GB1258697A - - Google Patents

Info

Publication number
GB1258697A
GB1258697A GB1258697DA GB1258697A GB 1258697 A GB1258697 A GB 1258697A GB 1258697D A GB1258697D A GB 1258697DA GB 1258697 A GB1258697 A GB 1258697A
Authority
GB
United Kingdom
Prior art keywords
bevel
abrasive
article
tool
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1258697A publication Critical patent/GB1258697A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02021—Edge treatment, chamfering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/02—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work
    • B24B5/14—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding conical surfaces, e.g. of centres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

1,258,697. Grinding. FMC CORP. 19 May, 1970 [3 June, 1969], No. 24109/70. Heading B3D. A method of forming a bevel on an article, such as a disc of silicon, comprises mounting the article in a fixed position, disposing a quantity of abrasive material on the surface to be worked, engaging the abrasive with a moving tool surface having a configuration substantially the reverse of the bevel to force the abrasive into contact with the surface of the article, and maintaining the pressure until the bevel is formed. In apparatus for carrying out the method, a tool 30 made of tool steel is mounted in the chuck 32 of a drill press and has its lower surface formed with a recess having a frusto-conical wall 34. The article, such as a silicon wafer W, is secured by wax to a support 40, and abrasive, which may be diamond lapping material, is placed as a ribbon around the periphery of the lap. The tool 30 is thus rotated and lowered to cause the abrasive to form the bevel on the wafer. A gauge having a diameter D may be used to check the size of the bevel. After the bevel has been ground, the lapping material may be wiped off the wafer with a sheet of paper, the paper burnt, and the residue collected so that the lapping material can be separated for further use.
GB1258697D 1969-06-03 1970-05-19 Expired GB1258697A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82996169A 1969-06-03 1969-06-03

Publications (1)

Publication Number Publication Date
GB1258697A true GB1258697A (en) 1971-12-30

Family

ID=25256002

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1258697D Expired GB1258697A (en) 1969-06-03 1970-05-19

Country Status (5)

Country Link
US (1) US3603039A (en)
CA (1) CA922110A (en)
DE (2) DE2023439A1 (en)
ES (1) ES379540A1 (en)
GB (1) GB1258697A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112382706A (en) * 2020-11-13 2021-02-19 吴炜强 Processing equipment for semiconductor light-emitting element

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3805458A (en) * 1972-12-22 1974-04-23 Bell Telephone Labor Inc Technique for correcting the crystallographic orientation angle of crystals by double face lapping of overlapping layers
US3803774A (en) * 1972-12-22 1974-04-16 Bell Telephone Labor Inc Technique for correcting the crystallo-graphic orientation angle of crystals by the formation of mesas and double face lapping
US9044812B2 (en) 2011-08-03 2015-06-02 General Electric Company Jig and method for modifying casing in turbine system
CN105150088A (en) * 2015-08-28 2015-12-16 中国空间技术研究院 Device and method for perforating and thinning back sides of electronic devices

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1048059A (en) * 1910-09-07 1912-12-24 Antonio Foppiano Machine for cutting holes in glass, marble, and like material.
US1241236A (en) * 1915-06-08 1917-09-25 Maurice Mathy Machine for grinding the rims of glass vessels.
US2395700A (en) * 1943-03-23 1946-02-26 Alncin Inc Method and apparatus for shaping optical objects and the like
US3158968A (en) * 1962-08-23 1964-12-01 Bell Telephone Labor Inc Grinding apparatus and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112382706A (en) * 2020-11-13 2021-02-19 吴炜强 Processing equipment for semiconductor light-emitting element

Also Published As

Publication number Publication date
ES379540A1 (en) 1973-04-01
DE7017942U (en) 1973-04-26
US3603039A (en) 1971-09-07
CA922110A (en) 1973-03-06
DE2023439A1 (en) 1970-12-17

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees