CN1091567C - Return-flow soldering method and return-flow soldering appts. using the method thereof - Google Patents
Return-flow soldering method and return-flow soldering appts. using the method thereof Download PDFInfo
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- CN1091567C CN1091567C CN98101187A CN98101187A CN1091567C CN 1091567 C CN1091567 C CN 1091567C CN 98101187 A CN98101187 A CN 98101187A CN 98101187 A CN98101187 A CN 98101187A CN 1091567 C CN1091567 C CN 1091567C
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- mentioned
- heat exchange
- exchange component
- air
- heater
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
Abstract
In a reflow soldering apparatus outside air is supplied by a fan member (8) into a heat exchange member (7) in which heat exchange is performed between the outside air and the inside air discharged from a heating member (4), thereby heating the outside air being supplied to the heat exchange member. Then the outside air thus heated is further heated to a high temperature by the heating member to reflow solder a printed circuit board (P).
Description
The present invention relates to the reflow soldering apparatus of a kind of Reflow Soldering method and this method of use.This method is to utilize transfer members such as belt-type conveyer belt, and circuit component will be housed, and the printed base plate of coating soldering paste is delivered to heater, utilizes this heater to heat above-mentioned printed base plate, make the soldering paste fusion, carries out soldering.
As previous reflow soldering apparatus, the Japanese patent application that proposes according to the present patent application people describes for No. 175657/1994 now.As shown in Figure 7, the internal configurations of this reflow soldering apparatus transfer member 1, it will load circuit component (not illustrating among the figure), coat the printed base plate (not illustrating among the figure) of soldering paste, carry from input A towards output B.
This transfer member 1 is by the non junction chain conveyor 1a that does not have terminal, drive the drive motors 1b of this chain conveyor 1a and give chain conveyor 1a guiding, do not make above-mentioned chain conveyor 1a, under weight effects such as above-mentioned printed base plate, sagging downwards conveyor track 1c forms.By the rotation of drive motors 1b, make this transfer member 1, mobile by the direction (downstream promptly) of arrow C from the upstream.
In addition, the upstream in the previous reflow soldering apparatus inside that above-mentioned chain conveyor 1a passes through is disposing first preheating furnace 2 and second preheating furnace 3 as the preheating member.In the framework 2a of above-mentioned first preheating furnace 2, dispose a pair of fan 2b.Above each of above-mentioned a pair of fan 2b, disposing 6 infrared heater 2d.
Air in the framework 2a of this first preheating furnace 2 is upwards carried by fan 2b, heats through infrared heater 2d.The air of heating rebounds to the bottom behind the end face of meeting framework 2a, circulates in framework 2a.Like this, can be to circuit component be housed, to carry by chain conveyor 1a, the printed base plate (not illustrating among the figure) of having coated soldering paste carries out preheating.
In addition, owing to the structure of second preheating furnace 3 that is positioned at first preheating furnace, 2 downstreams is identical with above-mentioned first preheating furnace 2, so its explanation is omitted.
In the downstream of above-mentioned second preheating furnace 3, also disposing reflow ovens 14.This reflow ovens 14 have be positioned at above-mentioned chain conveyor 1a under heater case 14a.On the top of this heater case 14a,, disposing a plurality of heated nozzle 14b along the moving direction of chain conveyor 1a.
In above-mentioned heater case 14a, also placing a plurality of heaters (not illustrating among the figure), will deliver to air heat in the heater case 14a to high temperature.
In addition, above reflow ovens 14, disposing hood 15.Discharge duct 6 is connected with this hood 15 with circulating line 16, with the direction of the heat part of air after the soldering paste fusion of above-mentioned printed base plate along arrow D, is attracted out from above-mentioned discharge duct 6, and is expelled to the reflow soldering apparatus outside.
Be not inhaled into the heated air of the remnants in the discharge duct 6, by the direction of forced draft fan 17 according to arrow E, sucking-off from circulating line 16 again from suction inlet 17a, through exhaust outlet 17b, is admitted in the heater case 14a of reflow ovens 14 once more.
Above-mentioned forced draft fan 17 is configured in the below of reflow ovens 14, and above-mentioned circulating line 16 prolongs, and is connected with above-mentioned hood 15.
