JPH0394994A - Cream solder - Google Patents
Cream solderInfo
- Publication number
- JPH0394994A JPH0394994A JP22842489A JP22842489A JPH0394994A JP H0394994 A JPH0394994 A JP H0394994A JP 22842489 A JP22842489 A JP 22842489A JP 22842489 A JP22842489 A JP 22842489A JP H0394994 A JPH0394994 A JP H0394994A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- cream solder
- amine
- flux
- cream
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 54
- 239000006071 cream Substances 0.000 title claims abstract description 32
- 230000004907 flux Effects 0.000 claims abstract description 14
- -1 alicyclic amine Chemical class 0.000 claims abstract description 4
- 239000007788 liquid Substances 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 claims description 3
- 150000004982 aromatic amines Chemical class 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 abstract description 8
- 238000007639 printing Methods 0.000 abstract description 8
- 239000000843 powder Substances 0.000 abstract description 7
- 238000005476 soldering Methods 0.000 abstract description 7
- 238000005219 brazing Methods 0.000 abstract 1
- 235000011837 pasties Nutrition 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007665 sagging Methods 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプリント基板と電子部品とをはんだ付けするに
適したクリームはんだに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cream solder suitable for soldering printed circuit boards and electronic components.
一般にプリント基板と電子部品のはんだ付けには、プリ
ント基板のはんだ付け部と一致するところに穴のあいた
スクリーンを用い、該スクリーンでプリント基板のはん
だ付け箇所にクリームはんだを印刷塗布してから、プリ
ント基板に電子部品を搭載し、しかる後、適宜な加熱装
置で加熱する方法が採られている。該はんだ付けに用い
るクリームはんだとしては次のような条件を満足するも
のでなければならない。Generally, when soldering printed circuit boards and electronic components, a screen with holes in the same places as the soldering parts of the printed circuit board is used. Cream solder is printed and applied to the soldered parts of the printed circuit board using the screen, and then the soldering part is printed. A method has been adopted in which electronic components are mounted on a substrate and then heated with an appropriate heating device. The cream solder used for the soldering must satisfy the following conditions.
○はんだ付け性が良好であること
プリント基板のランドや電子部品のリードに対して良好
な濡れ性を有し、かつランド間に酸化物や微小はんだボ
ールを発生させないものでなければならない。酸化物や
微小はんだボールが多発すると絶紗性が悪くなる。○ Good solderability It must have good wettability to the lands of printed circuit boards and leads of electronic components, and must not generate oxides or minute solder balls between the lands. If oxides and minute solder balls occur frequently, the gauze integrity will deteriorate.
Ｏ印刷性が良いこと
スクリーンに形成したパターンどおり、クリームはんだ
がきれいに印刷できるとともに、全ての印刷箇所に塗布
されなければならない。Good printing properties The cream solder must be able to be printed neatly in accordance with the pattern formed on the screen, and must be applied to all printed areas.
Ｏダレないこと
プリント基板に印刷塗布後、予備加熱した時にクリーム
はんだの形状がダレてはんだ付け部以外に流出しないこ
と。ダレが起こると隣接したランド間にブリッヂを形成
してしまうことがある。No sag When preheated after printing on a printed circuit board, the shape of the cream solder should not sag and flow outside the soldered area. When sag occurs, a bridge may be formed between adjacent lands.
０経時変化の少ないこと
クリームはんだは経時変化すると、粘度が高くなって印
刷性を悪くし、また粉末はんだがフラックスと反応して
はんだ付け性を悪くしてしまう。従って、クリームはん
だは経時変化が少ないものでなければならない。0. Little change over time When cream solder changes over time, its viscosity increases and printability deteriorates, and powdered solder reacts with flux and deteriorates solderability. Therefore, the cream solder must have little change over time.
