DE2023439A1 - Verfahren und Vorrichtung zur Bearbeitung von Gegenständen - Google Patents

Verfahren und Vorrichtung zur Bearbeitung von Gegenständen

Info

Publication number
DE2023439A1
DE2023439A1 DE19702023439 DE2023439A DE2023439A1 DE 2023439 A1 DE2023439 A1 DE 2023439A1 DE 19702023439 DE19702023439 DE 19702023439 DE 2023439 A DE2023439 A DE 2023439A DE 2023439 A1 DE2023439 A1 DE 2023439A1
Authority
DE
Germany
Prior art keywords
tool
abrasive
workpiece
base
circular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19702023439
Other languages
German (de)
English (en)
Inventor
Donald Frank Johnstown; Yandrick Rudolph Michael Indiana; Pa. Stahr (V.St.A.). P B24b
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FMC Corp
Original Assignee
FMC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FMC Corp filed Critical FMC Corp
Publication of DE2023439A1 publication Critical patent/DE2023439A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/128—Preparing bulk and homogeneous wafers by edge treatment, e.g. chamfering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/02—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work
    • B24B5/14—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding conical surfaces, e.g. of centres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
DE19702023439 1969-06-03 1970-05-13 Verfahren und Vorrichtung zur Bearbeitung von Gegenständen Pending DE2023439A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82996169A 1969-06-03 1969-06-03

Publications (1)

Publication Number Publication Date
DE2023439A1 true DE2023439A1 (de) 1970-12-17

Family

ID=25256002

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19702023439 Pending DE2023439A1 (de) 1969-06-03 1970-05-13 Verfahren und Vorrichtung zur Bearbeitung von Gegenständen
DE7017942U Expired DE7017942U (de) 1969-06-03 1970-05-13 Vorrichtung zur bearbeitung von gegenstaenden.

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE7017942U Expired DE7017942U (de) 1969-06-03 1970-05-13 Vorrichtung zur bearbeitung von gegenstaenden.

Country Status (5)

Country Link
US (1) US3603039A (cg-RX-API-DMAC7.html)
CA (1) CA922110A (cg-RX-API-DMAC7.html)
DE (2) DE2023439A1 (cg-RX-API-DMAC7.html)
ES (1) ES379540A1 (cg-RX-API-DMAC7.html)
GB (1) GB1258697A (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105150088A (zh) * 2015-08-28 2015-12-16 中国空间技术研究院 一种电子器件背面开孔减薄装置及减薄方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3805458A (en) * 1972-12-22 1974-04-23 Bell Telephone Labor Inc Technique for correcting the crystallographic orientation angle of crystals by double face lapping of overlapping layers
US3803774A (en) * 1972-12-22 1974-04-16 Bell Telephone Labor Inc Technique for correcting the crystallo-graphic orientation angle of crystals by the formation of mesas and double face lapping
US9044812B2 (en) 2011-08-03 2015-06-02 General Electric Company Jig and method for modifying casing in turbine system
CN112382706B (zh) * 2020-11-13 2021-06-11 吴炜强 一种用于半导体发光元件的加工设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1048059A (en) * 1910-09-07 1912-12-24 Antonio Foppiano Machine for cutting holes in glass, marble, and like material.
US1241236A (en) * 1915-06-08 1917-09-25 Maurice Mathy Machine for grinding the rims of glass vessels.
US2395700A (en) * 1943-03-23 1946-02-26 Alncin Inc Method and apparatus for shaping optical objects and the like
US3158968A (en) * 1962-08-23 1964-12-01 Bell Telephone Labor Inc Grinding apparatus and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105150088A (zh) * 2015-08-28 2015-12-16 中国空间技术研究院 一种电子器件背面开孔减薄装置及减薄方法

Also Published As

Publication number Publication date
CA922110A (en) 1973-03-06
US3603039A (en) 1971-09-07
ES379540A1 (es) 1973-04-01
DE7017942U (de) 1973-04-26
GB1258697A (cg-RX-API-DMAC7.html) 1971-12-30

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