MY142253A - Reflow soldering method, and reflow soldering equipment for soldering by breflow soldering method - Google Patents

Reflow soldering method, and reflow soldering equipment for soldering by breflow soldering method

Info

Publication number
MY142253A
MY142253A MYPI98001562A MYPI9801562A MY142253A MY 142253 A MY142253 A MY 142253A MY PI98001562 A MYPI98001562 A MY PI98001562A MY PI9801562 A MYPI9801562 A MY PI9801562A MY 142253 A MY142253 A MY 142253A
Authority
MY
Malaysia
Prior art keywords
soldering
reflow
breflow
equipment
heat exchange
Prior art date
Application number
MYPI98001562A
Inventor
Hiroaki Aiura
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of MY142253A publication Critical patent/MY142253A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing

Abstract

THE OUTSIDE AIR IS SUPPLIED BY A FAN MEMBER INTO A HEAT EXCHANGE MEMBER IN WHICH HEAT EXCHANGE IS PERFORMED BETWEEN THE OUTSIDE AIR AND THE INSIDE AIR OF DIFFERENT TEMPERATURES TO THEREBY REDUCE A TEMPERATURE DIFFERENCE. THE HEAT EXCHANGE MEMBER TO BE SUPPLIED WITH THE OUTSIDE AIR IS HEATED BY THE HEATED AIR DISCHARGED FROM THE HEATING MEMBER, THEREBY HEATING THE OUTSIDE AIR BEING SUPPLIED TO THE HEAT EXCHANGE MEMBER. THEN THE OUTSIDE THUS HEATED IS FURTHER HEATED TO A HIGH TEMPERATURE BY THE HEATING MEMBER.(FIG. 1)
MYPI98001562A 1997-04-10 1998-04-09 Reflow soldering method, and reflow soldering equipment for soldering by breflow soldering method MY142253A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9091226A JPH10284832A (en) 1997-04-10 1997-04-10 Reflow soldering device

Publications (1)

Publication Number Publication Date
MY142253A true MY142253A (en) 2010-11-15

Family

ID=14020518

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI98001562A MY142253A (en) 1997-04-10 1998-04-09 Reflow soldering method, and reflow soldering equipment for soldering by breflow soldering method

Country Status (5)

Country Link
JP (1) JPH10284832A (en)
KR (1) KR100270764B1 (en)
CN (1) CN1091567C (en)
GB (1) GB2324058B (en)
MY (1) MY142253A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101174315B1 (en) * 2008-09-18 2012-08-16 알프스 덴키 가부시키가이샤 Electric component, structure for mounting the electric component, and method for mounting the electric component
DE102013217952B3 (en) 2013-09-09 2014-11-06 Ersa Gmbh Device for supplying a hot gas stream
EP3167774A4 (en) * 2014-07-11 2018-03-07 Nichirei Foods Inc. Food heating device
EP3009220B1 (en) * 2014-10-17 2018-12-19 Rehm Thermal Systems GmbH Roller to roller production assembly for and method of concatenated continuous and discontinuous processing processes
WO2016182641A1 (en) * 2015-05-13 2016-11-17 Commscope Technologies Llc Method and apparatus for forming interface between coaxial cable and connector
US9647353B2 (en) 2015-05-13 2017-05-09 Commscope Technologies Llc Method and apparatus for forming interface between coaxial cable and connector
CN105562870A (en) * 2015-12-23 2016-05-11 南通富士通微电子股份有限公司 Soldering-flux-free backflow method adopting formic acid and formic acid backflow device
CN112620853B (en) * 2020-12-17 2022-07-01 江西超联半导体科技有限公司 Multifunctional reflow soldering device for producing light-emitting diode

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4060379A (en) * 1975-02-06 1977-11-29 Hague International Energy conserving process furnace system and components thereof
US4029465A (en) * 1975-02-06 1977-06-14 Hague International Corporation Energy conserving process furnace system and components thereof
US4771929A (en) * 1987-02-20 1988-09-20 Hollis Automation, Inc. Focused convection reflow soldering method and apparatus
JPH01275362A (en) * 1988-04-27 1989-11-06 Florm Co Ltd Transport device for base plate
JPH03207573A (en) * 1990-01-08 1991-09-10 Matsushita Electric Ind Co Ltd Method and apparatus for producing joined body
JPH0422573A (en) * 1990-05-18 1992-01-27 Tamura Seisakusho Co Ltd Hot air reflow device
JPH0569119A (en) * 1991-01-17 1993-03-23 Nippon Haiburitsudo Kk Reflow furnace utilizing hot blast
JPH07115166B2 (en) * 1991-03-26 1995-12-13 日立テクノエンジニアリング株式会社 Reflow soldering method and apparatus
JPH07231160A (en) * 1994-02-18 1995-08-29 Hitachi Techno Eng Co Ltd Reflow soldering device
JPH08250852A (en) * 1995-03-10 1996-09-27 Senju Metal Ind Co Ltd Reflow method, reflow furnace and hot air heater for the furnace

Also Published As

Publication number Publication date
KR19980081217A (en) 1998-11-25
JPH10284832A (en) 1998-10-23
GB2324058B (en) 2002-04-10
CN1091567C (en) 2002-09-25
KR100270764B1 (en) 2001-01-15
GB2324058A (en) 1998-10-14
JP2812675B1 (en) 1998-10-22
CN1197366A (en) 1998-10-28
GB9805394D0 (en) 1998-05-06

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