DE19983067T1 - Lötmittelpulver, Flussmittel, Lötmittelpaste, Lötmethode, gelötete Leiterplatte und Lotverbindungsprodukt - Google Patents

Lötmittelpulver, Flussmittel, Lötmittelpaste, Lötmethode, gelötete Leiterplatte und Lotverbindungsprodukt

Info

Publication number
DE19983067T1
DE19983067T1 DE19983067T DE19983067T DE19983067T1 DE 19983067 T1 DE19983067 T1 DE 19983067T1 DE 19983067 T DE19983067 T DE 19983067T DE 19983067 T DE19983067 T DE 19983067T DE 19983067 T1 DE19983067 T1 DE 19983067T1
Authority
DE
Germany
Prior art keywords
solder
flux
circuit board
soldering method
connection product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19983067T
Other languages
English (en)
Inventor
Hitoshi Amita
Takashi Shoji
Shunsuke Nagasaki
Yoshinori Shibuya
Isamu Taguchi
Noriko Murase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27564097&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE19983067(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of DE19983067T1 publication Critical patent/DE19983067T1/de
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3616—Halogen compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE19983067T 1998-06-10 1999-06-10 Lötmittelpulver, Flussmittel, Lötmittelpaste, Lötmethode, gelötete Leiterplatte und Lotverbindungsprodukt Ceased DE19983067T1 (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP16185498 1998-06-10
JP33689898 1998-11-27
JP2647299 1999-02-03
JP8893599 1999-03-30
US13583999P 1999-05-24 1999-05-24
US13584199P 1999-05-24 1999-05-24
US13584299P 1999-05-24 1999-05-24
PCT/JP1999/003095 WO1999064199A1 (fr) 1998-06-10 1999-06-10 Poudre de soudage, fondant, pate de soudage, procede de soudage, carte a circuit soudee et produit de jonction soude

Publications (1)

Publication Number Publication Date
DE19983067T1 true DE19983067T1 (de) 2001-05-17

Family

ID=27564097

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19983067T Ceased DE19983067T1 (de) 1998-06-10 1999-06-10 Lötmittelpulver, Flussmittel, Lötmittelpaste, Lötmethode, gelötete Leiterplatte und Lotverbindungsprodukt

Country Status (5)

Country Link
JP (1) JP3385272B2 (de)
KR (2) KR100411229B1 (de)
AU (1) AU4164999A (de)
DE (1) DE19983067T1 (de)
WO (1) WO1999064199A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019110781A1 (en) * 2017-12-08 2019-06-13 Solvay Sa Compositions for brazing of aluminium and aluminium alloys and their use