In addition, in the downstream of above-mentioned reflow ovens 14, the top of chain conveyor 1a is disposing the cooling fan 9 with a plurality of cowling panel 9a, can cool off the printed base plate after the soldering.
Below above-mentioned first and second preheating furnaces 2 and 3, dispose and reclaim the dropping recovery net 10 that falls into the waste materials such as scolding tin bits in first and second preheating furnaces 2 and 3.Previous reflow soldering apparatus comes to this and constitutes.
But, above-mentioned reflow soldering apparatus, owing to will mix with soldering paste on being coated in printed base plate with being used to improve the solder flux welding agent of soldering performance, when using from the above-mentioned soldering paste of heat air fusion that heated nozzle 14b discharges, the part of above-mentioned solder flux welding agent can become gas owing to high temperature evaporates.
When containing this heated air that becomes the solder flux welding agent of gas and be sucked in the above-mentioned forced draft fan 17, during above-mentioned circulating line 16 warp let-off forced draft fans 17, the temperature that contains the heated air of the above-mentioned solder flux welding agent that becomes gas reduces, the above-mentioned solder flux welding agent that becomes gas can change the high liquid or solid of viscosity into, attached to the inside of circulating line 16 and forced draft fan 17 or reflow ovens 14.
Like this, the pumping property of above-mentioned forced draft fan 17 and exhaust performance reduce, and the heated air of desired quantity can not be sent in the reflow ovens 14, need spended time that the temperature in the reflow ovens 14 is brought up to temperature desired, and power consumption increases.In addition, the temperature of the heat air of discharging from reflow ovens 14 has deviation, and the fusion that is coated in the soldering paste on the printed base plate is inhomogeneous, the performance depreciation of soldering.
Moreover, in order to remove above-mentioned solder flux welding agent attached to above-mentioned circulating line 16 and forced draft fan 17 inside, need repair cycle pipeline 16 or forced draft fan 17 in a short time, this must take above-mentioned circulating line 16 or forced draft fan 17 apart and clear away, therefore, the running rate of reflow soldering apparatus reduces, and production performance degenerates.
In addition, because circulating line 16 is prolonged, be connected with forced draft fan 17 with above-mentioned hood 15, therefore, at the heat air that sucks from hood 15, by above-mentioned circulating line, pass through forced draft fan 17 again, supply with once more before the reflow ovens 14, the temperature of heated air reduces.
As first method that addresses the above problem, Reflow Soldering method of the present invention is to constitute like this: utilize the air-supply member, extraneous gas is supplied with heat exchange component inside, and this heat exchange component makes outside and inner air with temperature difference carry out heat exchange mutually, and temperature difference is reduced.Utilize the heated air of discharging again, will send into the heat exchange component heating of extraneous gas, thereby the temperature of the said external gas of sending into above-mentioned heat exchange component inside is raise from heater.The said external gas that this temperature is raise is supplied with above-mentioned heater again, utilizes this heater, with the said external gas heated to higher temperature.The heated air of this high temperature is expelled to the outside of above-mentioned heater, utilizes the heat air of this discharge, with the circuit component soldering on printed base plate.
As second method that addresses the above problem, Reflow Soldering method of the present invention is to constitute like this: the extraneous gas of above-mentioned heat exchange component inside absorbs from the heat of the heated air of above-mentioned heater discharge, in the outside of this heat exchange component, heat exchange component heated air temperature is on every side reduced.
Again, as the 3rd method that addresses the above problem, reflow soldering apparatus of the present invention has transfer member, air-supply member, heat exchange component and heater, and above-mentioned heat exchange component is configured on the position of discharging with the heated air of this heater heating.This transfer member can be carried circuit component is housed, and has applied the printed base plate of soldering paste.This air-supply member can be with the extraneous gas feeder inside that sucks, and the extraneous gas that this heat exchange component then can be sent the member of blowing from this imports inner.This heater can heat the extraneous gas of sending into by above-mentioned heat exchange component from above-mentioned air-supply member.
As the 4th method that addresses the above problem, reflow soldering apparatus of the present invention has an exhaust component, it can be by seizing the heat in the extraneous gas of sending into above-mentioned heat exchange component inside, and make from the heat air cooling of above-mentioned heater discharge, and with the cooling air put together, be expelled to the outside.Above-mentioned heat exchange component is configured in the inboard of this exhaust component.
