DE19826756C2 - Verfahren zum Verkapseln von feinen Lotmetallpulvern und danach hergestellte Lotmetallpulver - Google Patents
Verfahren zum Verkapseln von feinen Lotmetallpulvern und danach hergestellte LotmetallpulverInfo
- Publication number
- DE19826756C2 DE19826756C2 DE19826756A DE19826756A DE19826756C2 DE 19826756 C2 DE19826756 C2 DE 19826756C2 DE 19826756 A DE19826756 A DE 19826756A DE 19826756 A DE19826756 A DE 19826756A DE 19826756 C2 DE19826756 C2 DE 19826756C2
- Authority
- DE
- Germany
- Prior art keywords
- solder metal
- solder
- powder
- hydrophobic
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000843 powder Substances 0.000 title claims abstract description 36
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 33
- 239000002184 metal Substances 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 22
- 230000008569 process Effects 0.000 title description 7
- 239000002775 capsule Substances 0.000 claims abstract description 11
- 230000004907 flux Effects 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims description 15
- 230000002209 hydrophobic effect Effects 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 9
- 239000000178 monomer Substances 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 8
- 238000003756 stirring Methods 0.000 claims description 7
- 239000004094 surface-active agent Substances 0.000 claims description 7
- 229920001169 thermoplastic Polymers 0.000 claims description 7
- 238000006116 polymerization reaction Methods 0.000 claims description 6
- 239000011241 protective layer Substances 0.000 claims description 6
- 239000003093 cationic surfactant Substances 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 230000009477 glass transition Effects 0.000 claims description 5
- 239000000725 suspension Substances 0.000 claims description 5
- 239000008158 vegetable oil Substances 0.000 claims description 5
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical group CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 claims description 4
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 4
- 235000019483 Peanut oil Nutrition 0.000 claims description 4
- 239000004359 castor oil Substances 0.000 claims description 4
- 235000019438 castor oil Nutrition 0.000 claims description 4
- DDXLVDQZPFLQMZ-UHFFFAOYSA-M dodecyl(trimethyl)azanium;chloride Chemical compound [Cl-].CCCCCCCCCCCC[N+](C)(C)C DDXLVDQZPFLQMZ-UHFFFAOYSA-M 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims description 4
- 239000003999 initiator Substances 0.000 claims description 4
- 239000002923 metal particle Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 239000000312 peanut oil Substances 0.000 claims description 4
- 239000010775 animal oil Substances 0.000 claims description 3
- 239000003849 aromatic solvent Substances 0.000 claims description 3
- WOWHHFRSBJGXCM-UHFFFAOYSA-M cetyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+](C)(C)C WOWHHFRSBJGXCM-UHFFFAOYSA-M 0.000 claims description 3
- 239000004006 olive oil Substances 0.000 claims description 3
- 235000008390 olive oil Nutrition 0.000 claims description 3
- 235000013311 vegetables Nutrition 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- 238000012695 Interfacial polymerization Methods 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims description 2
- 239000003995 emulsifying agent Substances 0.000 claims description 2
- 230000005661 hydrophobic surface Effects 0.000 claims description 2
- 150000001451 organic peroxides Chemical class 0.000 claims description 2
- 239000002344 surface layer Substances 0.000 claims description 2
- 150000003863 ammonium salts Chemical class 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 230000000087 stabilizing effect Effects 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 abstract description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000003921 oil Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 235000019198 oils Nutrition 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 229920000052 poly(p-xylylene) Polymers 0.000 description 2
- 239000006228 supernatant Substances 0.000 description 2
- 235000015112 vegetable and seed oil Nutrition 0.000 description 2
- 239000012190 activator Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005354 coacervation Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000012074 organic phase Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2984—Microcapsule with fluid core [includes liposome]
