IE34521B1 - Semiconductor devices - Google Patents

Semiconductor devices

Info

Publication number
IE34521B1
IE34521B1 IE1188/70A IE118870A IE34521B1 IE 34521 B1 IE34521 B1 IE 34521B1 IE 1188/70 A IE1188/70 A IE 1188/70A IE 118870 A IE118870 A IE 118870A IE 34521 B1 IE34521 B1 IE 34521B1
Authority
IE
Ireland
Prior art keywords
stack
conductors
resin
moulded
connectors
Prior art date
Application number
IE1188/70A
Other languages
English (en)
Other versions
IE34521L (en
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of IE34521L publication Critical patent/IE34521L/xx
Publication of IE34521B1 publication Critical patent/IE34521B1/xx

Links

Classifications

    • H10W72/00—
    • H10W74/121—
    • H10W74/131—
    • H10W76/40—
    • H10W90/00—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
IE1188/70A 1969-10-02 1970-09-24 Semiconductor devices IE34521B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86320869A 1969-10-02 1969-10-02

Publications (2)

Publication Number Publication Date
IE34521L IE34521L (en) 1971-04-02
IE34521B1 true IE34521B1 (en) 1975-05-28

Family

ID=25340554

Family Applications (1)

Application Number Title Priority Date Filing Date
IE1188/70A IE34521B1 (en) 1969-10-02 1970-09-24 Semiconductor devices

Country Status (6)

Country Link
JP (1) JPS50353B1 (enExample)
DE (2) DE7036187U (enExample)
FR (1) FR2064104B1 (enExample)
GB (1) GB1320412A (enExample)
IE (1) IE34521B1 (enExample)
SE (1) SE365067B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof
JPS59198740A (ja) * 1983-04-25 1984-11-10 Mitsubishi Electric Corp 樹脂封止形半導体複合素子
JPS63193160U (enExample) * 1987-05-30 1988-12-13
CN118451792A (zh) * 2021-12-10 2024-08-06 维谢综合半导体有限责任公司 具有增强的保护的堆叠式多芯片结构

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB716243A (en) * 1951-04-05 1954-09-29 Standard Telephones Cables Ltd Improvements in or relating to electrically conducting cements
FR1481857A (fr) * 1964-08-07 1967-05-19 Rca Corp Procédé de fabrication de dispositifs semiconducteurs à empilage et dispositifs semiconducteurs obtenus par ce procédé
US3423638A (en) * 1964-09-02 1969-01-21 Gti Corp Micromodular package with compression means holding contacts engaged
US3416046A (en) * 1965-12-13 1968-12-10 Dickson Electronics Corp Encased zener diode assembly and method of producing same
FR1544424A (fr) * 1966-11-14 1968-10-31 Gen Electric Perfectionnements aux dispositifs à semiconducteurs encapsulés

Also Published As

Publication number Publication date
GB1320412A (en) 1973-06-13
DE7036187U (de) 1972-04-27
IE34521L (en) 1971-04-02
SE365067B (enExample) 1974-03-11
FR2064104B1 (enExample) 1974-04-26
JPS50353B1 (enExample) 1975-01-08
FR2064104A1 (enExample) 1971-07-16
DE2048067A1 (de) 1971-04-22

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