As the 5th method that addresses the above problem, above-mentioned heat exchange component clips above-mentioned transfer member, is configured in an opposite side of above-mentioned heater.
As the 6th method that addresses the above problem, above-mentioned heat exchange component is made of airbag.This airbag is at the arrival end and the port of export, and many pipes concentrate are formed.Extraneous gas from above-mentioned air-supply member is sent can pass through above-mentioned airbag, sends in the above-mentioned heater.
As the 7th method that addresses the above problem, the airbag of above-mentioned heat exchange component partly constitutes by the surface being made corrugated a plurality of raised line.
Fig. 1 is all pie graphs of the reflow soldering apparatus of one embodiment of the present of invention;
Fig. 2 is the sectional view of the major part of first preheating furnace that reflow soldering apparatus had of Fig. 1;
Fig. 3 is the sectional view of the major part of the heater that reflow soldering apparatus had of Fig. 1;
Fig. 4 is the perspective view of the summary of the heat exchange component that reflow soldering apparatus had of Fig. 1;
Fig. 5 is the general perspective of another embodiment of the heat exchange component of Fig. 4;
Fig. 6 heats the perspective view of the state of printed base plate for explanation utilizes the heater of Fig. 3;
Fig. 7 is all pie graphs of previous reflow soldering apparatus.
Utilize Fig. 1～Fig. 6 that reflow soldering apparatus of the present invention is described now.With the identical member of member that uses in the above-mentioned previous reflow soldering apparatus, with identical label mark.
Fig. 1 is all pie graphs of the reflow soldering apparatus of one embodiment of the present of invention.To output B, disposing the transfer member 1 of carrying printed base plate P from input A.
This transfer member 1 is not had the non junction chain conveyor 1a of terminal by (for example), drive the drive motors 1b of this chain conveyor 1a, with give chain conveyor 1a guiding from the below, the unlikely conveyor track 1C sagging under weight effects such as transported substance of above-mentioned chain conveyor 1a is constituted.This transfer member 1 can be by the revolution of above-mentioned drive motors 1b, moves by the direction of arrow C (promptly from as the input A of upstream towards the direction as the output B in downstream).
And, above-mentioned chain conveyor 1a, in case be drawn out to the reflow soldering apparatus outside from input A and output B, it is led by a plurality of guide roller 1e, be admitted to reflow soldering apparatus inside once more, deliver to the below of reflow soldering apparatus inside, be wound on the belt pulley of drive motors 1b, by the rotation of drive motors 1b, and move repeatedly.
In addition, the upstream in the reflow soldering apparatus inside of above-mentioned chain conveyor 1a walking has disposed first preheating furnace 2 and second preheating furnace 3 of preheating printed base plate P.The outside of above-mentioned first preheating furnace 2 is made of framework 2a, and the inside of this framework 2a is spaced into two spaces, in each space, is disposing a pair of fan 2b respectively.Fan 2b has outstanding gyroaxis 2c downwards.Above-mentioned a pair of fan 2b separately above, disposed 6 infrared heater 2d.
As shown in Figure 2, the air in the framework 2a of first preheating furnace 2 by the revolution of fan 2b, is upwards carried, and is heated to become by infrared heater 2d to be approximately 150 ℃ air.Utilize temperature to rise to about 150 ℃ preheated air, the printed base plate P that has applied soldering paste and circuit component P1 is housed is carried out preheating after, above-mentioned preheated air is run into the end face of framework 2a, below being rebounded, as a result, preheated air circulates in framework 2a with about 150 ℃ uniform temperature.
Because like this, the air that the inside of framework 2a can the upper and lower does not have the stationary temperature of temperature difference, and P heats to printed base plate.
In addition, the structure of second preheating furnace 3 that is positioned at above-mentioned first preheating furnace 2 downstreams is identical with first preheating furnace 2, has therefore omitted its explanation.
In the downstream of above-mentioned second preheating furnace 3, below transfer member 1, disposing heater 4.This heater 4 have be located at above-mentioned chain conveyor 1a under heater case 4a, on the top of this heater case 4a, along the moving direction shown in the arrow C of chain conveyor 1a, with the regulation the interval (for example, pitch is approximately 20mm), be arranged in order a plurality of heated nozzle 4b.The opening of this heated nozzle 4b is set at about 50mm * 50mm, and its length direction is configured to vertical with the moving direction of above-mentioned chain conveyor 1a.
