DE69919806D1 - Leitpaste und Keramikschaltungsplatte - Google Patents

Leitpaste und Keramikschaltungsplatte

Info

Publication number
DE69919806D1
DE69919806D1 DE69919806T DE69919806T DE69919806D1 DE 69919806 D1 DE69919806 D1 DE 69919806D1 DE 69919806 T DE69919806 T DE 69919806T DE 69919806 T DE69919806 T DE 69919806T DE 69919806 D1 DE69919806 D1 DE 69919806D1
Authority
DE
Germany
Prior art keywords
circuit board
conductive paste
ceramic circuit
ceramic
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69919806T
Other languages
English (en)
Other versions
DE69919806T2 (de
Inventor
Eiji Kodera
Hitoshi Nagura
Hironori Sato
Shigeru Taga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP24853699A external-priority patent/JP2001143527A/ja
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Application granted granted Critical
Publication of DE69919806D1 publication Critical patent/DE69919806D1/de
Publication of DE69919806T2 publication Critical patent/DE69919806T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
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    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE1999619806 1998-10-28 1999-10-28 Leitpaste und Keramikschaltungsplatte Expired - Fee Related DE69919806T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP34653598 1998-10-28
JP34653598 1998-10-28
JP24853699 1999-09-02
JP24853699A JP2001143527A (ja) 1998-10-28 1999-09-02 導電ペースト及びそれを用いたセラミック配線基板

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DE69919806D1 true DE69919806D1 (de) 2004-10-07
DE69919806T2 DE69919806T2 (de) 2005-09-15

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JP3818030B2 (ja) * 2000-07-21 2006-09-06 株式会社村田製作所 多層基板の製造方法
JP2002094204A (ja) * 2000-09-19 2002-03-29 Matsushita Electric Ind Co Ltd 高周波モジュールとその製造方法
US7506438B1 (en) 2000-11-14 2009-03-24 Freescale Semiconductor, Inc. Low profile integrated module interconnects and method of fabrication
JP2002362987A (ja) * 2001-06-08 2002-12-18 Hitachi Ltd 電子部品およびその製造方法
US6762369B2 (en) * 2001-10-29 2004-07-13 Matsushita Electric Industrial Co., Ltd. Multilayer ceramic substrate and method for manufacturing the same
US6770971B2 (en) * 2002-06-14 2004-08-03 Casio Computer Co., Ltd. Semiconductor device and method of fabricating the same
US7510995B2 (en) * 2003-04-01 2009-03-31 United Technologies Corporation Application of a mixed metal oxide catalyst to a metallic substrate
US7491590B2 (en) * 2004-05-28 2009-02-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing thin film transistor in display device
DE102006057332B4 (de) * 2006-12-05 2018-01-25 Infineon Technologies Ag Zusammenbau aufweisend ein Substrat und einen auf dem Substrat montierten Chip
JP5455661B2 (ja) * 2009-01-29 2014-03-26 ギガフォトン株式会社 極端紫外光源装置
US8196475B2 (en) * 2009-03-16 2012-06-12 Kavlico Corporation Cointegrated MEMS sensor and method
CN201888020U (zh) * 2010-05-25 2011-06-29 景德镇正宇奈米科技有限公司 陶瓷印刷电路板结构
WO2012052192A1 (de) * 2010-10-20 2012-04-26 Robert Bosch Gmbh Ausgangswerkstoff und verfahren zur herstellung einer sinterverbindung
ES2390427B1 (es) * 2011-04-14 2013-07-04 Roca Sanitario, S. A. Composición de una pasta conductora eléctrica co-sinterizable a altas temperaturas y su integración en materiales cerámicos en base porcelana, gres, gres porcelánico o similares

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US2993815A (en) * 1959-05-25 1961-07-25 Bell Telephone Labor Inc Metallizing refractory substrates
US4001146A (en) * 1975-02-26 1977-01-04 E. I. Du Pont De Nemours And Company Novel silver compositions
US4514321A (en) * 1983-08-25 1985-04-30 E. I. Du Pont De Nemours And Company Thick film conductor compositions
KR900008781B1 (ko) * 1985-06-17 1990-11-29 마쯔시다덴기산교 가부시기가이샤 후막도체조성물
JP2917457B2 (ja) 1990-07-31 1999-07-12 太平洋セメント株式会社 導体ペースト
JP2953075B2 (ja) 1991-02-19 1999-09-27 日本電気株式会社 探針で試料近傍を走査して得たデータを画像表示する顕微鏡及びその像測定法
JPH0514363A (ja) 1991-07-08 1993-01-22 Mitsubishi Electric Corp ローカルエリアネツトワーク用トランシーバ
JPH0574166A (ja) 1991-09-13 1993-03-26 Toshiba Corp メモリ装置及びタイムベースコレクタ回路
JP3152873B2 (ja) 1995-06-30 2001-04-03 京セラ株式会社 低温焼成回路基板
JPH09198919A (ja) 1996-01-19 1997-07-31 Matsushita Electric Ind Co Ltd 導電ペースト及びそれを用いたセラミックス部品
JPH1051088A (ja) * 1996-05-28 1998-02-20 Ngk Spark Plug Co Ltd セラミック配線基板およびその製造方法

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DE69919806T2 (de) 2005-09-15
EP0997941A3 (de) 2003-05-14
US6338893B1 (en) 2002-01-15
EP0997941A2 (de) 2000-05-03
EP0997941B1 (de) 2004-09-01

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