- Y10T428/2985—Solid-walled microcapsule from synthetic polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31609—Particulate metal or metal compound-containing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Of Micro-Capsules (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Image Analysis (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Polymerisation Methods In General (AREA)
Priority Applications (16)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19826756A DE19826756C2 (de) | 1998-06-15 | 1998-06-15 | Verfahren zum Verkapseln von feinen Lotmetallpulvern und danach hergestellte Lotmetallpulver |
| DK99939356T DK1094915T3 (da) | 1998-06-15 | 1999-06-15 | Fremgangsmåde til indkapsling af loddemetalpulvere og loddemetalpulvere fremstillet verd denne fremgangsmåde |
| AT99939356T ATE249308T1 (de) | 1998-06-15 | 1999-06-15 | Verfahren zum verkapseln von lotmetallpulver und danach hergestelltes lotmetallpulver |
| PCT/DE1999/001777 WO1999065640A1 (de) | 1998-06-15 | 1999-06-15 | Verfahren zum verkapseln von lotmetallpulver und danach hergestellte lotmetallpulver |
| US09/719,281 US6416863B1 (en) | 1998-06-15 | 1999-06-15 | Method for encapsulating solder metal powders and solder metal powders produced according to this method |
| EP99939356A EP1094915B1 (de) | 1998-06-15 | 1999-06-15 | Verfahren zum verkapseln von lotmetallpulver und danach hergestelltes lotmetallpulver |
| CA002335002A CA2335002C (en) | 1998-06-15 | 1999-06-15 | Method for encapsulating solder metal powders and solder metal powders produced according to this method |
| CN99807440A CN1106905C (zh) | 1998-06-15 | 1999-06-15 | 焊料金属粉末的封装方法和按此方法制得的焊料金属粉末 |
| DE59906970T DE59906970D1 (de) | 1998-06-15 | 1999-06-15 | Verfahren zum verkapseln von lotmetallpulver und danach hergestelltes lotmetallpulver |
| KR1020007013564A KR100549612B1 (ko) | 1998-06-15 | 1999-06-15 | 땜납 금속 분말 캡슐화 방법 및 그 방법에 따라 제조된땜납 금속 분말 |
| IDW20002606A ID27425A (id) | 1998-06-15 | 1999-06-15 | Metode untuk pengkapsulan serbuk-logam patri dan serbuk-logam-patri yang dihasilkan dengan metode ini |
| BR9911173-0A BR9911173A (pt) | 1998-06-15 | 1999-06-15 | Método para encapsular pós metálicos de solda e pós metálicos de solda produzidos de acordo com este método |
| IL14005399A IL140053A0 (en) | 1998-06-15 | 1999-06-15 | Method for encapsulating solder metal powders and solder metal powders produced according to this method |
| JP2000554502A JP3783031B2 (ja) | 1998-06-15 | 1999-06-15 | 軟ろう粉末をカプセル化する方法およびそれによって製造される軟ろう粉末 |
| NZ508383A NZ508383A (en) | 1998-06-15 | 1999-06-15 | Method for encapsulating fine solder metal powders |
| IL140053A IL140053A (en) | 1998-06-15 | 2000-12-03 | Method for encapsulation of solder metal powders and solder metal powders produced by this method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19826756A DE19826756C2 (de) | 1998-06-15 | 1998-06-15 | Verfahren zum Verkapseln von feinen Lotmetallpulvern und danach hergestellte Lotmetallpulver |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE19826756A1 DE19826756A1 (de) | 2000-01-13 |
| DE19826756C2 true DE19826756C2 (de) | 2002-04-18 |
Family
ID=7871020
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19826756A Expired - Fee Related DE19826756C2 (de) | 1998-06-15 | 1998-06-15 | Verfahren zum Verkapseln von feinen Lotmetallpulvern und danach hergestellte Lotmetallpulver |
| DE59906970T Expired - Fee Related DE59906970D1 (de) | 1998-06-15 | 1999-06-15 | Verfahren zum verkapseln von lotmetallpulver und danach hergestelltes lotmetallpulver |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE59906970T Expired - Fee Related DE59906970D1 (de) | 1998-06-15 | 1999-06-15 | Verfahren zum verkapseln von lotmetallpulver und danach hergestelltes lotmetallpulver |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US6416863B1 (enExample) |
| EP (1) | EP1094915B1 (enExample) |
| JP (1) | JP3783031B2 (enExample) |
| KR (1) | KR100549612B1 (enExample) |
| CN (1) | CN1106905C (enExample) |
| AT (1) | ATE249308T1 (enExample) |
| BR (1) | BR9911173A (enExample) |
| CA (1) | CA2335002C (enExample) |
| DE (2) | DE19826756C2 (enExample) |
| DK (1) | DK1094915T3 (enExample) |
| ID (1) | ID27425A (enExample) |
| IL (2) | IL140053A0 (enExample) |
| NZ (1) | NZ508383A (enExample) |
| WO (1) | WO1999065640A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7780875B2 (en) | 2005-01-13 | 2010-08-24 | Cinvention Ag | Composite materials containing carbon nanoparticles |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3888573B2 (ja) * | 2001-06-29 | 2007-03-07 | 富士電機ホールディングス株式会社 | ハンダ組成物 |
| CN102264491B (zh) | 2008-11-21 | 2014-11-26 | 汉高公司 | 可热分解聚合物涂布的金属粉末 |