In addition, as shown in Figure 3, in above-mentioned heater case 4a,, a plurality of heater 4c and a plurality of injection nozzle 4d are installed successively from the below.This injection nozzle 4d is positioned at the top of this heater 4c, and forms a plurality of apertures (not illustrating among the figure) towards downward direction.Heater 4c and injection nozzle 4d imbed in the sidewall of a side of heater case 4a.On the top of above-mentioned injection nozzle 4d, on the sidewall of the opposite side relative, the thermocouple 4e that is used to measure the temperature in the heater case 4a is installed with the sidewall of the side that above-mentioned heater 4c and injection nozzle 4d are installed.Thermocouple 4e imbeds in this sidewall.
Between loam cake 4f top, that be a plurality of above-mentioned heated nozzle 4b of above-mentioned thermocouple 4e and capping heater case 4a, disposing air cleaner 4g.When eject from above-mentioned injection nozzle 4d, be heated to the air of high temperature by heater 4c, when flowing among the heated nozzle 4b, can reduce the turbulent flow of air-flow.
Directly over the heated nozzle 4b of heater 4, disposing chain conveyor 1a.With this chain conveyor 1a separate a given spacing distance above, disposing the box-shaped exhaust component 5 of lower open.Discharge duct 6 is connected with this exhaust component 5, will put together from the heat air that heated nozzle 4b discharges, and is expelled to the outside.
In addition,, clip above-mentioned transfer member 1, above the above-mentioned transfer member 1 of the opposite side of above-mentioned heater 4, heat exchange component 7 is installed in the inboard of above-mentioned exhaust component 5.This heat exchange component 7 can make outside and inner air with temperature difference carry out heat exchange mutually, reduces temperature difference outside and inner air.
Again, as shown in Figure 4, this heat exchange component 7, with the interval of regulation, the pipe 7a combination with many circles forms airbag 7b respectively, again with above-mentioned round tube 7a, put together respectively at arrival end 7c and port of export 7d place, the air supply duct 8a of the described air-supply member 8 in arrival end 7c and back is connected, and port of export 7d is connected with service 7e.And as shown in Figure 1, this service 7e comes out from above-mentioned heat exchange component 7, is connected with heater 4.
In addition, the air supply duct 8a that is connected with the arrival end 7c of above-mentioned heat exchange component 7 prolongs from the air-supply member 8 that is made of the forced draft fan that is configured in heater 4 belows etc.On the suction inlet 8b of this air-supply member 8, filter 8c is installed, can suck the extraneous gas of the cleaning of having removed grit etc.With this extraneous gas,, send into the above-mentioned heat exchange component 7 again from outlet 8a by above-mentioned air supply duct 8a.
In the downstream of above-mentioned reflow ovens 4, above chain conveyor 1a, disposing cooling fan 9 with a plurality of cowling panel 9a.In addition, in above-mentioned first and second preheating furnaces 2,3, the dropping that disposes the refuses such as scolding tin bits that recovery falls from chain conveyor 1a reclaims net 10.
That is: reflow soldering apparatus of the present invention has to carry circuit component is housed, and has applied the transfer member 1 of the printed base plate P of soldering paste; Suck extraneous gas, and to the air-supply member of inner blower; To import inner heat exchange component from the extraneous gas that this member of blowing is sent and make from above-mentioned air-supply member 8 heater 4 that the extraneous gas of sending by above-mentioned heat exchange component 7 heats.Its structure is with above-mentioned heat exchange component 7, is configured on the position that the heated air 11 of this heater 4 heating is discharged.
The reflow soldering apparatus of the present invention of above-mentioned such formation utilizes transfer member 1, from input A, carries circuit component P1 is housed, and applied the printed base plate P of soldering paste.When utilizing this printed base plate of first and second preheating furnaces, 2,3 preheatings P, the temperature of printed base plate P is heated to about 120～150 ℃.
As shown in Figure 6, when a plurality of heated nozzle 4b that are delivered to heater 4 as the printed base plate P with preheating go up, because being heated to central portion temp reaches about 300 ℃ heat air 11, be expelled to the lower surface of printed base plate P from above-mentioned heated nozzle 4b, therefore, the temperature of the lower surface of printed base plate P rises to about 200～250 ℃.