上記条件は、ほとんどがフラックスによって影響される
ものであるが、はんだ付け性、印刷性、ダレ性等は粉末
はんだ、特にその形状が多いに影響してくるものである
。一般に粉末はんだの形状としては球形と不定形（多く
は芋状）とがあるが、はんだ付け性、印刷性については
球形の方が良好な結果となる。なぜならば球形のものは
スクリーンに引掛からないためスクリーンの穴への充填
やスクリーンからの抜けが円滑となり印刷不良が少なく
なるからである。また球形粉末はんだは、これを作る時
に不活性雰囲気で作るため粉末はんだの表面が酸化され
てなく、しかも酸化物の混入が少ない。従って球形の粉
末はんだを用いたクリームはんだは濡れ性が良好となり
、酸化物や微小はんだボールの発生は少ないものである
。Most of the above conditions are influenced by the flux, but solderability, printability, sag resistance, etc. are greatly influenced by the powder solder, especially its shape. Powdered solder generally has a spherical shape and an irregular shape (often potato-like), but the spherical shape gives better results in terms of solderability and printability. This is because spherical particles do not get caught on the screen, so filling holes in the screen and coming out of the screen are smooth, reducing printing defects. Furthermore, since spherical powder solder is manufactured in an inert atmosphere, the surface of the powder solder is not oxidized and there is little oxide contamination. Therefore, cream solder using spherical powdered solder has good wettability and generates fewer oxides and minute solder balls.
この様に球形の粉末はんだを用いたクリームはんだは、
印刷性やはんだ付け性の面では優れているといえるが、
ダレ性の面ではかえって悪い方に影響してしまうもので
ある。つまり、球形粉末はんだを用いたクリームはんだ
は印刷塗布後、粉末はんだ同志のからみあいかないため
、はんだ付け時の予備加熱でフラックスの粘度が下がる
と粉末同志が滑ってダレを起こしてしまうものであった
。In this way, cream solder using spherical powdered solder is
Although it can be said to be excellent in terms of printability and solderability,
In terms of sagging properties, this actually has a negative effect. In other words, cream solder using spherical powdered solder does not intertwine with each other after being printed and applied, so if the viscosity of the flux decreases during preheating during soldering, the powdered solder will slip and sag. .
ところで、従来のクリームはんだのブラックスは、主成
分となる松脂、フラックスと粉末はんだの分離を防ぐチ
キソ剤、はんだ付け性を良好にする活性剤、およびこれ
らの成分を溶解して液状またはペースト状にする溶剤等
から構成されていたものであった。By the way, conventional cream solder blacks consists of pine resin as the main ingredient, a thixotropic agent to prevent separation of flux and powdered solder, an activator to improve solderability, and a liquid or paste by dissolving these ingredients. It was made up of a solvent and the like.
従来のクリームはんだのフラックスでは球形の粉末はん
だを用いた場合はダレを阻止することができなかったし
、また経時変化の起こりやすいものであった。本発明は
球形の粉末はんだを用いるにもかかわらずダレにくく、
しかも経時変化の起こりにくいクリームはんだを提供す
ることにある．〔課題を解決するための手段〕
本発明者らがクリームはんだの経時変化について鋭意研
究を重ねた結果、フラックスのＰ Ｈ値が多いに関係し
ていることが分かった。つまり、ブラックスのＰＨが小
さくなるとクリームはんだは経時変化を起こしやすくな
ってしまうものである。Conventional cream solder flux was unable to prevent sagging when spherical powder solder was used, and was also susceptible to deterioration over time. Although the present invention uses spherical powder solder, it does not sag easily.
Moreover, the objective is to provide cream solder that does not easily change over time. [Means for Solving the Problems] As a result of intensive research by the present inventors on the aging of cream solder, it was found that it is related to the large PH value of the flux. In other words, as the pH of the black decreases, cream solder tends to change over time.
特にそのＰＨ値が６よりも小さくなると経時変化ところ
、アミンがＰＨの調整に適しており、しかも或る種のア
ミンにはクリームはんだのダレを抑制する効果も備わっ
ていることを知り得て本発明を完成させた。In particular, when the pH value becomes smaller than 6, it changes over time.However, I learned that amines are suitable for adjusting the pH, and that some types of amines also have the effect of suppressing the dripping of cream solder. completed the invention.
