GB2324058B - Reflow soldering method,and reflow soldering equipment for soldering by reflow soldering method - Google Patents

Reflow soldering method,and reflow soldering equipment for soldering by reflow soldering method

Info

Publication number
GB2324058B
GB2324058B GB9805394A GB9805394A GB2324058B GB 2324058 B GB2324058 B GB 2324058B GB 9805394 A GB9805394 A GB 9805394A GB 9805394 A GB9805394 A GB 9805394A GB 2324058 B GB2324058 B GB 2324058B
Authority
GB
United Kingdom
Prior art keywords
reflow soldering
soldering
reflow
equipment
soldering method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9805394A
Other versions
GB9805394D0 (en
GB2324058A (en
Inventor
Hiroaki Aiura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of GB9805394D0 publication Critical patent/GB9805394D0/en
Publication of GB2324058A publication Critical patent/GB2324058A/en
Application granted granted Critical
Publication of GB2324058B publication Critical patent/GB2324058B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
GB9805394A 1997-04-10 1998-03-16 Reflow soldering method,and reflow soldering equipment for soldering by reflow soldering method Expired - Fee Related GB2324058B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9091226A JPH10284832A (en) 1997-04-10 1997-04-10 Reflow soldering device

Publications (3)

Publication Number Publication Date
GB9805394D0 GB9805394D0 (en) 1998-05-06
GB2324058A GB2324058A (en) 1998-10-14
GB2324058B true GB2324058B (en) 2002-04-10

Family

ID=14020518

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9805394A Expired - Fee Related GB2324058B (en) 1997-04-10 1998-03-16 Reflow soldering method,and reflow soldering equipment for soldering by reflow soldering method

Country Status (5)

Country Link
JP (1) JPH10284832A (en)
KR (1) KR100270764B1 (en)
CN (1) CN1091567C (en)
GB (1) GB2324058B (en)
MY (1) MY142253A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5066262B2 (en) * 2008-09-18 2012-11-07 アルプス電気株式会社 Electrical component, mounting structure of electrical component, and mounting method of electrical component
DE102013217952B3 (en) * 2013-09-09 2014-11-06 Ersa Gmbh Device for supplying a hot gas stream
EP3167774A4 (en) * 2014-07-11 2018-03-07 Nichirei Foods Inc. Food heating device
EP3009220B1 (en) * 2014-10-17 2018-12-19 Rehm Thermal Systems GmbH Roller to roller production assembly for and method of concatenated continuous and discontinuous processing processes
US9647353B2 (en) 2015-05-13 2017-05-09 Commscope Technologies Llc Method and apparatus for forming interface between coaxial cable and connector
WO2016182641A1 (en) * 2015-05-13 2016-11-17 Commscope Technologies Llc Method and apparatus for forming interface between coaxial cable and connector
CN105562870A (en) * 2015-12-23 2016-05-11 南通富士通微电子股份有限公司 Soldering-flux-free backflow method adopting formic acid and formic acid backflow device
CN112620853B (en) * 2020-12-17 2022-07-01 江西超联半导体科技有限公司 Multifunctional reflow soldering device for producing light-emitting diode

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1538253A (en) * 1975-02-06 1979-01-17 Hague Int Energy conserving process furnace
JPH0422573A (en) * 1990-05-18 1992-01-27 Tamura Seisakusho Co Ltd Hot air reflow device
US5203487A (en) * 1991-03-26 1993-04-20 Hitachi Techno Engineering Co., Ltd. Reflow soldering method and system therefor

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4029465A (en) * 1975-02-06 1977-06-14 Hague International Corporation Energy conserving process furnace system and components thereof
US4771929A (en) * 1987-02-20 1988-09-20 Hollis Automation, Inc. Focused convection reflow soldering method and apparatus
JPH01275362A (en) * 1988-04-27 1989-11-06 Florm Co Ltd Transport device for base plate
JPH03207573A (en) * 1990-01-08 1991-09-10 Matsushita Electric Ind Co Ltd Method and apparatus for producing joined body
JPH0569119A (en) * 1991-01-17 1993-03-23 Nippon Haiburitsudo Kk Reflow furnace utilizing hot blast
JPH07231160A (en) * 1994-02-18 1995-08-29 Hitachi Techno Eng Co Ltd Reflow soldering device
JPH08250852A (en) * 1995-03-10 1996-09-27 Senju Metal Ind Co Ltd Reflow method, reflow furnace and hot air heater for the furnace

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1538253A (en) * 1975-02-06 1979-01-17 Hague Int Energy conserving process furnace
JPH0422573A (en) * 1990-05-18 1992-01-27 Tamura Seisakusho Co Ltd Hot air reflow device
US5203487A (en) * 1991-03-26 1993-04-20 Hitachi Techno Engineering Co., Ltd. Reflow soldering method and system therefor

Also Published As

Publication number Publication date
JPH10284832A (en) 1998-10-23
GB9805394D0 (en) 1998-05-06
KR100270764B1 (en) 2001-01-15
GB2324058A (en) 1998-10-14
JP2812675B1 (en) 1998-10-22
CN1091567C (en) 2002-09-25
KR19980081217A (en) 1998-11-25
MY142253A (en) 2010-11-15
CN1197366A (en) 1998-10-28

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20100316