AU4164999A - Solder powder, flux, solder paste, method for soldering, soldered circuit board and soldered junction product - Google Patents
Solder powder, flux, solder paste, method for soldering, soldered circuit board and soldered junction productInfo
- Publication number
- AU4164999A AU4164999A AU41649/99A AU4164999A AU4164999A AU 4164999 A AU4164999 A AU 4164999A AU 41649/99 A AU41649/99 A AU 41649/99A AU 4164999 A AU4164999 A AU 4164999A AU 4164999 A AU4164999 A AU 4164999A
- Authority
- AU
- Australia
- Prior art keywords
- soldered
- soldering
- flux
- circuit board
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3615—N-compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3616—Halogen compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0266—Size distribution
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (15)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16185498 | 1998-06-10 | ||
JP10/161854 | 1998-06-10 | ||
JP10/336898 | 1998-11-27 | ||
JP33689898 | 1998-11-27 | ||
JP11/26472 | 1999-02-03 | ||
JP2647299 | 1999-02-03 | ||
JP11/88935 | 1999-03-30 | ||
JP8893599 | 1999-03-30 | ||
US13584299P | 1999-05-24 | 1999-05-24 | |
US13584199P | 1999-05-24 | 1999-05-24 | |
US13583999P | 1999-05-24 | 1999-05-24 | |
US60135841 | 1999-05-24 | ||
US60135839 | 1999-05-24 | ||
US60135842 | 1999-05-24 | ||
PCT/JP1999/003095 WO1999064199A1 (en) | 1998-06-10 | 1999-06-10 | Solder powder, flux, solder paste, method for soldering, soldered circuit board and soldered junction product |
Publications (1)
Publication Number | Publication Date |
---|---|
AU4164999A true AU4164999A (en) | 1999-12-30 |
Family
ID=27564097
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU41649/99A Abandoned AU4164999A (en) | 1998-06-10 | 1999-06-10 | Solder powder, flux, solder paste, method for soldering, soldered circuit board and soldered junction product |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP3385272B2 (en) |
KR (2) | KR100411229B1 (en) |
AU (1) | AU4164999A (en) |
DE (1) | DE19983067T1 (en) |
WO (1) | WO1999064199A1 (en) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001358438A (en) * | 2000-04-14 | 2001-12-26 | Matsushita Electric Ind Co Ltd | Conductive bonding material |
JP2002033346A (en) * | 2000-07-18 | 2002-01-31 | Showa Denko Kk | Soldering paste used for forming solder bump electrode |
JP2002263884A (en) * | 2001-03-09 | 2002-09-17 | Showa Denko Kk | Soldering flux and solder paste |
JP2002361476A (en) * | 2001-06-08 | 2002-12-18 | Showa Denko Kk | Solder metal, solder paste, soldering method, soldered circuit board and soldered part |
JP2003001487A (en) * | 2001-06-15 | 2003-01-08 | Showa Denko Kk | Soldering flux |
KR100400606B1 (en) * | 2001-09-08 | 2003-10-08 | 정재필 | Double pre-coated substrate using lead free solder plated with low-melting-pointed alloy and manufacturing method thereof |
KR100765146B1 (en) | 2006-06-15 | 2007-10-12 | 배상준 | Solder paste and method of forming solder bumps using the same |
US7569164B2 (en) | 2007-01-29 | 2009-08-04 | Harima Chemicals, Inc. | Solder precoating method |
JP5086222B2 (en) * | 2008-10-17 | 2012-11-28 | 株式会社タムラ製作所 | Solder paste for circuit board soldering and circuit board |
KR20130129392A (en) * | 2010-11-22 | 2013-11-28 | 도와 일렉트로닉스 가부시키가이샤 | Binding material, binding body, and binding method |
JP6293514B2 (en) * | 2014-02-27 | 2018-03-14 | 株式会社タムラ製作所 | Solder composition and printed wiring board manufacturing method |