本発明は、粉末はんだと液状またはペースト状ブラック
スを混和したクリームはんだにおいて、該フラックス中
にアルカノールアミン、芳香族アミンおよび脂環式アミ
ンの中から選ばれた一種または二種以上をＯ．１〜１０
重漬％添加したことを特徴とするクリームはんだである
。The present invention provides a cream solder that is a mixture of powdered solder and liquid or paste black, in which one or more selected from alkanolamines, aromatic amines, and alicyclic amines are added to the flux. 1-10
This is a cream solder characterized by the addition of heavy immersion.
クリームはんだのフラックス中へのアミンの添加量が０
．１重量％より少ないと経時変化を阻止する効果もまた
ダレを防止する効果も現れない。The amount of amine added to the flux of cream solder is 0.
．． If the amount is less than 1% by weight, neither the effect of preventing changes over time nor the effect of preventing sag will be exhibited.
しかるにアミンの添加竜が１０重量％を超えると粘度が
高くなり過ぎて印刷性を悪くしてしまう。However, if the amount of amine added exceeds 10% by weight, the viscosity becomes too high and printability deteriorates.
実施例および比較例を第１表に示す。 Examples and comparative examples are shown in Table 1.
なお、成分の数値は重量％であり、実施例および比較例
のクリームはんだはこれらのフラックスを１０重量％と
球形の粉末はんだ（６３Ｓｎ−Ｐｂ、２５０メッシュ）
を９０重竜％の割合で混和したものである。Note that the numerical values of the components are weight %, and the cream solders of the examples and comparative examples contain 10 weight % of these fluxes and spherical powder solder (63Sn-Pb, 250 mesh).
It is a mixture of 90% heavy dragon.
※１ダレ率
板厚０．３ｍｍのステンレス板に直径５ｌＴｌｌＴｌの
穴（ＤＩ）を穿設した孔板で銅板にクリームはんだを印
刷塗布し、２４時間室内に放置後、１５０℃で２０秒間
加熱してダレを起こさせる。この時のクリームはんだの
直径（Ｄ２）を測定し、次式によりダレ率を算出する。*1 Sagging rate Print and apply cream solder to a copper plate using a perforated plate with holes (DI) of 5lTllTl in diameter on a stainless steel plate with a plate thickness of 0.3mm, leave it indoors for 24 hours, and then heat it at 150℃ for 20 seconds. It makes you drool. The diameter (D2) of the cream solder at this time is measured, and the sag rate is calculated using the following formula.
Ｄ＋
※２経時変化（印刷性）
クリームはんだ製造後、密封容器に充填して室温にて１
週間放置。該クリームはんだをリードピッチ０．５ｍｍ
、リード巾０．５ｍｍのＱＦＰ搭載用プリント基板にそ
れ用のスクリーンを用いて印刷塗布し、印刷状態を観察
する。D+ *2 Change over time (printability) After producing cream solder, fill it in a sealed container and store it at room temperature.
Leave it alone for a week. Lead pitch of the cream solder is 0.5mm
, using a screen for printing on a QFP mounting printed circuit board with a lead width of 0.5 mm, and observing the printing condition.
※３はんだ付け性（はんだボール）
上記経時変化（印刷ｒ．）の試験でクリームはんだが印
刷塗布されたプリント基板を遠赤外線式リフロー炉（本
加熱２００℃）で加熱してクＪ−ムはんだを溶融し、は
んだ付け部周辺に発生した微小はんだボールの発生状態
を観察する。*3 Solderability (solder balls) In the above aging test (printing r.), a printed circuit board coated with cream solder was heated in a far-infrared reflow oven (main heating 200°C) to form cream solder. to observe the formation of minute solder balls around the soldered area.
