JPS6464773A - Method for polishing semiconductor wafer - Google Patents
Method for polishing semiconductor waferInfo
- Publication number
- JPS6464773A JPS6464773A JP62218643A JP21864387A JPS6464773A JP S6464773 A JPS6464773 A JP S6464773A JP 62218643 A JP62218643 A JP 62218643A JP 21864387 A JP21864387 A JP 21864387A JP S6464773 A JPS6464773 A JP S6464773A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- tackifier layer
- tackifier
- base board
- holding base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
PURPOSE:To polish a semiconductor wafer with a simple process without need for using wax by polishing the semiconductor wafer in a condition that it is held by a wafer holding base board via a specific tackifier layer. CONSTITUTION:A tackifier layer 3 consisting of tackifier and a radiation polymerization compound is provided on a wafer holding base board 2. Then, a semiconductor wafer 1 is stuck to the top of the tackifier layer 3 and, in this condition, the surface of the semiconductor wafer 1 is polished into a specular surface by means of abrasive grains such as silica, etc. After the end of the polishing operation, the tackifier layer 3 is irradiated with a radiation to lower the tackiness of the tackifier layer 3, and the polished semiconductor wafer 1 is separated from the wafer holding base board 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62218643A JPS6464773A (en) | 1987-09-01 | 1987-09-01 | Method for polishing semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62218643A JPS6464773A (en) | 1987-09-01 | 1987-09-01 | Method for polishing semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6464773A true JPS6464773A (en) | 1989-03-10 |
Family
ID=16723164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62218643A Pending JPS6464773A (en) | 1987-09-01 | 1987-09-01 | Method for polishing semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6464773A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0810635A1 (en) * | 1996-05-31 | 1997-12-03 | MEMC Electronic Materials, Inc. | Method and apparatus for mounting a semiconductor wafer on a polishing block by applying radiant heat |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59157162A (en) * | 1983-02-26 | 1984-09-06 | Dainippon Printing Co Ltd | Pressure-sensitive adhesive composition peelable easily with water |
JPS61164777A (en) * | 1985-01-17 | 1986-07-25 | Toshiba Ceramics Co Ltd | Adhesive for silicone wafer |
-
1987
- 1987-09-01 JP JP62218643A patent/JPS6464773A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59157162A (en) * | 1983-02-26 | 1984-09-06 | Dainippon Printing Co Ltd | Pressure-sensitive adhesive composition peelable easily with water |
JPS61164777A (en) * | 1985-01-17 | 1986-07-25 | Toshiba Ceramics Co Ltd | Adhesive for silicone wafer |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0810635A1 (en) * | 1996-05-31 | 1997-12-03 | MEMC Electronic Materials, Inc. | Method and apparatus for mounting a semiconductor wafer on a polishing block by applying radiant heat |
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