor connectors is mounted with the connectors making low-resistance connection with the formed ends of conductors projecting up from a substrate into which they are moulded or stuck, or with conductors extending on to lands projecting from the surface of a substrate and on to which the connectors also extend, the low-resistance connections in either case being made by a mass of curable plastics containing conductive particles. The curing temperature of the plastics is below the softening temperature of the stack bonding material. In all cases the stack has a passivating coating and is encapsulated in a fabricated housing or in moulded plastics. The elements are etched and rinsed and the passivation applied after attaching the stack to the conductors. In assembling the Fig. 1 arrangement notched conductors 106 are forced apart to permit insertion of the stack between them. The conductive bonding material supplements the resulting pressure contact or, Fig. 2 (not shown), may replace it entirely. A cold setting resin loaded with silver, gold, or aluminium particles may be used but to avoid thermal stress in operation it is preferred to use a resin which is cured at a temperature above those occurring in operation. Suitable passivants are resins, glass and silicon oxide or nitride over oxide but silicone varnish with an overcoat of cold setting silicone resin is preferred. The moulded encapsulation is preferably of epoxy, silicone or phenolic resin. As shown the junction elements are of PN type, but use of PIN, PNP, NPN, and NPNP elements is also suggested.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US86320869A | 1969-10-02 | 1969-10-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1320412A true GB1320412A (en) | 1973-06-13 |
Family
ID=25340554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB4589570A Expired GB1320412A (en) | 1969-10-02 | 1970-09-25 | Semiconductor devices |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS50353B1 (en) |
DE (2) | DE2048067A1 (en) |
FR (1) | FR2064104B1 (en) |
GB (1) | GB1320412A (en) |
IE (1) | IE34521B1 (en) |
SE (1) | SE365067B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4523371A (en) * | 1979-08-01 | 1985-06-18 | Yoshiaki Wakashima | Method of fabricating a resin mold type semiconductor device |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59198740A (en) * | 1983-04-25 | 1984-11-10 | Mitsubishi Electric Corp | Resin seal type semiconductor compound element |
JPS63193160U (en) * | 1987-05-30 | 1988-12-13 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB716243A (en) * | 1951-04-05 | 1954-09-29 | Standard Telephones Cables Ltd | Improvements in or relating to electrically conducting cements |
FR1481857A (en) * | 1964-08-07 | 1967-05-19 | Rca Corp | Method of manufacturing stacked semiconductor devices and semiconductor devices obtained by this method |
US3423638A (en) * | 1964-09-02 | 1969-01-21 | Gti Corp | Micromodular package with compression means holding contacts engaged |
US3416046A (en) * | 1965-12-13 | 1968-12-10 | Dickson Electronics Corp | Encased zener diode assembly and method of producing same |
FR1544424A (en) * | 1966-11-14 | 1968-10-31 | Gen Electric | Enhancements to Encapsulated Semiconductor Devices |
-
1970
- 1970-09-24 IE IE1188/70A patent/IE34521B1/en unknown
- 1970-09-25 GB GB4589570A patent/GB1320412A/en not_active Expired
- 1970-09-30 DE DE19702048067 patent/DE2048067A1/en active Pending
- 1970-09-30 SE SE13268/70A patent/SE365067B/xx unknown
- 1970-09-30 DE DE7036187U patent/DE7036187U/en not_active Expired
- 1970-10-01 FR FR7035545A patent/FR2064104B1/fr not_active Expired
- 1970-10-02 JP JP45086320A patent/JPS50353B1/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4523371A (en) * | 1979-08-01 | 1985-06-18 | Yoshiaki Wakashima | Method of fabricating a resin mold type semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
FR2064104A1 (en) | 1971-07-16 |
DE2048067A1 (en) | 1971-04-22 |
DE7036187U (en) | 1972-04-27 |
IE34521B1 (en) | 1975-05-28 |
FR2064104B1 (en) | 1974-04-26 |
IE34521L (en) | 1971-04-02 |
JPS50353B1 (en) | 1975-01-08 |
SE365067B (en) | 1974-03-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PLNP | Patent lapsed through nonpayment of renewal fees |