Like this, be coated in the solder paste melts on the printed base plate P lower surface, make the circuitous pattern (not illustrating among the figure) on circuit component P1 and the printed base plate P become the electrically conducting state.
And, when using transfer member 1 again, when the printed base plate P that above-mentioned soldering paste is molten condition is delivered to the downstream, printed base plate P is delivered to cooling fan 9 from heater 4, the wind that utilization is sent from cowling panel 9a, with printed base plate P cooling, above-mentioned soldering paste solidifies, and circuitous pattern (not illustrating among the figure) and circuit component P1 soldering are linked together.
In addition, this reflow soldering apparatus also has exhaust component 5, it makes from above-mentioned heated nozzle 4b and discharges upward, with the heated air 11 after the above-mentioned soldering paste fusion, cool down after the heat in being seized the extraneous gas that is sent to above-mentioned heat exchange component 7 inside, air with this cooling puts together then, is expelled to the outside of reflow soldering apparatus.Above-mentioned heat exchange component 7 promptly is configured in the inside of this exhaust component 5.
This heat exchange component 7, owing to formed airbag 7b with many pipe 7a, therefore, supply with the extraneous gas of the airbag 7b inside of above-mentioned heat exchange component 7 from above-mentioned air-supply member 8, can absorb the heat of the heated air 11 of discharging upward from the heated nozzle 4b of above-mentioned heater 4, the temperature of above-mentioned heat exchange component 7 external heated air 11 is reduced.
And the extraneous gas from the above-mentioned heat exchange component of above-mentioned air-supply member 8 supplies 7 inside can absorb heat from above-mentioned heated air 11, elevate the temperature, and the temperature of the gas that the outside of airbag 7b inside is come can rise to 100～150 ℃.
Temperature rises to 100～150 ℃ the interior external gas of airbag 7b, suppresses,, to deliver among the heater case 4a of heater 4 again from service 7e by the new extraneous gas that air supply duct 8a sends from above-mentioned air-supply member 8.
In addition, send among this heater case 4a, the extraneous gas that said temperature raises by a plurality of holes (not illustrating among the figure) of injection nozzle 4d, sprays towards heater 4c.
Like this, the temperature of said external gas is higher, rises to about about 300 ℃, becomes the heated air 11 of high temperature as shown in Figure 6, discharges upward from heated nozzle 4b again.
Therefore, by the printed base plate P that above-mentioned transfer member 1 is carried, by heated air 11 heating of above-mentioned high temperature, the temperature of printed base plate P lower surface rises to about 200～250 ℃, makes the soldering paste fusion that is coated on the printed base plate P lower surface.
In addition, because above-mentioned heat exchange component 7 is configured in the inboard of above-mentioned exhaust component 5, clamp above-mentioned transfer member 1, and in the opposite side of above-mentioned heater 4, again owing to can absorb expeditiously from above-mentioned heater 4 and discharge, the heat of the heated air after the above-mentioned solder paste melts 11, can be in the outside of above-mentioned heat exchange component 7, the temperature of the heated air 11 around making reduces, and therefore, the circuit component P1 that can prevent to be contained on the above-mentioned printed base plate P is subjected to high temperature destruction.
The airbag 7b of the above-mentioned heat exchange component 7 that a plurality of circular pipe 7a are constituted has been described in the embodiments of the invention.Yet pipe 7a is not limited only to circle, also can (for example) make oval-shaped.
In addition, the airbag 7b of above-mentioned heat exchange component 7 also is not limited only to many pipe 7a, also can make corrugated many raised lines by the surface and partly constitute as airbag 7g shown in Figure 5, makes its inner state that forms middle sky.
According to above-mentioned the present invention, can utilize the air-supply member that extraneous gas is supplied with heat exchange component, this heat exchange component makes outside and inner air with temperature difference carry out heat exchange mutually, and temperature difference is reduced.The heated air that utilization is discharged from heater makes the heat exchange component heating of supplying with this extraneous gas, and the said external gas temperature of sending into above-mentioned heat exchange component inside is raise.The said external gas that temperature raises resupplies above-mentioned heater, utilizes above-mentioned heater, makes the said external gas heated to higher temperature.The heated air of this high temperature is expelled to the outside of above-mentioned heater.Owing to can utilize the heat air of this discharge, with the circuit component soldering on printed base plate, therefore can utilize above-mentioned heat exchange component, absorb the heat of the heated air of the high temperature of discharging from above-mentioned heater expeditiously, this sends into the temperature of the said external gas of above-mentioned heat exchange component inside, raise at short notice, the extraneous gas that temperature is raise is supplied with above-mentioned heater again.
In addition, raise owing to supply with the extraneous gas temperature of above-mentioned heater, thus can utilize heater to be heated to high temperature at short notice, and can melt the soldering paste that is coated on the printed base plate equably, carry out soldering reliably.
In addition, because the extraneous gas body of above-mentioned heat exchange component inside can absorb from the heat of the heated air of above-mentioned heater discharge, this heat exchange component external heated air themperature is reduced, thereby can prevent that the circuit component that is contained on the printed base plate from becoming high temperature, thereby can prevent the heat damage of circuit component.
Again, this soldering apparatus has conveying circuit component is housed, and has applied the transfer member of the printed base plate of soldering paste; Suck extraneous gas, to the air-supply member of inner blower; The extraneous gas that to send from this member of blowing imports inner heat exchange component; With make from above-mentioned air-supply member the heater of the extraneous gas heating of sending by above-mentioned heat exchange component.Because above-mentioned heat exchange component is configured on the position of discharging with the heated air of this heater heating, again owing to can add the heat of the above-mentioned heat air of discharging by heater of heat absorption expeditiously, and send into the external gas of above-mentioned heat exchange component inside, and the extraneous gas that temperature raises is sent into above-mentioned heater, therefore can provide a kind of electric capacity that can reduce to heat the heater of heater, the reflow soldering apparatus that power consumption is few.
In addition, the extraneous gas of sending from above-mentioned air-supply member is the air of exterior clean, does not adhere to solder flux welding agent and grit etc. in air-supply component inside and heater inside, but the therefore service interval of extension fixture, improve running rate, provide a kind of production performance high reflow soldering apparatus.
In addition, this reflow soldering apparatus has exhaust component, and it can seize heat from the extraneous gas that is sent to above-mentioned heat exchange component inside, and makes from the heated air cooling of the high temperature of above-mentioned heater discharge.This exhaust component also can put together the air of cooling, is expelled to the outside.Because above-mentioned heat exchange component is configured in this exhaust component inboard, can absorb heat expeditiously from the heated air of high temperature, at short notice, makes the extraneous gas heating of sending into heat exchange component inside, and elevate the temperature.
Moreover, because above-mentioned heat exchange component is clamped above-mentioned transfer member, be configured in an opposite side of above-mentioned heater, therefore, above-mentioned heat exchange component can be expeditiously from fusion be coated in the heat air behind the soldering paste on the printed base plate, absorb heat, the heated air temperature of above-mentioned high temperature is cooled down, thereby the circuit component that can prevent to be contained on the printed base plate is subjected to temperatures involved and heat damage.
Above-mentioned heat exchange component is made up of airbag.This airbag for will many pipes make up, at its arrival end and the port of export place pipe put together formation.Because can be with the extraneous gas of sending from above-mentioned air-supply member, be sent to above-mentioned heater by above-mentioned airbag, therefore, can increase the surface area of above-mentioned airbag, and can absorb the heat of above-mentioned heat air expeditiously, at short notice, the extraneous gas heating with sending in the above-mentioned airbag elevates the temperature.
Partly constitute because the airbag of above-mentioned heat exchange component can be made corrugated a plurality of raised line by the surface, so this airbag can increase its surface area again,, and can absorb the heat of above-mentioned heat air expeditiously, at short notice, make the new air heat of airbag inside, and elevate the temperature.
Claims (14)
1. a Reflow Soldering method is characterized in that, utilizes the air-supply member that extraneous gas is supplied with heat exchange component inside, and this heat exchange component makes outside and the inner air with uniform temperature difference, carries out heat exchange mutually, and temperature difference is reduced; Utilize the heated air of discharging again from heater, the heat exchange component that adds the heat supply extraneous gas, the temperature of the said external gas that is supplied to above-mentioned heat exchange component inside is raise, the said external gas that temperature is raise is sent into above-mentioned heater again, utilize this heater, with the said external gas heated to higher temperature, the heated air of this high temperature is expelled to the outside of above-mentioned heater, utilize the heat air of this discharge, with the circuit component soldering on printed base plate.
2. Reflow Soldering method as claimed in claim 1, it is characterized in that the external gas of above-mentioned heat exchange component inside absorbs from the heat of the heated air of above-mentioned heater discharge, in the outside of this heat exchange component, the temperature of heat exchange component above-mentioned heated air is on every side reduced.
3. a reflow soldering apparatus is characterized in that, it has to carry is equipped with circuit component, and has applied the transfer member of the printed base plate of soldering paste; Suck extraneous gas, and to the air-supply member of inner blower; The extraneous gas that to send from this member of blowing imports inner heat exchange component and will be by above-mentioned heat exchange component, the heater that the extraneous gas of sending from above-mentioned air-supply member heats; Above-mentioned heat exchange component is configured on the position of the heated air discharge that utilizes this heater heating.
4. reflow soldering apparatus as claimed in claim 3, it is characterized in that, it has exhaust component, this exhaust component can seize the heat in the extraneous gas of sending into above-mentioned heat exchange component inside, and make from the heat air cooling of above-mentioned heater discharge, this exhaust component also can put together the air of cooling, is expelled to the outside; Above-mentioned heat exchange component is configured in the inboard of this exhaust component.
5. reflow soldering apparatus as claimed in claim 4 is characterized in that above-mentioned heat exchange component is clamped above-mentioned transfer member, is configured in an opposite side of above-mentioned heater.
6. reflow soldering apparatus as claimed in claim 5, it is characterized in that, above-mentioned heat exchange component is made up of airbag, this airbag is with many pipes, put together formation at its arrival end and port of export place, extraneous gas from above-mentioned air-supply member is sent can pass through above-mentioned airbag, sends in the above-mentioned heater.
7. reflow soldering apparatus as claimed in claim 6 is characterized in that, the airbag of above-mentioned heat exchange component is made corrugated a plurality of raised line by the surface and partly constituted.
8. reflow soldering apparatus as claimed in claim 4, it is characterized in that, above-mentioned heat exchange component is made of airbag, this airbag is with many pipes, put together formation at its arrival end and port of export place, extraneous gas from above-mentioned air-supply member is sent can pass through above-mentioned airbag, sends in the above-mentioned heater.
9. reflow soldering apparatus as claimed in claim 8 is characterized in that, the airbag of above-mentioned heat exchange component is made corrugated a plurality of raised line by the surface and partly constituted.
10. reflow soldering apparatus as claimed in claim 3 is characterized in that above-mentioned heat exchange component is clamped above-mentioned transfer member, is configured in an opposite side of above-mentioned heater.
11. reflow soldering apparatus as claimed in claim 10, it is characterized in that, above-mentioned heat exchange component is made of airbag, this airbag is with many pipes, put together formation at arrival end and port of export place, from the extraneous gas that above-mentioned air-supply member is sent, can send in the above-mentioned heater by above-mentioned airbag.
12. reflow soldering apparatus as claimed in claim 11 is characterized in that, the airbag of above-mentioned heat exchange component is made corrugated a plurality of raised line by the surface and is partly constituted.
13. reflow soldering apparatus as claimed in claim 3, it is characterized in that, above-mentioned heat exchange component is made of airbag, this airbag is with many pipes, put together formation at its arrival end and port of export place, extraneous gas from above-mentioned air-supply member is sent can pass through above-mentioned airbag, sends in the above-mentioned heater.