本発明のクリームはんだは経時変化が起きにくいため印
刷性やはんだ付け性が良好となるばかりか、印刷後のダ
レも少ないことから隣合ったランド間にブリッヂを形成
することがないという信頼あるはんだ付け部が得られる
ものである。The cream solder of the present invention not only has good printability and solderability because it does not easily change over time, but also has less sag after printing, so it is a reliable solder that does not form bridges between adjacent lands. The attached part is obtained.
Claims (1)
たクリームはんだにおいて、該フラックス中にアルカノ
ールアミン、芳香族アミンおよび脂環式アミンの中から
選ばれた一種または二種以上を０．１〜１０重量％添加
したことを特徴とするクリームはんだ。In cream solder that is a mixture of powdered solder and liquid or paste flux, 0.1 to 10% by weight of one or more selected from alkanolamines, aromatic amines, and alicyclic amines is added to the flux. A cream solder characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22842489A JPH0394994A (en) | 1989-09-05 | 1989-09-05 | Cream solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22842489A JPH0394994A (en) | 1989-09-05 | 1989-09-05 | Cream solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0394994A true JPH0394994A (en) | 1991-04-19 |
Family
ID=16876262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22842489A Pending JPH0394994A (en) | 1989-09-05 | 1989-09-05 | Cream solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0394994A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07241695A (en) * | 1994-03-07 | 1995-09-19 | Nippon Genma:Kk | Cream solder |
| JP3385272B2 (en) * | 1998-06-10 | 2003-03-10 | 昭和電工株式会社 | Solder powder, flux, solder paste, soldering method, soldered circuit board, and soldered joint |
| US6881278B2 (en) | 1998-06-10 | 2005-04-19 | Showa Denko K.K. | Flux for solder paste |
-
1989
- 1989-09-05 JP JP22842489A patent/JPH0394994A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07241695A (en) * | 1994-03-07 | 1995-09-19 | Nippon Genma:Kk | Cream solder |
| JP3385272B2 (en) * | 1998-06-10 | 2003-03-10 | 昭和電工株式会社 | Solder powder, flux, solder paste, soldering method, soldered circuit board, and soldered joint |
| US6881278B2 (en) | 1998-06-10 | 2005-04-19 | Showa Denko K.K. | Flux for solder paste |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102183512B1 (en) | Solder paste | |
| KR101059710B1 (en) | Solder paste and printed circuit board | |
| EP2826589B1 (en) | Flux, solder composition and method for producing electronic circuit mounting substrate | |
| TWI651370B (en) | Flux and solder paste for soldering | |
| JP2008510620A (en) | Solder composition, solder joint method, and solder joint structure | |
| JPS63220992A (en) | Method for soldering electronic parts to base plate | |
| JP2002113590A (en) | Solder paste | |
| JP2000094179A (en) | Solder paste and manufacture of the same and method for solder precoating | |
| JP2000317682A (en) | Solder powder and manufacture thereof, and solder paste | |
| JPH1133776A (en) | Soldering material and electronic part using thereof | |
| JPH0394994A (en) | Cream solder | |
| JP2006326598A (en) | Leadless solder paste composition, soldering method, and method for stabilizing joining of electronic component | |
| JPH09277082A (en) | Soldering paste | |
| JP4486287B2 (en) | Solder paste composition and reflow soldering method | |
| JP3193962B2 (en) | Solder paste | |
| JP3648697B2 (en) | Solder paste composition, method for producing printed wiring board having solder pads, and method for producing electronic component mounting circuit board | |
| JP2000176676A (en) | Resin flux cored solder, and its manufacture | |
| JP2002336993A (en) | Solder paste composition and reflow soldering method | |
| JP3158258B2 (en) | Solder paste | |
| JPH09186449A (en) | Low residue solder paste composite and reflow solder method | |
| JPH08174265A (en) | Cream solder | |
| JP2521177B2 (en) | Printed circuit board solder coating method | |
| JPH0596396A (en) | Creamy solder | |
| JP3786405B2 (en) | Tin-zinc-based lead-free solder powder and method for producing the same | |
| JPH0929485A (en) | Flux composition, solder paste composition and method for packaging printed circuit board using the same |