JPS6464773A - Method for polishing semiconductor wafer - Google Patents

Method for polishing semiconductor wafer

Info

Publication number
JPS6464773A
JPS6464773A JP62218643A JP21864387A JPS6464773A JP S6464773 A JPS6464773 A JP S6464773A JP 62218643 A JP62218643 A JP 62218643A JP 21864387 A JP21864387 A JP 21864387A JP S6464773 A JPS6464773 A JP S6464773A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
tackifier layer
tackifier
base board
holding base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62218643A
Other languages
Japanese (ja)
Inventor
Kazuyoshi Ebe
Toshio Minagawa
Takanori Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FSK Corp
Original Assignee
FSK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FSK Corp filed Critical FSK Corp
Priority to JP62218643A priority Critical patent/JPS6464773A/en
Publication of JPS6464773A publication Critical patent/JPS6464773A/en
Pending legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE:To polish a semiconductor wafer with a simple process without need for using wax by polishing the semiconductor wafer in a condition that it is held by a wafer holding base board via a specific tackifier layer. CONSTITUTION:A tackifier layer 3 consisting of tackifier and a radiation polymerization compound is provided on a wafer holding base board 2. Then, a semiconductor wafer 1 is stuck to the top of the tackifier layer 3 and, in this condition, the surface of the semiconductor wafer 1 is polished into a specular surface by means of abrasive grains such as silica, etc. After the end of the polishing operation, the tackifier layer 3 is irradiated with a radiation to lower the tackiness of the tackifier layer 3, and the polished semiconductor wafer 1 is separated from the wafer holding base board 2.
JP62218643A 1987-09-01 1987-09-01 Method for polishing semiconductor wafer Pending JPS6464773A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62218643A JPS6464773A (en) 1987-09-01 1987-09-01 Method for polishing semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62218643A JPS6464773A (en) 1987-09-01 1987-09-01 Method for polishing semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS6464773A true JPS6464773A (en) 1989-03-10

Family

ID=16723164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62218643A Pending JPS6464773A (en) 1987-09-01 1987-09-01 Method for polishing semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS6464773A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0810635A1 (en) * 1996-05-31 1997-12-03 MEMC Electronic Materials, Inc. Method and apparatus for mounting a semiconductor wafer on a polishing block by applying radiant heat

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59157162A (en) * 1983-02-26 1984-09-06 Dainippon Printing Co Ltd Pressure-sensitive adhesive composition peelable easily with water
JPS61164777A (en) * 1985-01-17 1986-07-25 Toshiba Ceramics Co Ltd Adhesive for silicone wafer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59157162A (en) * 1983-02-26 1984-09-06 Dainippon Printing Co Ltd Pressure-sensitive adhesive composition peelable easily with water
JPS61164777A (en) * 1985-01-17 1986-07-25 Toshiba Ceramics Co Ltd Adhesive for silicone wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0810635A1 (en) * 1996-05-31 1997-12-03 MEMC Electronic Materials, Inc. Method and apparatus for mounting a semiconductor wafer on a polishing block by applying radiant heat

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