JP6888900B2 (en) * | 2014-11-13 | 2021-06-18 | 三菱マテリアル株式会社 | Au-Sn alloy solder paste, method of manufacturing Au-Sn alloy solder layer, and Au-Sn alloy solder layer |
JP5816947B1 (en) * | 2015-02-05 | 2015-11-18 | 株式会社弘輝 | Activator for flux, flux and solder |
JP2018060786A (en) * | 2016-09-28 | 2018-04-12 | 積水化学工業株式会社 | Conductive material and connection structure |
JP6275311B1 (en) * | 2017-05-31 | 2018-02-07 | 株式会社タムラ製作所 | Solder paste and solder joint |
KR102325435B1 (en) | 2017-11-09 | 2021-11-12 | 한국전자기술연구원 | Method for bonding flexible sensor on fpcb, and fpcb bonded flexible sensor |
WO2019110781A1 (en) * | 2017-12-08 | 2019-06-13 | Solvay Sa | Compositions for brazing of aluminium and aluminium alloys and their use |
KR102145215B1 (en) * | 2018-07-30 | 2020-08-18 | 경북대학교 산학협력단 | LASER WELDING PASTE COMPOSITION FOR DENTAL Co-Cr ALLOY, WELDING METHOD FOR MANUFACTURING DENTAL Co-Cr ALLOY, DENTAL Co-Cr ALLOY BY USING THE METHOD AND DENTAL PROSTHESIS INCLUDING THE DENTAL Co-Cr ALLOY |
JP6624410B1 (en) * | 2019-03-08 | 2019-12-25 | 千住金属工業株式会社 | Flux recovery device, soldering device and flux removal method |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57118891A (en) * | 1981-01-14 | 1982-07-23 | Taruchin Kk | Paste solder |
JPS6012295A (en) * | 1983-06-30 | 1985-01-22 | Ginya Ishii | Composition for solder paste |
JPH0394994A (en) * | 1989-09-05 | 1991-04-19 | Senju Metal Ind Co Ltd | Cream solder |
JP2608995B2 (en) * | 1991-02-12 | 1997-05-14 | 松下電器産業株式会社 | Solder paste for light beam heating solder |
JP3273961B2 (en) * | 1991-12-18 | 2002-04-15 | トヨタ自動車株式会社 | Cream solder |
JP3148478B2 (en) * | 1993-08-19 | 2001-03-19 | 株式会社豊田中央研究所 | Flux for soldering |
JP2641841B2 (en) * | 1994-04-25 | 1997-08-20 | 株式会社ニホンゲンマ | Cream solder |
JPH08243782A (en) * | 1995-03-08 | 1996-09-24 | Toshiba Corp | Solder alloy and soldering method using the same |
JP3755916B2 (en) * | 1995-07-18 | 2006-03-15 | 富士通株式会社 | Flux composition, solder paste composition, and printed wiring board mounting method using the same |
JPH09239585A (en) * | 1996-03-11 | 1997-09-16 | Toyota Central Res & Dev Lab Inc | Flux for soldering and cream solder formed by using the same |
JP3379679B2 (en) * | 1996-06-10 | 2003-02-24 | 千住金属工業株式会社 | Solder paste |
JPH106074A (en) * | 1996-06-20 | 1998-01-13 | Harima Chem Inc | Solder paste composition |
JP3177197B2 (en) * | 1996-10-18 | 2001-06-18 | 昭和電工株式会社 | Solder paste |
JP3774311B2 (en) * | 1998-01-19 | 2006-05-10 | 昭和電工株式会社 | Solder paste |
JP3075277B2 (en) * | 1999-01-18 | 2000-08-14 | 松下電器産業株式会社 | Optical information recording master production method |
-
1999
- 1999-06-10 AU AU41649/99A patent/AU4164999A/en not_active Abandoned
- 1999-06-10 DE DE19983067T patent/DE19983067T1/en not_active Ceased
- 1999-06-10 KR KR10-2000-7011247A patent/KR100411229B1/en not_active IP Right Cessation
- 1999-06-10 KR KR10-2002-7012727A patent/KR100427092B1/en not_active IP Right Cessation
- 1999-06-10 JP JP2000553246A patent/JP3385272B2/en not_active Expired - Fee Related
- 1999-06-10 WO PCT/JP1999/003095 patent/WO1999064199A1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
DE19983067T1 (en) | 2001-05-17 |
KR20020081592A (en) | 2002-10-28 |
WO1999064199A1 (en) | 1999-12-16 |
JP3385272B2 (en) | 2003-03-10 |
KR20010074480A (en) | 2001-08-04 |
KR100411229B1 (en) | 2003-12-18 |
KR100427092B1 (en) | 2004-04-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |