JP2812675B1 - - Google Patents

Info

Publication number
JP2812675B1
JP2812675B1 JP9091226A JP9122697A JP2812675B1 JP 2812675 B1 JP2812675 B1 JP 2812675B1 JP 9091226 A JP9091226 A JP 9091226A JP 9122697 A JP9122697 A JP 9122697A JP 2812675 B1 JP2812675 B1 JP 2812675B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP9091226A
Other languages
Japanese (ja)
Other versions
JPH10284832A (en
JP2812675B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9-91226A priority Critical patent/JP2812675B2/en
Priority to GB9805394A priority patent/GB2324058B/en
Priority to KR1019980012514A priority patent/KR100270764B1/en
Priority to MYPI98001562A priority patent/MY142253A/en
Priority to CN98101187A priority patent/CN1091567C/en
Application granted granted Critical
Publication of JP2812675B1 publication Critical patent/JP2812675B1/ja
Publication of JP2812675B2 publication Critical patent/JP2812675B2/en
Publication of JPH10284832A publication Critical patent/JPH10284832A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP9-91226A 1997-04-10 1997-04-10 Reflow soldering equipment Expired - Lifetime JP2812675B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP9-91226A JP2812675B2 (en) 1997-04-10 Reflow soldering equipment
GB9805394A GB2324058B (en) 1997-04-10 1998-03-16 Reflow soldering method,and reflow soldering equipment for soldering by reflow soldering method
KR1019980012514A KR100270764B1 (en) 1997-04-10 1998-04-09 A method for reflow welding and an apparatus utilizing the method
MYPI98001562A MY142253A (en) 1997-04-10 1998-04-09 Reflow soldering method, and reflow soldering equipment for soldering by breflow soldering method
CN98101187A CN1091567C (en) 1997-04-10 1998-04-10 Return-flow soldering method and return-flow soldering appts. using the method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9-91226A JP2812675B2 (en) 1997-04-10 Reflow soldering equipment

Publications (3)

Publication Number Publication Date
JP2812675B1 true JP2812675B1 (en) 1998-10-22
JP2812675B2 JP2812675B2 (en) 1998-10-22
JPH10284832A JPH10284832A (en) 1998-10-23

Family

ID=14020518

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9-91226A Expired - Lifetime JP2812675B2 (en) 1997-04-10 1997-04-10 Reflow soldering equipment

Country Status (5)

Country Link
JP (1) JP2812675B2 (en)
KR (1) KR100270764B1 (en)
CN (1) CN1091567C (en)
GB (1) GB2324058B (en)
MY (1) MY142253A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5066262B2 (en) * 2008-09-18 2012-11-07 アルプス電気株式会社 Electrical component, mounting structure of electrical component, and mounting method of electrical component
DE102013217952B3 (en) * 2013-09-09 2014-11-06 Ersa Gmbh Device for supplying a hot gas stream
JP6765303B2 (en) * 2014-07-11 2020-10-07 株式会社ニチレイフーズ Food heating device and food manufacturing method
EP3009220B1 (en) * 2014-10-17 2018-12-19 Rehm Thermal Systems GmbH Roller to roller production assembly for and method of concatenated continuous and discontinuous processing processes
WO2016182641A1 (en) * 2015-05-13 2016-11-17 Commscope Technologies Llc Method and apparatus for forming interface between coaxial cable and connector
US9647353B2 (en) 2015-05-13 2017-05-09 Commscope Technologies Llc Method and apparatus for forming interface between coaxial cable and connector
CN105562870A (en) * 2015-12-23 2016-05-11 南通富士通微电子股份有限公司 Soldering-flux-free backflow method adopting formic acid and formic acid backflow device
CN112620853B (en) * 2020-12-17 2022-07-01 江西超联半导体科技有限公司 Multifunctional reflow soldering device for producing light-emitting diode

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4029465A (en) * 1975-02-06 1977-06-14 Hague International Corporation Energy conserving process furnace system and components thereof
US4060379A (en) * 1975-02-06 1977-11-29 Hague International Energy conserving process furnace system and components thereof
US4771929A (en) * 1987-02-20 1988-09-20 Hollis Automation, Inc. Focused convection reflow soldering method and apparatus
JPH01275362A (en) * 1988-04-27 1989-11-06 Florm Co Ltd Transport device for base plate
JPH03207573A (en) * 1990-01-08 1991-09-10 Matsushita Electric Ind Co Ltd Method and apparatus for producing joined body
JPH0422573A (en) * 1990-05-18 1992-01-27 Tamura Seisakusho Co Ltd Hot air reflow device
JPH0569119A (en) * 1991-01-17 1993-03-23 Nippon Haiburitsudo Kk Reflow furnace utilizing hot blast
JPH07115166B2 (en) * 1991-03-26 1995-12-13 日立テクノエンジニアリング株式会社 Reflow soldering method and apparatus
JPH07231160A (en) * 1994-02-18 1995-08-29 Hitachi Techno Eng Co Ltd Reflow soldering equipment
JPH08250852A (en) * 1995-03-10 1996-09-27 Senju Metal Ind Co Ltd Reflow method, reflow furnace and hot air heater for the furnace

Also Published As

Publication number Publication date
KR19980081217A (en) 1998-11-25
JPH10284832A (en) 1998-10-23
GB2324058B (en) 2002-04-10
GB9805394D0 (en) 1998-05-06
GB2324058A (en) 1998-10-14
MY142253A (en) 2010-11-15
CN1197366A (en) 1998-10-28
CN1091567C (en) 2002-09-25
JP2812675B2 (en) 1998-10-22
KR100270764B1 (en) 2001-01-15

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