ES379540A1 - Un metodo y un aparato para formar una superficie de confi-guracion deseada en un articulo. - Google Patents

Un metodo y un aparato para formar una superficie de confi-guracion deseada en un articulo.

Info

Publication number
ES379540A1
ES379540A1 ES379540A ES379540A ES379540A1 ES 379540 A1 ES379540 A1 ES 379540A1 ES 379540 A ES379540 A ES 379540A ES 379540 A ES379540 A ES 379540A ES 379540 A1 ES379540 A1 ES 379540A1
Authority
ES
Spain
Prior art keywords
bevel
abrasive
article
tool
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES379540A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FMC Corp
Original Assignee
FMC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FMC Corp filed Critical FMC Corp
Publication of ES379540A1 publication Critical patent/ES379540A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02021—Edge treatment, chamfering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/02—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work
    • B24B5/14—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding conical surfaces, e.g. of centres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
ES379540A 1969-06-03 1970-05-11 Un metodo y un aparato para formar una superficie de confi-guracion deseada en un articulo. Expired ES379540A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82996169A 1969-06-03 1969-06-03

Publications (1)

Publication Number Publication Date
ES379540A1 true ES379540A1 (es) 1973-04-01

Family

ID=25256002

Family Applications (1)

Application Number Title Priority Date Filing Date
ES379540A Expired ES379540A1 (es) 1969-06-03 1970-05-11 Un metodo y un aparato para formar una superficie de confi-guracion deseada en un articulo.

Country Status (5)

Country Link
US (1) US3603039A (es)
CA (1) CA922110A (es)
DE (2) DE2023439A1 (es)
ES (1) ES379540A1 (es)
GB (1) GB1258697A (es)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3805458A (en) * 1972-12-22 1974-04-23 Bell Telephone Labor Inc Technique for correcting the crystallographic orientation angle of crystals by double face lapping of overlapping layers
US3803774A (en) * 1972-12-22 1974-04-16 Bell Telephone Labor Inc Technique for correcting the crystallo-graphic orientation angle of crystals by the formation of mesas and double face lapping
US9044812B2 (en) 2011-08-03 2015-06-02 General Electric Company Jig and method for modifying casing in turbine system
CN105150088A (zh) * 2015-08-28 2015-12-16 中国空间技术研究院 一种电子器件背面开孔减薄装置及减薄方法
CN112382706B (zh) * 2020-11-13 2021-06-11 吴炜强 一种用于半导体发光元件的加工设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1048059A (en) * 1910-09-07 1912-12-24 Antonio Foppiano Machine for cutting holes in glass, marble, and like material.
US1241236A (en) * 1915-06-08 1917-09-25 Maurice Mathy Machine for grinding the rims of glass vessels.
US2395700A (en) * 1943-03-23 1946-02-26 Alncin Inc Method and apparatus for shaping optical objects and the like
US3158968A (en) * 1962-08-23 1964-12-01 Bell Telephone Labor Inc Grinding apparatus and method

Also Published As

Publication number Publication date
US3603039A (en) 1971-09-07
DE7017942U (de) 1973-04-26
DE2023439A1 (de) 1970-12-17
GB1258697A (es) 1971-12-30
CA922110A (en) 1973-03-06

Similar Documents

Publication Publication Date Title
ES457466A1 (es) Un procedimiento para tratar una superficie metalica de una pieza mecanica.
CA2073388A1 (en) Method of machining silicon nitride ceramics and silicon nitride ceramics products
JPS5789551A (en) Grinding process for sapphire wafer
CA961633A (en) Method of and apparatus for controlling chucking pressures on workpieces in machine tools
ES379540A1 (es) Un metodo y un aparato para formar una superficie de confi-guracion deseada en un articulo.
US2634558A (en) Piezoelectric crystal lapping apparatus
DE3775655D1 (de) Verfahren und vorrichtung zum mechanischen schleifen und polieren der flaeche eines mineralischen materials, insbesondere aus glas.
JPS57170538A (en) Polishing method for one side of semiconductor wafer
US2394671A (en) Profile grinding machine
ATE175916T1 (de) Polierverfahren, hierzu bestimmte vorrichtung und schwabbel-/polierscheibe
ES2011495A6 (es) Procedimiento automatico de movimiento discontinuo para calibrar espesores de manufacturas de granito u otras piedras duras.
CN106903565A (zh) 磨削设备、磨削方法及用于玻璃生产设备的碳化硅板
US3292312A (en) Method of abrading a workpiece
JPS57144654A (en) Polishing method for high density magnetic disk substrate
GB1540517A (en) Grinding method and apparatus
JPS5613728A (en) Grinding method for semiconductor wafer
GB1319597A (en) Method and means for finishing an aperture
GB1349864A (en) Four-spindle surface grinding machine
US2326848A (en) Surface working method
JPS51111993A (en) Apparatus for fabricating thin work as semiconductor or the like
JPS57132954A (en) Grinding method and device for flat annular surface
GB1381763A (en) Device dor detecting and compensating wear of tools in machine tools
JPS5934143Y2 (ja) 真空チヤツクの吸着部
JPS57147241A (en) Bonding method for crystal wafer
JPS5437989A (en) Grinder in apparatus for repairing inner surface of steel pipes