| CN102574934B (zh) | 2009-10-15 | 2013-10-16 | 东丽株式会社 | 核壳颗粒的制造方法、核壳颗粒和使用该核壳颗粒的糊料组合物以及片材组合物 |
| US9682447B2 (en) | 2010-08-20 | 2017-06-20 | Henkel IP & Holding GmbH | Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastes |
| GB2491387A (en) * | 2011-06-02 | 2012-12-05 | Magnequench Ltd | Rare earth material capsule used in making a magnet |
| CN102220550B (zh) * | 2011-06-13 | 2012-07-04 | 苏州国通科技有限公司 | 一种锡熔液保护剂 |
| JP6050364B2 (ja) | 2011-09-06 | 2016-12-21 | ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング | はんだペースト用の二官能性または多官能性電子不足オレフィン被覆金属粉末 |
| JP5947238B2 (ja) | 2013-03-25 | 2016-07-06 | 株式会社日立製作所 | ペースト、アルミニウム電線体、アルミニウム電線体の製造方法、モータ及びモータの製造方法 |
| WO2015146999A1 (ja) | 2014-03-25 | 2015-10-01 | 住友金属鉱山株式会社 | 被覆はんだ材料およびその製造方法 |
| US9878039B1 (en) | 2016-09-01 | 2018-01-30 | International Business Machines Corporation | Microcapsule having a microcapsule shell material that is rupturable via a retro-dimerization reaction |
| US10328535B2 (en) | 2016-11-07 | 2019-06-25 | International Business Machines Corporation | Self-heating solder flux material |
| CN108722000B (zh) * | 2018-05-25 | 2020-09-29 | 中国人民解放军63908部队 | 十二烷基三甲基溴化铵在固-液云爆剂组分分离中的应用及方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0556864A1 (en) * | 1992-02-21 | 1993-08-25 | London Chemical Company, Inc. | Solder powder coated with parylene |
| DE4402042A1 (de) * | 1994-01-25 | 1994-06-09 | Kunststoff Maschinen Handelsge | Mikropartikulierte Reflow-Lötmittel und Verfahren zu deren Herstellung |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3736653A (en) * | 1970-05-07 | 1973-06-05 | Ncr Co | Process for soldering using pre-fluxed solder powder |
| JP2564152B2 (ja) | 1987-10-27 | 1996-12-18 | タムラ化研株式会社 | はんだペースト |
| US4944326A (en) * | 1989-09-08 | 1990-07-31 | Su Yueh Hsieh | Inlet valve for water tanks |
| US5922403A (en) | 1996-03-12 | 1999-07-13 | Tecle; Berhan | Method for isolating ultrafine and fine particles |
-
1998
- 1998-06-15 DE DE19826756A patent/DE19826756C2/de not_active Expired - Fee Related
-
1999
- 1999-06-15 AT AT99939356T patent/ATE249308T1/de not_active IP Right Cessation
- 1999-06-15 KR KR1020007013564A patent/KR100549612B1/ko not_active Expired - Fee Related
- 1999-06-15 CN CN99807440A patent/CN1106905C/zh not_active Expired - Fee Related
- 1999-06-15 BR BR9911173-0A patent/BR9911173A/pt not_active IP Right Cessation
- 1999-06-15 NZ NZ508383A patent/NZ508383A/xx unknown
- 1999-06-15 DE DE59906970T patent/DE59906970D1/de not_active Expired - Fee Related
- 1999-06-15 WO PCT/DE1999/001777 patent/WO1999065640A1/de not_active Ceased
- 1999-06-15 ID IDW20002606A patent/ID27425A/id unknown
- 1999-06-15 EP EP99939356A patent/EP1094915B1/de not_active Expired - Lifetime
- 1999-06-15 IL IL14005399A patent/IL140053A0/xx active IP Right Grant
- 1999-06-15 US US09/719,281 patent/US6416863B1/en not_active Expired - Lifetime
- 1999-06-15 CA CA002335002A patent/CA2335002C/en not_active Expired - Fee Related
- 1999-06-15 DK DK99939356T patent/DK1094915T3/da active
- 1999-06-15 JP JP2000554502A patent/JP3783031B2/ja not_active Expired - Fee Related
-
2000
- 2000-12-03 IL IL140053A patent/IL140053A/en not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0556864A1 (en) * | 1992-02-21 | 1993-08-25 | London Chemical Company, Inc. | Solder powder coated with parylene |
| DE4402042A1 (de) * | 1994-01-25 | 1994-06-09 | Kunststoff Maschinen Handelsge | Mikropartikulierte Reflow-Lötmittel und Verfahren zu deren Herstellung |
Non-Patent Citations (1)
| Title |
|---|
| DE-B.: Ullmanns Encyclopädie der technischen Chemie 4.Aufl., Bd.16, Verlag Chemie GmbH, Wein- heim 1978, S.675-682 "Mikrokapseln" * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7780875B2 (en) | 2005-01-13 | 2010-08-24 | Cinvention Ag | Composite materials containing carbon nanoparticles |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2335002C (en) | 2004-12-07 |
| CN1106905C (zh) | 2003-04-30 |
| ID27425A (id) | 2001-04-05 |
| WO1999065640A1 (de) | 1999-12-23 |
| ATE249308T1 (de) | 2003-09-15 |
| NZ508383A (en) | 2003-03-28 |
| IL140053A0 (en) | 2002-02-10 |
| EP1094915A1 (de) | 2001-05-02 |
| US6416863B1 (en) | 2002-07-09 |
| IL140053A (en) | 2006-04-10 |
| CN1305403A (zh) | 2001-07-25 |
| KR100549612B1 (ko) | 2006-02-03 |
| KR20010071362A (ko) | 2001-07-28 |
| EP1094915B1 (de) | 2003-09-10 |
| CA2335002A1 (en) | 1999-12-23 |
| JP2002518182A (ja) | 2002-06-25 |
| DE59906970D1 (de) | 2003-10-16 |
| BR9911173A (pt) | 2001-03-20 |
| DK1094915T3 (da) | 2004-01-05 |
| JP3783031B2 (ja) | 2006-06-07 |
| DE19826756A1 (de) | 2000-01-13 |
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