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001358438A (ja) * 2000-04-14 2001-12-26 Matsushita Electric Ind Co Ltd 導電性接合材料
JP2002033346A (ja) * 2000-07-18 2002-01-31 Showa Denko Kk ハンダバンプ電極の形成に用いるハンダペースト
JP2002263884A (ja) * 2001-03-09 2002-09-17 Showa Denko Kk ハンダ付け用フラックスおよびハンダペースト
JP2002361476A (ja) * 2001-06-08 2002-12-18 Showa Denko Kk ハンダ金属、ハンダペースト、ハンダ付け方法、ハンダ付けした回路板、及びハンダ付けした接合物
JP2003001487A (ja) * 2001-06-15 2003-01-08 Showa Denko Kk ハンダ付けフラックス
KR100400606B1 (ko) * 2001-09-08 2003-10-08 정재필 저융점 무연솔더 도금층을 이용한 2중 프리코팅 기판 및그 제조방법
KR100765146B1 (ko) 2006-06-15 2007-10-12 배상준 솔더 페이스트 및 이를 이용한 솔더 범프 형성방법
US7569164B2 (en) 2007-01-29 2009-08-04 Harima Chemicals, Inc. Solder precoating method
JP5086222B2 (ja) * 2008-10-17 2012-11-28 株式会社タムラ製作所 回路基板はんだ付用ソルダーペーストおよび回路基板
KR20130129392A (ko) * 2010-11-22 2013-11-28 도와 일렉트로닉스 가부시키가이샤 접합재료, 접합체, 및 접합방법
JP6293514B2 (ja) * 2014-02-27 2018-03-14 株式会社タムラ製作所 はんだ組成物およびプリント配線基板の製造方法
JP6888900B2 (ja) * 2014-11-13 2021-06-18 三菱マテリアル株式会社 Ａｕ−Ｓｎ合金はんだペースト、Ａｕ−Ｓｎ合金はんだ層の製造方法、及びＡｕ−Ｓｎ合金はんだ層
JP5816947B1 (ja) * 2015-02-05 2015-11-18 株式会社弘輝 フラックス用活性剤、フラックス及びはんだ
JP2018060786A (ja) * 2016-09-28 2018-04-12 積水化学工業株式会社 導電材料及び接続構造体
JP6275311B1 (ja) * 2017-05-31 2018-02-07 株式会社タムラ製作所 ソルダペースト及びはんだ接合部
KR102325435B1 (ko) 2017-11-09 2021-11-12 한국전자기술연구원 유연인쇄회로기판상 유연센서 접합방법, 및 유연센서가 접합된 유연센서인쇄회로기판
KR102145215B1 (ko) * 2018-07-30 2020-08-18 경북대학교 산학협력단 치과용 코발트계 합금의 레이저 용접 페이스트 조성물, 치과용 코발트계 합금의 용접방법, 이에 따라 제조된 치과용 코발트계 합금 및 이를 포함하는 치과용 보철물
JP6624410B1 (ja) * 2019-03-08 2019-12-25 千住金属工業株式会社 フラックス回収装置、はんだ付け装置及びフラックス除去方法

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
JPS57118891A (en) * 1981-01-14 1982-07-23 Taruchin Kk Paste solder
JPS6012295A (ja) * 1983-06-30 1985-01-22 Ginya Ishii はんだペ−スト組成物
JPH0394994A (ja) * 1989-09-05 1991-04-19 Senju Metal Ind Co Ltd クリームはんだ
JP2608995B2 (ja) * 1991-02-12 1997-05-14 松下電器産業株式会社 光ビーム加熱半田用ソルダーペースト
JP3273961B2 (ja) * 1991-12-18 2002-04-15 トヨタ自動車株式会社 クリームはんだ
JP3148478B2 (ja) * 1993-08-19 2001-03-19 株式会社豊田中央研究所 はんだ付け用フラックス
JP2641841B2 (ja) * 1994-04-25 1997-08-20 株式会社ニホンゲンマ クリームはんだ
JPH08243782A (ja) * 1995-03-08 1996-09-24 Toshiba Corp はんだ合金およびそれを用いたはんだ付け方法
JP3755916B2 (ja) * 1995-07-18 2006-03-15 富士通株式会社 フラックス組成物、ソルダペースト組成物及びそれを用いたプリント配線板の実装方法
JPH09239585A (ja) * 1996-03-11 1997-09-16 Toyota Central Res & Dev Lab Inc はんだ付け用フラックスおよびそれを用いたクリームはんだ
JP3379679B2 (ja) * 1996-06-10 2003-02-24 千住金属工業株式会社 ソルダペースト
JPH106074A (ja) * 1996-06-20 1998-01-13 Harima Chem Inc ソルダペースト組成物
JP3177197B2 (ja) * 1996-10-18 2001-06-18 昭和電工株式会社 はんだペースト
JP3774311B2 (ja) * 1998-01-19 2006-05-10 昭和電工株式会社 はんだペースト
JP3075277B2 (ja) * 1999-01-18 2000-08-14 松下電器産業株式会社 光学情報記録原盤作製方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019110781A1 (en) * 2017-12-08 2019-06-13 Solvay Sa Compositions for brazing of aluminium and aluminium alloys and their use

Also Published As

Publication number Publication date
KR20020081592A (ko) 2002-10-28
WO1999064199A1 (fr) 1999-12-16
JP3385272B2 (ja) 2003-03-10
AU4164999A (en) 1999-12-30
KR20010074480A (ko) 2001-08-04
KR100411229B1 (ko) 2003-12-18
KR100427092B1 (ko) 2004-04-17

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