14. reflow soldering apparatus as claimed in claim 13 is characterized in that, the airbag of above-mentioned heat exchange component is made corrugated a plurality of raised line by the surface and is partly constituted.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9091226A JPH10284832A (en) | 1997-04-10 | 1997-04-10 | Reflow soldering device |
| JP091226/97 | 1997-04-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1197366A CN1197366A (en) | 1998-10-28 |
| CN1091567C true CN1091567C (en) | 2002-09-25 |
Family
ID=14020518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN98101187A Expired - Lifetime CN1091567C (en) | 1997-04-10 | 1998-04-10 | Return-flow soldering method and return-flow soldering appts. using the method thereof |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPH10284832A (en) |
| KR (1) | KR100270764B1 (en) |
| CN (1) | CN1091567C (en) |
| GB (1) | GB2324058B (en) |
| MY (1) | MY142253A (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102160237B (en) * | 2008-09-18 | 2014-03-12 | 阿尔卑斯电气株式会社 | Electric component, structure for mounting electric component, and method for mounting electric component |
| DE102013217952B3 (en) * | 2013-09-09 | 2014-11-06 | Ersa Gmbh | Device for supplying a hot gas stream |
| EP3167774A4 (en) * | 2014-07-11 | 2018-03-07 | Nichirei Foods Inc. | Food heating device |
| EP3009220B1 (en) * | 2014-10-17 | 2018-12-19 | Rehm Thermal Systems GmbH | Roller to roller production assembly for and method of concatenated continuous and discontinuous processing processes |
| WO2016182641A1 (en) | 2015-05-13 | 2016-11-17 | Commscope Technologies Llc | Method and apparatus for forming interface between coaxial cable and connector |
| US9647353B2 (en) | 2015-05-13 | 2017-05-09 | Commscope Technologies Llc | Method and apparatus for forming interface between coaxial cable and connector |
| CN105562870A (en) * | 2015-12-23 | 2016-05-11 | 南通富士通微电子股份有限公司 | Soldering-flux-free backflow method adopting formic acid and formic acid backflow device |
| CN112620853B (en) * | 2020-12-17 | 2022-07-01 | 江西超联半导体科技有限公司 | Multifunctional reflow soldering device for producing light-emitting diode |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4144020A (en) * | 1975-02-06 | 1979-03-13 | Hague International | Energy conserving process furnace system and components thereof |
| US5203487A (en) * | 1991-03-26 | 1993-04-20 | Hitachi Techno Engineering Co., Ltd. | Reflow soldering method and system therefor |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4060379A (en) * | 1975-02-06 | 1977-11-29 | Hague International | Energy conserving process furnace system and components thereof |
| US4771929A (en) * | 1987-02-20 | 1988-09-20 | Hollis Automation, Inc. | Focused convection reflow soldering method and apparatus |
| JPH01275362A (en) * | 1988-04-27 | 1989-11-06 | Florm Co Ltd | Transport device for base plate |
| JPH03207573A (en) * | 1990-01-08 | 1991-09-10 | Matsushita Electric Ind Co Ltd | Method and apparatus for producing joined body |
| JPH0422573A (en) * | 1990-05-18 | 1992-01-27 | Tamura Seisakusho Co Ltd | Hot air reflow device |
| JPH0569119A (en) * | 1991-01-17 | 1993-03-23 | Nippon Haiburitsudo Kk | Reflow furnace utilizing hot blast |
| JPH07231160A (en) * | 1994-02-18 | 1995-08-29 | Hitachi Techno Eng Co Ltd | Reflow soldering device |
| JPH08250852A (en) * | 1995-03-10 | 1996-09-27 | Senju Metal Ind Co Ltd | Reflow method, reflow furnace and hot air heater for the furnace |
-
1997
- 1997-04-10 JP JP9091226A patent/JPH10284832A/en active Granted
-
1998
- 1998-03-16 GB GB9805394A patent/GB2324058B/en not_active Expired - Fee Related
- 1998-04-09 KR KR1019980012514A patent/KR100270764B1/en not_active IP Right Cessation
- 1998-04-09 MY MYPI98001562A patent/MY142253A/en unknown
- 1998-04-10 CN CN98101187A patent/CN1091567C/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4144020A (en) * | 1975-02-06 | 1979-03-13 | Hague International | Energy conserving process furnace system and components thereof |
| US5203487A (en) * | 1991-03-26 | 1993-04-20 | Hitachi Techno Engineering Co., Ltd. | Reflow soldering method and system therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| MY142253A (en) | 2010-11-15 |
| GB9805394D0 (en) | 1998-05-06 |
| GB2324058A (en) | 1998-10-14 |
| JPH10284832A (en) | 1998-10-23 |
| KR100270764B1 (en) | 2001-01-15 |
| KR19980081217A (en) | 1998-11-25 |
| JP2812675B1 (en) | 1998-10-22 |
| GB2324058B (en) | 2002-04-10 |
| CN1197366A (en) | 1998-10-28 |
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Granted publication date: 20020925 |
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| CX01 | Expiry of patent term |